Technical Library: qfp or the (Page 1 of 1)

Manufacturers at the Crossroads: ERP or Best-of-Breed Software?

Technical Library | 2007-05-17 16:44:37.0

In the quest for quality, selecting the right Statistical Process Control (SPC) Software system doesn't boil down to a simple functional "fit-to-requirements" anymore. Once the expert domain of highly focused, independent software developers, the competitive landscape has changed dramatically with the influx of big-name ERP software providers who are aggressively promoting integrated quality modules within an all-encompassing business application framework.

Zontec, Inc.

Water Soluble Solder Paste, Wet Behind the Ears or Wave of the Future

Technical Library | 2017-03-22 20:58:08.0

Water soluble lead-free solder paste is widely used in today’s SMT processes, but the industry is slowly moving away from water soluble solder pastes in favor of no-clean solder pastes. This shift in usage of solder paste is driven by an effort to eliminate the water wash process. Some components cannot tolerate water wash and elimination of water washing streamlines the SMT process. Despite this shift, certain applications lend themselves to the use of water soluble solder paste.This paper details the research and development of a new water soluble lead-free solder paste which improves on the performance characteristics of existing technologies.

FCT ASSEMBLY, INC.

To dispense material under vacuum or dispense degassed material in atmosphere ….that is the question

Technical Library | 2018-08-23 07:47:57.0

Simply put, the proper system design and use of vacuum in the potting process can make the difference between a mediocre part and a perfect part. Air entrapment is inevitable whether you utilize syringes, cartridges, pails, or drums of material in the process.

Scheugenpflug Inc.

Head-On-Pillow Defect – A Pain in the Neck or Head-On-Pillow BGA Solder Defect

Technical Library | 2023-09-05 21:00:53.0

The head on pillow defect is becoming more common. This paper describes one such occurrence for an OEM and explains how it was dealt with. In this particular case it was solved by application of problem solving skills by the OEM, component supplier and the solder paste provider

Research In Motion

Re-Shoring or Near-Shoring Concepts Should be Strongly Considered when the OEM’s Goal is To Deliver Optimum Balance between Landed Cost and Time to Market

Technical Library | 2016-09-29 17:23:51.0

The old tactic of outsourcing to a low cost geography simply to deliver lowest cost direct and indirect labor was never a panacea supply chain solution. In fact, when evaluating solutions for lower volume and higher mix products typically found in the medical, industrial and public safety segments of the OEM market, IL & DL costs are only one subset of the total cost to land the product and service the ultimate customer. In this paper, there will be examination of what actual cost components should be included in a landed cost analysis, the soft costs that an OEM should consider to deliver outstanding performance in quality, logistics and delivery management of the supply chain solution. A detailed comparison using a 'case study' will be presented to demonstrate a total landed cost option versus one that is focused on IL/DL cost.

Kimball Electronics, Inc.

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