Technical Library: project (Page 1 of 7)

Masking and Underfill Dispensing for Medical Device

Technical Library | 2023-08-16 18:42:25.0

In one of our medical applications projects, the customer wanted to dispense a mask to protect gold leads and an underfill on a silicon substrate with a clear test die. The substrates were Dymax X-499-91-C for Masking and Epoxibond-106M-1 for Underfill Dispensing

GPD Global

Thermal Interface Material (TIM) Dispensing For Consumer Products

Technical Library | 2023-08-16 18:25:16.0

In one of our Consumer Electronics projects, a leader of networking technologies requested to test dispensing performance of a thermally conductive material, Fujipoly Sarcon SPG-50A. This material improves heat dissipation for higher frequency applications and reduces the negative effects of thermal resistance under heat, cold, humid, and thermal shock conditions. The customer's goal was to dispense a 1mm diameter dot with acceptable speed and consistency.

GPD Global

LED Encapsulation for Consumer Products

Technical Library | 2023-08-16 18:13:53.0

In one of our Consumer Electronics projects, a smart lighting company wished to dispense silicone-based LED encapsulation material for two different product sizes. The larger product had a 9mm circular dam which required silicone dispensing flush with the top of the dam. The smaller product had a 1mm LED die that required only the top to be encapsulated. The material consisted of two parts which were mixed by weight in a 1:1 ratio. A phosphor powder was added totaling 10% of the overall weight. The phosphor required agitation to remain suspended.

GPD Global

StencilQuick™ Lead-Free Solder Paste Rework Study

Technical Library | 2007-01-31 15:17:04.0

The goal of this project is to evaluate the reliability of lead-free BGA solder joints with a variety of different pad sizes using several different BGA rework methods. These methods included BGAs reworked with both flux only and solder paste attachment techniques and with or without the use of the BEST stay in place StencilQuick™. The daisy chained test boards were placed into a thermal test chamber and cycled between -25ºC to 125ºC over a 30 minute cycle with a 30 minute dwell on each end of the cycle. Each BGA on the board was wired and the continuity assessed during the 1000 cycles the test samples were in the chamber.

BEST Inc.

Calculating Laser Manufacturing Costs.

Technical Library | 2024-09-25 14:42:07.0

Reviews the factors involved in determining the cost of laser cut projects.

A-Laser, Inc.

Accurately Capturing System-Level Failure of Solder Joints

Technical Library | 2020-02-05 18:20:06.0

Consortium Projects - Thermal Cycling Reliability Consortium projects allow for joint research to investigate the reliability of multiple solder alloys under a variety of environmental stress conditions. Project jointly sponsored by iNEMI and HDP User Group and including CALCE and Universal consortium currently assessing 15 third-generation solder alloys..

DfR Solutions (acquired by ANSYS Inc)

Backplane Architecture High-Level Design

Technical Library | 2011-03-16 20:09:11.0

The backplane is the key component in any system architecture. The sooner one considers the backplane’s physical architecture near the beginning of a project, the more successful the project will be. This white paper introduces the concept of a backplane

Lamsim Enterprises Inc.

Engineering Services

Technical Library | 2024-05-23 18:15:22.0

Information on how A-Laser can help support your next laser manufacturing project.

A-Laser, Inc.

CNC Laser Cut Parts

Technical Library | 2024-07-09 20:41:41.0

A review of what are CNC laser cut parts. How does A-laser provide support for these types of projects?

A-Laser, Inc.

Choosing the Right Depanel Method

Technical Library | 2024-10-22 17:28:30.0

Reviews the different methods used to depanel and what would work best for your project.

A-Laser, Inc.

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