Technical Library | 2019-05-31 14:15:01.0
ACI Technologies (ACI) is working on a project where one of the challenges is removing a large quantity of heat from audio amplifier circuits. This challenge is further complicated in that the heat generating circuits are located in a rack mounted box that needs to be shielded from electro-magnetic interference (EMI). Mechanically, this means that there cannot be open passages into the rack mounted box. We will first review the basic types of cooling available as commercial off-the-shelf (COTS) systems for the electronics industry, then discuss the pros and cons of each for different applications, and finally reveal the criteria and solution for the ACI project.
Technical Library | 2020-07-01 19:45:04.0
A company approached ACI Technologies (ACI) for assistance with a new product that was about to undergo its initial proof-of-concept prototype build. This product was an item that was being furnished to the Department of Defense for a program designed to increase the technical capabilities of computer equipment issued to the war fighter. The requirements for this item specified the use of tin-lead solder during assembly of production units. One of the main responsibilities for ACI during this project was to assist the client in mitigating the risk introduced using commercial off-the-shelf materials that may be lead-free.
Technical Library | 2019-05-23 10:27:13.0
The technical tips have offered valuable details and techniques into various aspects of electronics manufacturing. This has been validated by the reader responses concurring with our assessments, offering additional insight, or in some rare cases, stating divergent points of view on any particular matter. In a bit of a strategic departure from the normal range of electronic manufacturing topics, ACI Technologies,Inc. would like our readers to consider the importance of being well prepared in the arena of designed experiments in order to properly qualify a manufacturing process. This particular topic has relevance because of the associated scope of work ACI Technologies encounters in numerous projects from material R&D to manufacturing process optimization, which require appropriate experimental designs to ascertain the significant data.
Technical Library | 2007-01-31 15:17:04.0
The goal of this project is to evaluate the reliability of lead-free BGA solder joints with a variety of different pad sizes using several different BGA rework methods. These methods included BGAs reworked with both flux only and solder paste attachment techniques and with or without the use of the BEST stay in place StencilQuick™. The daisy chained test boards were placed into a thermal test chamber and cycled between -25ºC to 125ºC over a 30 minute cycle with a 30 minute dwell on each end of the cycle. Each BGA on the board was wired and the continuity assessed during the 1000 cycles the test samples were in the chamber.
Technical Library | 2020-02-05 18:20:06.0
Consortium Projects - Thermal Cycling Reliability Consortium projects allow for joint research to investigate the reliability of multiple solder alloys under a variety of environmental stress conditions. Project jointly sponsored by iNEMI and HDP User Group and including CALCE and Universal consortium currently assessing 15 third-generation solder alloys..
Technical Library | 2011-03-16 20:09:11.0
The backplane is the key component in any system architecture. The sooner one considers the backplane’s physical architecture near the beginning of a project, the more successful the project will be. This white paper introduces the concept of a backplane
Technical Library | 2024-05-23 18:15:22.0
Information on how A-Laser can help support your next laser manufacturing project.
Technical Library | 2010-04-22 09:11:54.0
Current situation: Present Rejection = 18%. Sigma Level = 2.42 Scope of Project: Vendor PCB Assembly to Functional Testing of PCBA
Technical Library | 2017-05-31 18:19:44.0
These guidelines give the assembly team a standardized, no-nonsense method to produce a reliable panelization solution. By eliminating panelization guesswork, you ensure successful assembly even for complex projects.
Technical Library | 2007-03-13 14:28:27.0
This article tells what your electronic manufacturing service providers needs from you to prepare an accurate quotation for a typical printed circuit board assembly project.
