Technical Library | 2019-12-13 00:39:29.0
Salt spray corrosion chamber can test the ability of material and its protective layer to resist salt mist corrosion, or compare the process quality of similar protective layers, at the same time; this equipment is suitable for parts, electronic components, protective layer of metal material and other industrial products. Salt spray test is divided into neutral and acid test. What is the difference between neutral and acid in salt spray test? First, the temperature applied in the test method is different: Neutral test: a. Laboratory:35°C ±1°C, b. Saturated air drums:47°C ±1°C Acid test: a. Laboratory:50°C ±1°C, b. Saturated air drums:63°C ±1°C Second, the production material is different,neutral test chamber adoptes the traditional PVC plates, acid test chamber asopts PP sheet,which is more high temperature resistance and suits strong acid test. Third. Different test methods satisfied Neutral salt spray chamber according to GB/T 2423.17-2008, GB/T 2423.18-2000, salt spray test method and GB/T 10125-1997, GB/T 10587-2006, GB10593.2-1990, GB/T 1765-1979, GB/T 1771-2007, GB/T 12967.388, GB/T 1705.8-2008, etc. In addition to the test methods specified in the national standard, acid salt spray chamber also needs to expand the standard setting such as IEC,MIL,DIN,ASTM,IS,CNS. Last, Comparison of neutral test solutions China: NaCI distilled water solution NaCI mass concentration (50 ±5) g ≤ l pH value 6.5 ≤ 7.2 United States: distilled water solution NaCI mass concentration 5% ±1% pH value 6.5 ≤ 7.2 Germany: NaCI distilled water solution NaCI mass concentration (50 ±5) g ≤ l pH value 6.5 ≤ 7.2 Japan: NaCI distilled water solution NaCI mass concentration 5% ±1% pH pH value 6.5 ~ 7.2 France: NaCI distilled water solution NaCI mass concentration 5% pH 6.5 ≤ 7.2 https://climatechambers.com/articles&latestnews/difference-between-neutral-and-acid-salt-spray-corrosion-test.html
Technical Library | 2019-04-11 05:59:57.0
Are your MSD safely stored? As humidity is found to be one of the key reasons for rejected products, many manufacturers are taking measures to control the humidity to increase their production efficiency and save the cost. In the industries of semi-conductor and electronics, the key section in which the rejected products are most probably to be made is that during the heating process of SMT, the IC(e.g.,PBGA,BGA,or TQFD) is likely to crack and thus cause non-effective welding because of the humidity. Climatest Symor® auto dry cabinet is the best solution to avoid the cracking and non#2;effective welding by dehumidifying the surface of your components. The dry unit can be used for 20 years without replacement,and controller is calibration free within 5 years.We attach dry cabinet application with different humidity range,welcome to download.
Technical Library | 1999-05-06 11:42:16.0
The most reliable and well-designed electronic device can malfunction or fail if it overheats. Considering thermal issues early in the design process results in a thermally conscious system layout and minimizes costs through the use of passive cooling and off-the-shelf components. When thermal issues are left until completion of the design, the only remaining solution may be a costly custom heat sink that requires all the space available. Incorporating a heat sink or a fan into a product after it is fully developed can be expensive, and still may not provide sufficient cooling of the device.
Technical Library | 2007-09-13 16:58:52.0
With the use of laser light for reflow having been established, all that remains is to apply it to best effect. Each time a laser is fired, it pumps a specific amount of energy at a particular wavelength to a particular point in space. Where technique comes in is choosing where and for how long to apply that light along with the application of accessory equipment to optimize solder paste reflow. This presentation covers the specifics of how to determine which process choices are the right process choices based on the needs of your product to maximize yield and throughput.
Technical Library | 2017-11-10 00:58:37.0
Modern electronics manufacturing is made up by a multiplicity of different separation and joining processes, with the later surely taking the vast majority of production technology. Alongside gluing, welding and laser processes, soldering still holds a primary position in electronic assemblies. However, soldering does not always equal soldering, because there are quite a lot of different soldering technologies. Accordingly, you have to distinguish between automated and manual soldering procedures. No matter which soldering process you analyse, all of them have one aspect in common: they produce airborne pollutants, which may have a negative impact on employees, plants and products as well.
Technical Library | 2021-12-03 01:22:50.0
CNC machines is the abbreviation of "Computer Numerical Control" machines. It is an automatic machine tool with program control system. The control system can logically process the programs with control codes or other symbolic instructions, decode them and express them with coded numbers. Next, the coded numbers will be input into the numerical control device through the information carrier. After calculation and processing, the numerical control device sends out various control signals to control the action of the machine tool. CNC machine can automatically produce parts or other products according to the shape and size specified by the drawings.
Technical Library | 2023-11-06 17:08:44.0
A new process has been developed for RF shielding on compact electronic communications devices using automated solder paste dispensing. The process is known as Shield Edge Interconnect (SEI). SEI designs enable parts to be processed though underfill before placing of the RF shield and allows more complete use of valuable PCB real estate to achieve reduced form factor requirements and/or for added components on products such as smartphones and tablets. The reduced form factor creates challenges for the assembly of those devices. This process, enabled by Speedline dispensing technology, relies on extremely accurate dispensing of solder paste on copper traces located along the outer edge of the PCB. The result is a robust process solution for SEI in which proprietary closed loop dispenser, pump, vision, and software technologies enable a high volume manufacturing (HVM) process.
Technical Library | 2014-06-02 11:03:45.0
With the advancement of the electronic industry, package on package (POP) has become increasingly popular IC package for electronic devices, particularly POP TMV (Through Mold Vials) in mobile devices due to its benefits of miniaturization, design flexibility and cost efficiency. However, there are some issues that have been reported such as SIR drop due to small gap between top and bottom components, difficulty underfilling and rework due to stacked IC components and process yield issues. Some suppliers have reported using some methods such as dipping epoxy paste or epoxy flux to address these issues, but so far no customer has reported using these methods or materials in their mass production. In order to address these issues for POP TMV assembly, YINCAE has successfully developed and commercialized the first individual solder joint encapsulant adhesive for mass production for years.
Technical Library | 1999-05-06 11:18:25.0
The trend toward surface-mount assembly processes is making ball-grid array (BGA) packaging a popular choice for many types of devices, forcing designers to re-examine cooling of these large packages. While devices in BGAs transfer more heat to the board than leaded devices, the style of BGA packages has a large influence on the ability to transfer heat through other pathways, such as a top-mounted heat sink. Physical characteristics of the BGA further constrain the thermal designer. It takes forethought in board design to successfully accommodate devices that require significant heat dissipation. Multiple solutions exist, however, for BGA packages of all types.
Technical Library | 2017-09-25 10:36:52.0
Laser wire stripping was developed by NASA in the 1970s as part of the Space Shuttle program. The technology made it possible to use smaller sized wires with thinner insulations, without risk of the damage that can be caused by traditional mechanical wire stripping methods. Laser wire stripping technology was commercialized in the 1990s and was initially used for aerospace and defense applications. Laser wire stripping then grew significantly when the consumer electronics market exploded as lasers became the only stripping solution for the tiny data cables found in laptops, mobile phones and other consumer electronics products. Another large industry that has adopted laser wire stripping methods, and for good reason, is high-end medical device manufacturing.
