Technical Library | 2016-07-29 10:28:22.0
The RFQ process has been treated as a tedious and necessary evil by most EMS companies. However, a mature quoting process can improve your company's ability to win new business, keep existing customers and improve margins.
Technical Library | 2024-02-05 17:51:01.0
Objective: Drying = reducing the humidity in PCB before soldering Preventing delamination caused by thermal stress after moisture absorption Methods: Drying in convection and/ or vacuum oven Parameters subject to material type, soldering surface, layer count, time to soldering, layout (copper-plated areas)
Technical Library | 2017-01-23 21:12:01.0
"Water is not a problem of the future, but a key issue of our time for businesses: In the future, urgent water risks will increase in many areas of the world. A growing population, a changing consumer behavior and climate change will have an immediate impact on the availability and quality of water and thus build further pressure on governments, businesses and societies." (Quote from the summary of the 2014 WWF study "The imported risk. Germany's water risk in the age of globalization.")
Technical Library | 2021-09-01 15:31:39.0
The long-standing trend in the electronics industry has been the miniaturization of electronic components. It is projected that this trend will continue as Original Equipment Manufacturers (OEMs) and Electronic Manufacturing Service (EMS) providers strive to reduce "real estate" on printed circuit boards. Typically, the miniaturization of components can be achieved by integration or size reduction. At present, size reduction is considered to be more cost effective and flexible than integration. Passive components, which are used in limiting current, terminating transmission lines and de-coupling switching noise, are the primary focus in size reduction due to their variety of uses.
Technical Library | 2022-02-09 17:52:47.0
This article presents the first time that an millimeter-wave (mm-wave) multichip module (MCM) with on-demand "smart" encapsulation has been fabricated utilizing additive manufacturing technologies. RF and dc interconnects were fabricated using inkjet printing, while the encapsulation was realized using 3-D printing. Inkjet-printed interconnects feature superior RF performance, better mechanical reliability, and on-demand, low-cost fabrication process.
Technical Library | 2022-10-04 16:43:10.0
In this paper I will discuss the different methods and equipment used to detect counterfeit electronic parts, specifically integrated circuits as well as demonstrate some of the "red flags" that help to identify a part as being suspected counterfeit. We will begin with the initial receipt of the parts and the examination of the outer packaging, the basic visual inspection of the parts, the visual inspection and documentation at high magnification, permanency marking, blacktop test, scrape test, XRF (RoHS), decapsulation, X-ray, basic electrical testing, C-SAM, full function testing and limited function testing.
Technical Library | 2019-10-18 10:37:25.0
It usually does not make any logic to invest in costly fabrication equipment in case you just desire to spin some prototypes and rather outsource your Printed Circuit Board assembly as well as prototype fabrication to a trustworthy vendor. I would provide a few tips as to what to consider when seeking a contract manufacturer. The two most common procedures associated with Printed Circuit Board Assembly are through-hole technology and surface mount technology. Talking about the difference between through-hole technology and surface mount technology. Through-hole elements have metal leads, & these metal leads are supplied through-plated holes inside the circuit board. On the other hand, SMT elements might or might not have leads, nevertheless most significantly, they are developed to be soldered onto the surface of the circuit boards straight on the same side as the element body. A lot of contract manufacturers would provide a quick quote mechanism over their site for the fabrication of circuit boards as well as assembly of prototypes. This would bank your time when comparing various vendors. Ensure that the quote system facilitates you to fill your details, for instance, board material, thickness, copper thickness, milling, etc. in order that you can avail of a precise quote devoid of any surprises afterward. And this is quite necessary. Typically the cost per board would decline as quality upgrades. This is owing to the fairly high setup price of circuit board fabrication over and above component assembly. A few vendors would employ a system where they unite boards from various consumers. This manner the setup price would be circulated among numerous clients. When you fabricate an item, you clearly don’t desire to have to fabricate a big quantity of boards straight away whilst you improve your design. One restriction with small quantity prototypes though is that the option of materials & material thicknesses would be constrained. In case you are employing a particular material then opportunities are there will not be any other clients employing the same material. Additionally, lead time plays a major role in indecisive prices. A longer lead time facilitates the fabricator more liberty in slotting your fabrication. This is basically reflected in cheaper prices that would view in the quote section. Clearly, if you are in a hurry and desire to be moved to the summit of the pile you would require splurging more dollars. Ensure that your contract fabricator would support the file sort for producing which you offer. The most general format for printed circuit board fabrication is the Gerber format nonetheless a few vendors would moreover embrace board files from general printed circuit board software products. A few suppliers also provide in house printed circuit design. Even in case, you create your board yourself, choosing a vendor with design services might prove resourceful in case there is an issue with your files. In this scenario, your vendor could make swift changes that would neglect pricey delays. If you are looking for an Electronic Manufacturing Services (EMS Assembly) provider, then the web is the best to search.
Technical Library | 2021-09-21 20:20:22.0
The electronics industry has been using the epoxy puck for the processing of the vast majority of electronics microsections since the 1970s. Minimal advancements have been seen in the methods used for precision micro-sections of PCBs, PCBAs, and device packages. This paper will discuss different techniques and approaches in performing precision and analytical micro-sections, which fuse the techniques and materials common in preparation of silicon wafers and bulk materials. These techniques have not only been found to produce excellent optical results, but transfer effectively to SEM for high magnification inspection and further analysis with minimal post-lapping preparation needed. Additionally, processing time is reduced primarily due to a significant reduction of bulk material removal earlier in the preparation, therefore needing less removal at later lapping steps compared to traditional sectioning methods. Additional techniques are introduced that mitigate some classic challenges experienced by technicians over the decades.
Technical Library | 2019-12-16 22:20:55.0
When we were children,our parents always warn us "Do comparison shopping before you buy",why they say like this?this is a very simple truth, for the first deal,we are always cautious, through continuous comparison in order to find out the best quality, service, after-sale and price. This apply to any industry,there are many manufacturers of environmental test equipment. When some customers inquire a temeprature humidity test chamber, they will find a very common problem. Why is the price of the same equipment quoted by the two manufacturers very different? 1, the chamber body process,which effects the exterior case quality,this price has a gap. 2, the components, esp.components of the refrigeration system, is the core value of the temperature humidity test chamber. 3, even if the body and refrigeration components are the same, some prices are different, that is the manufacturer technical level. 4, regional issues, Wuxi,Changzhou, Dongguan, these brands need to know more. 5. after-sales, a powerful manufacturer often with a sound after-sales service dept.. The above are both technical and service, as well as the delivery cost of goods to the local and overseas are different.
Technical Library | 2020-09-23 21:29:25.0
The electronics industry could benefit greatly from using a reliable, manufacturable, reduced temperature, SMT solder material (alloy-composition) which is cost competitive with traditional Sn3Ag0.5Cu (SAC305) solder. The many possible advantages and some disadvantages / challenges are discussed. Until recently, the use of Sn/Bi based materials has been investigated with negative consequences for high strain rate (drop-shock) applications and thus, these alloys have been avoided. Recent advances in alloy "doping" have opened the door to revisit Sn/Bi alloys as a possible alternative to SAC-305 for many applications. We tested the manufacturability and reliability of three low-temperature and one SAC-305 (used as a control) solder paste materials. Two of these materials are doped Sn/Bi/Ag and one is just Sn/Bi/Ag1%. We will discuss the tests and related results. And lastly, we will discuss the prospects, applications and possible implications (based on this evaluation) of these materials together with future actions.
