Technical Library: process improvement (Page 3 of 10)

The Importance of On‐Site Training for PCB Assembly

Technical Library | 2017-08-28 17:17:04.0

If there is one way to guarantee world-class results in the electronics industry, it's by ensuring factory floor technicians enjoy consistent, regular training. Regular training ensures that assembly line technicians use standardized methods, generating efficiencies and improving the assembly process.

Power Design Services

Selective Reflow Rework Process

Technical Library | 2016-08-18 15:38:09.0

The Selective Reflow Rework Process is an approach to improving the high volume rework process, increasing process capabilities and process repeatability by using a standard reflow oven of 12 zones, pick and place machinery, semi-automated printing gear and Solder Paste Inspection (SPI) implementations. This approach was able to reduce the amount of rework equipment by more than half. Our human resource requirements (indirect and direct labor) were cut by more than 50% and our rolled throughput yield increased from 68.9% to 84.14%. The Selective Reflow Rework Process is less reliant upon operators and has become a repeatable, stable rework process.

Flex (Flextronics International)

Manufacturing Operations System Design and Analysis

Technical Library | 1999-05-06 14:48:20.0

This paper describes manufacturing operations design and analysis at Intel. The complexities and forces of both the market and the manufacturing process combine to make the development of improved semiconductor fabrication manufacturing strategies (like lot dispatching, micro and macro scheduling policies, labor utilization, layout, etc.) particularly important...

Intel Corporation

CHANGING THE RULES OF STENCIL DESIGN

Technical Library | 2023-05-22 16:42:56.0

Nano-coatings are applied to solder paste stencils with the intent of improving the solder paste printing process. Do they really make a noticeable improvement? The effect of Nano-coatings on solder paste print performance was investigated. Transfer efficiencies were studied across aperture sizes ranging from 0.30 to 0.80 area ratio. Also investigated were the effects of Nano-coatings on transfer efficiencies of tin-lead, lead-free, water soluble, no-clean, and type 3, 4, and 5 solder pastes. Solder paste print performance for each Nano-coating was summarized with respect to all of these variables.

FCT ASSEMBLY, INC.

Solar Panel Design Decision and General Information Sheet

Technical Library | 2014-04-10 18:04:04.0

This paper is meant to be a guide and a reference to new and old members alike who wish to know about, understand, and improve on the decisions made and processes implemented to build the current solar panels. The following paragraphs in the introduction will lay out background information on solar panels and cube satellites. This entire document was written with the idea that the reader will be able to follow the decisions made to construct the solar panels and then with this knowledge find areas of the project for improvement.

iSAT Group

Real-Time Yield Monitoring Through ERP Systems

Technical Library | 2007-04-25 21:54:26.0

Globalization and increased competition requires an enterprise to focus on cost reduction, improved manufacturing processes and higher standards of quality. Effective yield management using Enterprise Resource Planning (ERP) systems is crucial for the success of any manufacturing organization. An ERP system provides the infrastructure for consolidating all business operations by integrating the information flow across functions, including production planning and control.

i3 Electronics

Model for Improvement of Fluxing Process on Selective Soldering Machines

Technical Library | 2017-05-25 17:07:39.0

Purpose of this research is to identify the factors that directly influence the effectiveness of the fluxing process in selective soldering machines, using the design of experiment methodology with associated factors and levels used in the experiment. Final findings gives directions for set up of the optimal fluxing parameters that will enable appropriate flux appliance and to gain reduction of soldering quality issues which foundations are from this process.

Visteon Electronics

An Investigation Into The Durability Of Stencil Coating Technologies

Technical Library | 2019-03-13 15:19:55.0

It is well documented that Nano coatings on SMT stencils offer many benefits to those assembling PWBs. With reduced standard deviation and improved transfer efficiency nano coatings can provide, there is also a cost. As PWB assemblers work to justify the return on investment, one key question continues to arise. What is the durability or life of these coatings and what can be done in the print process to maximize the life of the coatings?This paper addresses durability of the coatings in relation to the number of print cycles and underside wipe cycles applied as well as materials used on the underside wipe process. Different parameters will be applied and data will be collected. The results of this study will be summarized to help those using or considering the use of these nano coatings to improve their print process and suggestions will be given to maximize the life of the coatings.

FCT ASSEMBLY, INC.

AOI-AXI Duo Improves Product Yield

Technical Library | 2009-08-26 19:32:32.0

Automated optical inspection (AOI) and automated X-ray inspection (AXI) have been around for some time in various configurations and both have played a role in improving the quality of circuit boards. While some companies opt for one technology over the other, each form of inspection contributes its own unique benefit to the manufacturing process.

Nordson YESTECH

Improve SMT Assembly Yields Using Root Cause Analysis in Stencil Design

Technical Library | 2018-07-18 16:28:26.0

Reduction of first pass defects in the SMT assembly process minimizes cost, assembly time and improves reliability. These three areas, cost, delivery and reliability determine manufacturing yields and are key in maintaining a successful and profitable assembly process. It is commonly accepted that the solder paste printing process causes the highest percentage of yield challenges in the SMT assembly process. As form factor continues to get smaller, the challenge to obtain 100% yield becomes more difficult.This paper will identify defects affecting SMT yields in the printing process and discuss their Root Cause. Outer layer copper weight and surface treatment will also be addressed as to their effect on printability. Experiments using leadless and emerging components will be studied and root cause analysis will be presented

FCT ASSEMBLY, INC.


process improvement searches for Companies, Equipment, Machines, Suppliers & Information

High Throughput Reflow Oven

Software for SMT placement & AOI - Free Download.
Blackfox IPC Training & Certification

Training online, at your facility, or at one of our worldwide training centers"
SMTAI 2024 - SMTA International

High Resolution Fast Speed Industrial Cameras.
PCB Handling with CE

Nozzles, Feeders, Spare Parts - Siemens, Fuji, Juki, Yamaha, etc...
Electronic Solutions R3

Thermal Transfer Materials.