1 problem passing j-std-003 solderability result

Aiming for High First-pass Yields in a Lead-free Environment

Technical Library | 2010-03-04 18:11:53.0

While the electronics manufacturing industry has been occupied with the challenge of RoHS compliance and with it, Pb-free soldering, established trends of increasing functionality and miniaturization have continued. The increasing use of ultra-fine pitch and area-array devices presents challenges in both printing and flux technology. With the decrease in both the size and the pitch of said components, new problems may arise, such as head-in-pillow and graping defects

Indium Corporation