Technical Library | 2019-08-19 23:55:20.0
Electronic dry cabinet for MSD storage Humidity is one of the key reasons for rejected products, many manufacturers are taking measures to control the humidity to increase production efficiency and save cost. In semiconductor and electronic industry, the key section of rejected products mostly happen during SMT heating process, Climatest Symor® auto dry cabinet is a superior solution to avoid the cracking. Warranty: two years with lifetime technical support
Technical Library | 2021-12-17 01:30:28.0
Diffusion silicon pressure transmitter is applied in a wide variety of industries, such as petroleum, chemical industry, steel, power, light industry and environmental protection industry. It can complete the work of measurement and control of the gauge pressure, negative pressure or absolute pressure of various fluid pressure. Most importantly, this type of transmitter can be used in corrosive medium and harsh or dangerous environment. In the process of using the transmitter, there may be some faults or problems.
Technical Library | 2019-04-11 05:59:57.0
Are your MSD safely stored? As humidity is found to be one of the key reasons for rejected products, many manufacturers are taking measures to control the humidity to increase their production efficiency and save the cost. In the industries of semi-conductor and electronics, the key section in which the rejected products are most probably to be made is that during the heating process of SMT, the IC(e.g.,PBGA,BGA,or TQFD) is likely to crack and thus cause non-effective welding because of the humidity. Climatest Symor® auto dry cabinet is the best solution to avoid the cracking and non#2;effective welding by dehumidifying the surface of your components. The dry unit can be used for 20 years without replacement,and controller is calibration free within 5 years.We attach dry cabinet application with different humidity range,welcome to download.
Technical Library | 2018-08-16 12:18:23.0
Appliance designers are constantly evolving to satisfy the ever changing wants and needs of their consumer base. These changes filter down and include not only the materials but also the equipment used to dispense the material in the manufacturing processes. Moreover, the latest evolution of appliances also seeks to add luxury controls and eye-catching applications. This challenge then, of new applications and material dispensing, often means the application and execution of these increasingly complex materials present multiple challenges up and down the appliance supply chain. Successfully meeting the material dispensing challenge has the potential to spur growth significantly in the higher-end appliance industry as the manufacturing adhesion processes evolve to meet market demand.
Technical Library | 2008-11-20 00:46:10.0
The Sn/Ag/Cu family of alloys is the leading candidate for a lead-free alternative. The first part of this study was to determine if there is any significant difference between Sn/Ag/Cu alloys when used in automatic soldering equipment in terms of copper build-up in the system. The study compared two Sn/Ag/Cu alloys to determine if at processing temperatures one alloy would absorb less copper than the other alloy.
Technical Library | 2019-07-23 22:33:47.0
The Quad Flat Pack No Leads (QFN) style of leadless packaging [also known as a Land Grid Array (LGA)] is rapidly increasing in us e for wireless, automotive, telecom and many other areas becaus e of its low cost, low stand-off height and excellent thermal and electri cal properties. With the implementation of any new package type, there is always a learning curve for its use in design and processing as well as for the Process and Quality Engineers who have to get to grips with the challenges that these packages bring. Therefore, this paper will provide examples of the common process defects that can be seen with QFNs /LGAs when using optical and x-ray inspection as part of manufacturing quality control. Results of trials conducted on four PCB finishes and using vapour phase and convection reflow will be discussed.
Technical Library | 2016-09-12 10:16:04.0
It is hard to open an Industry newsletter or visit an equipment manufacturer’s website without coming across a mention of the Internet of Things (IoT), Industry 4.0, SMART Manufacturing or ‘big data’. The accessibility to obtain data will only increase and this information and its real-time processing will become one of the most important resources for companies in the future. Production machinery will no longer simply processes the product, but the product will communicate with the machinery to tell it exactly what to do. Industry 4.0 has the vision to connects embedded system technologies and SMART production processes to drastically transform industry and production giving way to the SMART factory development. Future development in oven technology will allow machines to be controlled more intelligently and remotely resulting in the lowest cost model for manufacturing flow.
Technical Library | 2017-05-17 22:33:43.0
The selective soldering application requires a combination of performance attributes that traditional liquid fluxes designed for wave soldering applications cannot fulfill. First, the flux deposition on the board needs to be carefully controlled. Proper fine tuning of the flux physicochemical characteristics combined with a process optimization are mandatory to strike the right balance between solderability and reliability. However, localization of the flux residue through the drop jet process is not enough to guarantee the expected performance level. The flux needs to be designed to minimize the impact of unavoidable spreading and splashing events.From this perspective a fundamental understanding of the relationships between formulation and reliability is critical. In this application, thermal history of the flux residues (from room temperature to solder liquidus) is a key performance driver. Finally, it is necessary to conduct statistically designed experiments on industrial selective soldering machines in order to map the relationships between flux characteristics and selective process friendliness.
Technical Library | 2015-12-23 16:57:27.0
The onset of copper barrel cracks is typically induced by the presence of manufacturing defects. In the absence of discernible manufacturing defects, the causes of copper barrel cracks in printed circuit board (PCB) plated through holes is not well understood. Accordingly, there is a need to determine what affects the onset of barrel cracks and then control those causes to mitigate their initiation.The objective of this research is to conduct a design of experiment (DOE) to determine if there is a relationship between PCB fabrication processes and the prevalence of fine barrel cracks. The test vehicle used will be a 16-layer epoxy-based PCB that has two different sized plated through holes as well as buried vias.
Technical Library | 2019-01-02 21:51:49.0
Failed solder joints remain a constant source of printed circuit board failure. Soldering is the bonding of metallic surfaces via an intermetallic compound (IMC). The interaction between thermal energy delivery, flux chemistry, and solder chemistry creates the solder bond or joint. Today, reliability relies on visual inspection; operator experience and skill, control of influencers e.g. tip geometry, tip temperature, and collection and analysis of process data. Each factor involved with the formation of the solder joint is an element of risk and can affect either throughput or repeatability. Mitigating this risk in hand soldering requires the identification of these factors and a means to address them.
