Technical Library | 2019-11-20 22:44:25.0
Salt spray test chamber is used to test teh salt corrosion resistance ability of hardware, metal and other auto parts,the chamber can quickly detect the corrosion resistance degree of products in the temperature, humidity and salt spraying environment, which can effectively improve production efficiency. So what is the reason why such a salt spray test chamber does not spray? As per our past maintenance experience,there are below reasons,customers can have a look,hope it is helpful: 1, the spray tower is blocked; 2, water pipes clogged, water flow can not go in; 3, the air compressor stops running,pls open the air compressor button; 4, main switch of the air compressor outlet is not turned on,pls turn on. 5, the solenoid valve fails, the pressure meter is broken or the pressure is too low, pls check with Climatest and repair it. 6, when the nozzle is clogged, the nozzle should be carefully removed and cleaned,because it is fragile. 7, if the spray pressure is normal, the position of the nozzle glass is also correct, but what is the reason for not spraying? In this case, it is necessary to carefully observe whether there is dirt at the contact surface of the nozzle. If so, clean up the dirt and the spray can be carried out normally. That‘s all we‘re going to talk about today. If you have any questions, follow us on facebook, Please feel free to ask us questions.
Technical Library | 2019-11-07 03:07:12.0
Many customers who have purchased the nitrogen cabinets have been in the mistaken belief that the air pipe can be pull down hard,so that it can cause the board to be damaged due to the hard pulling of the air pipe, which leads to the replacement of the penetrating board. Now, the following pictures are provided. Please note: Nitrogen cabinet is a optiomal choice for the microelectronics,semiconductor for humidity proof and anti-oxidation purpose,Climatest has put much efforts on the R&D of dry cabinets,as you know,our advangtage is to handle temperature and humidity,since early 1990s,our engineers began to test and research dry cabinet and nitrogen cabinet,all of our manufacturing process strictly follow ISO9001 standard,we supply to international customers for 20 years,if you are still looking for a reliable dry cabinet manufacturer to protect your MSD from moisture related damage,come to visit www.climatechambers.com,we are ready!
Technical Library | 2015-08-13 15:52:40.0
Pad cratering has become more prevalent with the switch to lead free solders and lead free compatible laminates. This mainly is due to the use of higher reflow temperature, stiffer Pb-free solder alloys, and the more brittle Pb-free compatible laminates. However, pad cratering is difficult to detect by monitoring electric resistance since pad cratering initiates before an electrical failure occurs. Several methods have been developed to evaluate laminate materials' resistance to pad cratering. Pad-solder level tests include ball shear, ball pull and pin pull. The detailed methods for ball shear, ball pull, and pin pull testing are documented in an industry standard IPC-9708. Bansal, et al. proposed to use acoustic emission (AE) sensors to detect pad cratering during four-point bend test. Currently there is an industry-working group working on test guidelines for acoustic emission measurement during mechanical testing.
Technical Library | 2019-05-08 21:52:28.0
Cold ball pull testing is used to validate the resistance of PCB pad cratering for the different ultra-low loss dielectrics materials (Dk=3~4.2 and Df
Technical Library | 2015-02-19 16:54:34.0
Pad cratering is an important failure mode besides crack of solder joint as it’ll pass the regular test but have impact on the long term reliability of the product. A new pin pull test method with solder ball attached and positioning the test board at an angle of 30º is employed to study the strength of pad cratering. This new method clearly reveals the failure mechanism. And a proper way to interpret the finite element analysis (FEA) result is discussed. Impact of pad dimension, width and angle of copper trace on the strength is included. Some findings not included in previous research could help to guide the design for better performance
Technical Library | 2023-08-04 15:27:30.0
A designed experiment evaluated the influence of several variables on appearance and strength of Pb-free solder joints. Components, with leads finished with nickel-palladium-gold (NiPdAu), were used from Texas Instruments (TI) and two other integrated circuit suppliers. Pb-free solder paste used was tin-silver-copper (SnAgCu) alloy. Variables were printed wiring board (PWB) pad size/stencil aperture (the pad finish was consistent; electrolysis Ni/immersion Au), reflow atmosphere, reflow temperature, Pd thickness in the NiPdAu finish, and thermal aging. Height of solder wetting to component lead sides was measured for both ceramic plate and PWB soldering. A third response was solder joint strength; a "lead pull" test determined the maximum force needed to pull the component lead from the PWB. This paper presents a statistical analysis of the designed experiment. Reflow atmosphere and pad size/stencil aperture have the greatest contribution to the height of lead side wetting. Reflow temperature, palladium thickness, and preconditioning had very little impact on side-wetting height. For lead pull, variance in the data was relatively small and the factors tested had little impact.
Technical Library | 2019-05-06 23:04:05.0
The temperature and humidity test chamber simulate the temperature and humidity, so there are a lot of things customers shoud notice in the process of use, although there is detailed instruction when purchasing the equipment. But some users just know how the device works and start using it. This is very easy to cause problems in the use of the equipment, so Symor intends to describe the safety details during the use of temperature and humidity chamber. 1. Before the test, determine if the sample contains flammable and explosive substances to avoid combustion or explosion during the test. Of course, also make sure there is no flammable and explosive material around the test equipment, otherwise it may cause fire and other accidents. 2, Do not open the chamber door to operate during the experiment, or the gas in the studio may cause the operator to burn and so on. 3. At the end of the test or at the time of regular cleaning of the test chamber, power off the equipment to avoid electrocution accidents. Also, when cutting off the equipment power, pull the power cord to pull out the plug, otherwise it may lead to a rupture of the power cord and so on. You can contact manufacturers if there are some places you donnot understand, do not dismantle and repair the temperature and humidity test chamber without authorization, otherwise it may lead to more serious problems.
Technical Library | 2021-12-29 19:37:20.0
The purpose of this study was to compare the strength of the bond between resin and glass cloth for various composites (laminates) and its dependence on utilized soldering pad surface finishes. Moreover, the impact of surface finish application on the thermomechanical properties of the composites was evaluated. Three different laminates with various thermal endurances were included in the study. Soldering pads were covered with OSP and HASL surface finishes. The strength of the cohesion of the resin upper layer was examined utilizing a newly established method designed for pulling tests.
Technical Library | 2019-01-23 21:33:32.0
Automated Optical Inspection (AOI) is advantageous in that it enables defects to be detected early in the manufacturing process, reducing the Cost of Repair as the AOI systems identify the specific components that are failing removing the need for any additional test troubleshooting1-3. Because of this, more Electronic Contract Manufacturing Services (EMS) companies are implementing AOI into their SMT lines to minimize repair costs and maintain good process and product quality, especially for new component types. This project focuses on the testing of component package 03015 which is challenging for AOI.
Technical Library | 2013-04-04 15:28:39.0
This paper will outline and define what requirements must be adhered to for the OEM community to truly achieve the IPC class product from the Electrical Test standpoint. This will include the test point optimization matrix, Isolation (shorts) parameters and Continuity (opens) parameters. This paper will also address the IPC Class III/A additional requirements for Aerospace and Military Avionics. The disconnect exists between OEMs understanding the requirements of their specific IPC class design versus the signature that will be presented from their design. This results in many Class III builds failing at Electrical Test... First published in the 2012 IPC APEX EXPO technical conference proceedings
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