Technical Library | 2019-05-21 17:31:39.0
In the field of electronics manufacturing, the end use of the product will always dictate the processes, procedures, and methods, not only for building the product, but also for testing, cleaning, and protecting the assembly in order to assure the level of quality required for proper operation. The need to protect an electronic assembly from its end use environment may stem from anyone of a number of hazardous (or potentially hazardous) conditions. Choosing the type of protective material is dependent upon matching that material’s characteristics with the conditions to be overcome. Naturally, the use of a protective (conformal) coating will require some method of verification to ensure the desired level and type of protection is achieved.
Technical Library | 2020-04-01 14:24:56.0
It happens much too often; manufacturing engineers are brought into a NEW product design phase at the very end of a design and are asked to provide input that should have been provided much earlier. One needs to understand how the circuit board design and quality of the manufacturing process not only effects assembly yield and product reliability, but how it could also affect the results of any testing that is done to circuit packs during prototyping. It is important that any circuit pack (including prototypes) that will be used in reliability, performance and functional testing be designed with the proper features and assembled with a manufacturing process that has been developed to produce a high-quality assembly. If not, the results of any testing might not represent the actual characteristics of the design and provide miss-guidance to future changes.
Technical Library | 2023-12-18 11:33:57.0
Elevate your electronic manufacturing game with the I.C.T-D600 SMT Dispensing Machine! Precision, safety, and efficiency in one powerful solution. In the dynamic realm of electronic manufacturing, precision and efficiency are not just preferences but essential requirements. Introducing the I.C.T-D600, an automatic glue dispenser machine engineered to enhance production processes across various applications. From chip encapsulation to PCB assembly, SMT red-glue dispensing, LED lens production, and medical device creation, SMT dispensing machine is a versatile solution tailored to meet the demands of the industry. Essential Attributes Of The I.C.T-D600 Automatic Glue Dispenser Machine 1. Compliance with European Safety Standards: The I.C.T-D600 SMT dispensing machine prioritizes not only efficiency but also safety, boasting compliance with European safety standards and holding a CE certificate. This ensures a secure and reliable manufacturing environment, aligning with global quality benchmarks. 2. International Component Quality: Internationally renowned components form the core of the D600 SMT dispensing machine. From Panasonic servomotors to MINTRON CCD, each element is carefully selected, guaranteeing high performance and durability. This commitment to quality components results in a machine that operates seamlessly, reducing downtime and maintenance costs. 3. Impressive Performance Metrics: The SMT dispensing machinedoesn't just meet expectations; it surpasses them with exceptional performance metrics: Maximum Guide Rail Speed: 400mm/s Fastest Injection Valve Speed: 20 spots/sec Dispensing Accuracy: ±0.02mm Repeated Accuracy: ±0.01mm Machine Characteristics: Core Part – Jet Valve The non-contact jet dispensing method ensures high-speed operation (max jet speed: 20 spots/second), high accuracy with a minimum dispensing volume of 5nl, and flexibility with extremely small dispensing volumes. The thermostatic system for the flow channel and sprayer ensures uniform glue temperature, resulting in low maintenance costs and an extended service life. Enhanced Capacity: Non-contact jet dispensing eliminates the need for Z-axis motion. Integrated temperature control technology reduces manual intervention. Automatic glue compensation minimizes artificial regulation time. Dual-track design reduces waiting time. Automatic visual location identification and compensation. Non-contact height detection with laser reduces height detection time. Flexibility: Capable of handling substrates or backings of various sizes. Optional heating module. Independent control of dual tracks with user-friendly software. Fast switching between different product lines. Universal platform suitable for various processes with different glues
Technical Library | 2023-12-27 12:27:29.0
Background Of SMT Auto IC Programming Machines In the dynamic landscape of electronics manufacturing, SMT Auto IC Programming Machines, also known as IC Programmers, have become indispensable tools. These machines play a crucial role in the semiconductor industry, addressing the escalating demand for efficient programming tools as electronic devices become more intricate. Specifically designed to load firmware or programs onto integrated circuits (ICs), these machines ensure the functionality of ICs and facilitate their seamless integration into various electronic applications. Significance Of SMT Auto IC Programming Machines The significance of SMT Auto IC Programming Machines lies in their ability to streamline the manufacturing process of electronic devices. ICs, ranging from microcontrollers to memory chips, serve as the central processing units in electronic systems. IC Programming Machines enable the customization of these ICs, allowing manufacturers to program specific functionalities, update firmware, and adapt to diverse applications. Furthermore, these machines contribute significantly to the rapid development of new products. In a market where time-to-market is critical, IC Programming Machines provide the flexibility to quickly program different ICs, reducing production lead times and enhancing overall efficiency. Operational Principles Of IC Programming Machines Hardware Architecture SMT Auto IC Programming Machines consist of a sophisticated hardware architecture comprising a controller, socket, pin detection system, and additional peripherals. The controller acts as the brain, orchestrating the programming process, while the socket provides a connection interface for the IC. Programming Algorithms At the core of IC Programming Machines are various programming algorithms encompassing essential operations such as erasure, writing, and verification. The choice of algorithms depends on the specific requirements of the IC and the desired functionality. Communication Protocols Effective communication between the IC Programming Machine and the target IC is facilitated by standardized communication protocols such as JTAG, SPI, and I2C. The selection of a particular protocol is influenced by factors such as data transfer speed, complexity, and compatibility with the IC. Advanced Features And Characteristics Equipped with advanced features like parallel programming, support for multiple ICs, and online programming, IC Programming Machines elevate their capabilities, enhancing production efficiency and flexibility. Practical Applications IC Programming Machines find practical applications across various industries, from automotive electronics to consumer electronics. Case studies illustrate how these machines contribute to improved production workflows and product quality by ensuring programmed ICs meet specific application requirements. Future Trends Looking ahead, the future of SMT Auto IC Programming Machines holds exciting prospects. Anticipated trends include advancements in programming speed, support for emerging communication protocols, and increased integration with smart manufacturing systems. These developments aim to address the evolving demands of the electronics industry. I.C.T-910 Programming Machine Invest in the I.C.T-910 for an efficient and reliable IC programming experience. The I.C.T-910 complies with European safety standards, holding a CE certificate that attests to its quality and adherence to safety regulations. Our skilled engineers at I.C.T are committed to ensuring your success by providing professional training and assistance with equipment installation. I.C.T: Your Comprehensive SMT Equipment Provider I.C.T stands as a comprehensive SMT equipment provider, offering end-to-end solutions for your SMT production line needs. Tailoring services to your specific requirements and product specifications, we conduct a thorough analysis to determine the precise SMT equipment that suits your needs. Our commitment is to deliver the highest quality and cost-effective solutions, ensuring optimal performance and efficiency for your production processes. Partner with I.C.T for a customized approach to SMT equipment that aligns perfectly with your manufacturing goals. Contact us for an inquiry today.
Technical Library | 2009-03-05 15:46:54.0
In a recent survey of 89 organizations conducted by Whataboutquality.com, respondents were asked what few key characteristics defined quality, in the eyes of their customer, the most popular response was: the product or service met my requirements. The next two most popular responses were: it worked like I expected and it was a good value, worth what I paid for it (...) So how do you continue to exceed customer expectations and simultaneously reduce costs? There are two paths to take. You can find and reduce the variation in your process and you can eliminate as much of the non-value-added waste in your operation.
Technical Library | 2014-12-24 19:22:52.0
For centuries, the squeegee blade has been used throughout many applications for depositing viscous materials through screens and stencils to transfer images on to substrates, from cloth material to electronic circuit boards. One area of blade printing mechanics that have been reviewed many times is the angle of attack of the blade. Typically it has been tested from 45 degrees to 60 degrees to optimize the printing quality and efficiency. However, this typically ends up as a compromise, from fill characteristics (45 degrees) to print definition (60 degrees). This paper will present the revolutionary performance of the profiled squeegee blade, which has recently been developed to create a virtual multi angle of attack for unsurpassed process control for all types of stencil printing processes.
Technical Library | 2015-07-14 13:19:10.0
Bottom terminated components (BTC) are leadless components where terminations are protectively plated on the underside of the package. They are all slightly different and have different names, such as QFN (quad flat no lead), DFN (dual flat no lead), LGA (land grid array) and MLF (micro lead-frame. BTC assembly has increased rapidly in recent years. This type of package is attractive due to its low cost and good performance like improved signal speeds and enhanced thermal performance. However, bottom terminated components do not have any leads to absorb the stress and strain on the solder joints. It relies on the correct amount of solder deposited during the assembly process for having a good solder joint quality and reliable reliability. Voiding is typically seen on the BTC solder joint, especially on the thermal pad of the component. Voiding creates a major concern on BTC component’s solder joint reliability. There is no current industry standard on the voiding criteria for bottom terminated component. The impact of voiding on solder joint reliability and the impact of voiding on the heat transfer characteristics at BTC component are not well understood. This paper will present some data to address these concerns.
Technical Library | 2019-09-19 00:28:48.0
The symbiotic relationship between solder masks and selective finishes is not new. The soldermask application is one of the key considerations to ensure a successful application of a selective finish. The selective finish is the final chemical step of the PCB manufacturing process, this is when the panels are at their most valuable and are unfortunately not re-workable. Imperfections are not tolerated, even if they are wholly cosmetic. Quality issues often manifest themselves in the form of a 'ping pong' conversation between the fabricators, the soldermask suppliers and the selective finish suppliers. Without tangible evidence these discussions are difficult to resolve and the selective finish process is usually regarded as responsible. This paper will focus on the chemical characteristics and use them to predict or identify potential issues before they occur rather than specifically name 'critical' soldermasks. It is also the intention of this paper to address the potential of a soldermask to react to common yield hiking practices like UV bumping and oven curing. It is hoped that this awareness will help fabricators to ensure maximum yields by asking the right questions. 'Critical’ soldermasks impact all selective finishes. In this paper, practical experience using immersion tin will be used to highlight the relationship between 'critical' soldermasks and some of the issues seen in the field. The paper will include a novel approach to identify re-deposited volatiles after the reflow.
Technical Library | 2019-05-23 21:56:56.0
Automatic on-line shoe sole spraying system: automatic shoe sole spraying system, simple and convenient operation, using 3D vision positioning system. Automatic recognition and automatic generation of spraying trajectory. Robot non-contact spraying gun is used to complete the process of shoe sole spraying with maturity, stability, high speed and high precision along the predetermined trajectory. The automatic generation of spraying trajectory is the realization of shoe sole spraying technology. Shoe sole spraying characteristics: 1.Positioning System: 3D Visual Positioning 2.Components: Intelligent Robot, Laser Scanner, Industrial Computer, Gum Spraying System, Conveyor Belt, Electrical Control System, etc. 3.Spraying time: slightly different according to shoe size and spraying time Fully automatic sole spraying advantages: 1. Simple application: suitable for soles of different specifications, models and sizes 2. Faster speed: 6-8 seconds to complete sole scanning and spraying, superior to similar products at home and abroad. 3. Quality stability: gum spraying trajectory is scheduled, gum dosage is fixed, gum spraying quality is greatly improved. 4. High cost performance: the same performance, the price is only 1/3 of the same type of equipment of European brand. 5. Reduce wear and tear: glue is fully utilized and not wasted, reducing human contact with glue. Intelligent operation advantage manual only need general operation can be automated workshop, mechanical arm automatic spraying glue, accurate spraying, reduce glue waste. Environmental protection effect of long-term close contact with glue seriously affects human health and mechanical work, glue does not directly contact, do not harm the human body. Fully automatic spraying, shoe sole adhesion process for automatic spraying machine, will not cause great challenges! With the deepening of personalized shoemaking, higher requirements have been put forward for the spraying technology in shoemaking process. The method of creating spraying trajectory must be adapted to shoes of different sizes and styles. The automatic generation of spraying trajectory is one of the key technologies to realize the automation of shoe sole spraying process. The method of off-line programming and real-time generation of spraying trajectory for robots based on the three-dimensional CAD model of sole and the data of sole. A new method of generating spray trajectory by scanning the sole of shoe upper with linear structured light sensor is presented. The feasibility of the method is verified by industrial robots. Aiming at the need of generating shoe sole spray rubber trajectory based on line structured light, the format standard of IGES file of three-dimensional model of shoe sole was tested. The shoe sole contour line and the shoe sole surface were extracted, and then the offset curve of the shoe sole contour line on the shoe sole surface was calculated to obtain the spray rubber trajectory. Three-dimensional profilometer is to use structured light to obtain sole information, effectively improve the automatic shoemaking spraying process, which will help to improve the efficiency of shoemaking, improve the quality of footwear products, and promote the development of personalized shoemaking.
| 1 |
