Technical Library | 2023-11-20 17:42:33.0
Zero-defect strategies and increased demands on the production of assemblies are making quality assurance in electronics production increasingly important. Continous miniaturization of components, ever higher packing densities and the associated hard-to-view assembly areas, as well as the increased use of components such as BGAs, QFNs and QFPs, pose a considerable challenge when it comes to high-precision quality control.
Technical Library | 2019-02-27 15:23:47.0
A study was performed to investigate, evaluate and qualify new reworkable underfill materials to be used primarily with ball grid arrays (BGAs), Leadless SMT devices, QFNs, connectors and passive devices to improve reliability. The supplier of the sole source, currently used underfill, has indicated they may discontinue its manufacture in the near future. The current underfill material is used on numerous circuit card assemblies (CCAs) at several sites and across multiple programs/business areas. In addition, it is used by several of our contract CCA suppliers.The study objectives include evaluation of material properties for down select, dispensability and rework evaluation for further down select, accelerated life testing for final selection and qualification; and process development to implement into production and at our CCA suppliers. The paper will describe the approach used, material property test results and general findings relative to process characteristics and rework ability.
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