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Made in Japan: Solder Paste Jet Dispensing Machine

Technical Library | 2024-03-19 07:58:40.0

Introduction of Solder Paste Jet Dispensing Machine Step into the future of manufacturing with the Solder Paste Jet Dispensing Machine, meticulously crafted in Japan under the esteemed I.C.T brand. This cutting-edge equipment represents the pinnacle of precision engineering, delivering unrivaled performance and reliability. Let's dive into its exceptional features and applications. Transmission Structure System of Solder Paste Jet Dispensing Machine At the heart of this Solder Paste Jet Dispensing Machine lies a meticulously designed transmission structure system. Powered by X Y linear motor drive control, it achieves unprecedented precision in positioning. With a reciprocating position accuracy of 3σ±5um and a dynamic position accuracy of 3σ±3um across the X, Y, and Z axes, it ensures flawless execution of tasks with minimal deviation. The load-type gantry structure further enhances stability and accuracy, guaranteeing consistent performance even during high-speed operations. Advanced Function Configuration Flexibility and customization are the hallmarks of the Solder Paste Jet Dispensing Machine. It features a customizable platform tailored to meet the specific needs of diverse applications, ensuring optimal performance and efficiency. Additionally, the machine boasts advanced functionalities such as automatic correction of substrate warp height and real-time penetration monitoring. Equipped with dual cameras, it provides precise feedback for adjustments during the filling process, ensuring unmatched precision and quality. Function configuration.jpg Vision Non-stop Experience uninterrupted precision with the Vision Non-stop functionality of this machine. Capable of detecting 100 chips per second, it automatically identifies position and height deviations, enabling real-time compensation for coating actions. Dual compensation for path and glue amount further optimizes efficiency, minimizing waste and maximizing productivity. With its ability to print solder paste dots as small as 110um, it's perfectly suited for high-precision applications in ICs, BGAs, and beyond. Versatility in Configuration Options and Applications Adaptability is key in modern manufacturing, and the Solder Paste Jet Dispensing Machine delivers on all fronts. Offering a range of configuration options, including different valves tailored to various material viscosities and fluidity, it ensures optimal performance across diverse production scenarios. From semiconductor packages to LED back-end Mini-LED production, its versatility knows no bounds, making it an indispensable asset in a wide range of industries. Explore the Future of Manufacturing with I.C.T Join the ranks of industry leaders embracing the future of manufacturing with I.C.T's Solder Paste Jet Dispensing Machine. With its unrivaled precision, speed, and reliability, it's set to revolutionize your production processes and propel your business to new heights of success. Don't just keep up with the competition--surpass it with I.C.T's cutting-edge solutions. Unlock the Potential of Precision Manufacturing Delve deeper into the transformative power of precision manufacturing and discover how the Solder Paste Jet Dispensing Machine can unlock new possibilities for your business. From reducing production costs to improving product quality, the benefits are endless. Partner with I.C.T today and embark on a journey towards manufacturing excellence. Conclusion In conclusion, our Solder Paste Jet Dispensing Machine embodies the fusion of Japanese precision and I.C.T reliability, offering unparalleled efficiency in solder paste dispensing. With its advanced features and customizable options, it caters to the diverse needs of modern manufacturing processes. Experience the pinnacle of dispensing technology with our Solder Paste Jet Dispensing Machine. Overseas Technical Support by I.C.T At I.C.T, our commitment to customer satisfaction extends beyond the initial purchase. We provide comprehensive overseas technical support, including machine installation, debugging, and customer training. Our dedicated team ensures that your production line runs smoothly from the first product off the line to the seamless delivery of the machine. Partner with I.C.T today and elevate your manufacturing precision with our Solder Paste Jet Dispensing Machine. Contact us now to learn more about our solutions and take your production processes to new heights of efficiency and reliability.

I.C.T ( Dongguan ICT Technology Co., Ltd. )

Advanced modelling technique achieves near to zero set up time and minimal tuning

Technical Library | 2015-04-29 03:29:56.0

Statistical Appearance Modelling technology enables an AOI system to “learn real world variation” based on operator interaction with inspection task results. This provides an accurate statistical description of normal variation in a product. With modelling technology, the user does not have to anticipate potential defects as the system will “flag” anything outside the “normal production range”. And, since the system is programmed with real production variation, it is sensitive to small subtle changes enabling reliable defect detection. Autonomous prediction of process variation enables an AOI system to be set up from a single PCB with production-ready performance. Setup time can be

CyberOptics Corporation

Yamaha Mounter Accessories 6604098 Class I Laser Product CyberOptics Unit Laser

Technical Library | 2022-10-31 09:01:25.0

Delivery Time: 1-2 Days Attributes: Original New Material: Metal Shipping Ways: DHL, FedEx, TNT, UPS, By Sea,DDP Dedicated Line Color: Black Certification: ISO

Shenzhen Zhongrun Hi-Tech Technology Co., Ltd.

FSM Cookbook

Technical Library | 2001-04-24 10:41:53.0

Tau models describe the timing and functional information of component interfaces. Timing information specifies the delay in placing values on output signals and the timing constraints (set-up/hold, pulse-width) on input signals of a component. Functional information, through a finite state machine (FSM), specifies when output signal values change, when input signal values are latched, and how output values are determined as a function of input values.

Mentor Graphics

Effect of Contact Time on Lead-Free Wave Soldering

Technical Library | 2008-08-28 22:50:11.0

The increasing use of lead-free solder has introduced a new set of process parameters when setting up wave solder equipment for effective soldering. Determining the proper flow characteristics of the solder wave for adequate hole fill is an essential step in achieving a reliable process. A variety of solder waves exist in the industry; each with advantages and disadvantages when performing lead-free wave soldering. One way to ensure adequate hole-fill is by increasing contact time at the Chip Wave.

Speedline Technologies, Inc.

X-RAY FURTHER INCREASES PRODUCT QUALITY AT MENTZER ELECTRONICS

Technical Library | 2023-11-20 17:59:32.0

Quality control at Mentzer Electronics in Burlingame, California, includes tracing electronics assembly issues using a Metris XT V real-time X-ray inspection system. This electronics X-ray inspection system allows quality engineers to intuitively navigate through the internal structure of assembled PCBs. In the rapidly evolving electronics industry, Mentzer Electronics uses the acquired insight to speed up and fi ne tune manufacturing processes. Real-time X-ray guarantees that no hidden defects remain in products when turning them out to customers nationwide.

Mentzer Electronics

Evaluating the Mechanical Reliability of Ball Grid Array (BGA) Flexible Surface-Mount Electronics Packaging under Isothermal Ageing

Technical Library | 2015-02-12 16:57:56.0

Electronic systems are known to be affected by the environmental and mechanical conditions, such as humidity, temperature, thermal shocks and vibration. These adverse environmental operating conditions, with time, could degrade the mechanical efficiency of the system and might lead to catastrophic failures.The aim of this study is to investigate the mechanical integrity of lead-free ball grid array (BGA) solder joints subjected to isothermal ageing at 150°C for up to 1000 hours. Upon ageing at 150°C the Sn-3.5Ag solder alloy initially age-softened for up to 200 hours. This behaviour was linked to the coarsening of grains. When aged beyond 200 hours the shear strength was found to increase up to 400 hours. This age-hardening was correlated with precipitation of hard Ag3Sn particles in Sn matrix. Further ageing resulted in gradual decrease in shear strength. This can be explained as the combined effect of precipitation coarsening and growth of intermetallic layer. The fractured surfaces of the broken solder balls were also investigated under a Scanning Electron Microscope. The shear failures were generally due to ductile fractures in bulk solders irrespective of the ageing time.

School of Engineering, University of Greenwich

SMT chip capacitor resistor storage and processing method

Technical Library | 2022-04-27 01:34:43.0

SMD capacitors and resistors have small sizes and many models. Some manufacturers buy a lot of products and do not use them up in time. The problem of storage is always a headache. So how should chip capacitors and resistors be stored? There are also precautions when using chip capacitors. Please see the following information and hope it will help you.

Leaderway Industrial Co.,Ltd

e-Supply Chain Management: Prerequisites To Success.

Technical Library | 2001-05-23 16:15:54.0

The supply chain is made up of all the activities that are required to deliver products to the customer - from designing product to receiving orders, procuring materials, marketing, manufacturing, logistics, customer service, receiving payment and so on. Anyone, anything, anywhere that influences a product’s time-to-market, price, quality, information exchange, delivery, among other activities is part of the supply chain.

R. Michael Donovan & Co., Inc.

Boundary Scan Skews Test Coverage Tradeoffs in your Favor

Technical Library | 2007-08-23 14:30:03.0

The complexity and programmability of modern embedded boards means that knowledge built up during debugging and testing must be regarded as Intellectual Property (IP) and therefore preserved. But many of the processes and tools used today do not provide a means to preserve or pass on this IP, and thereby forego valuable opportunities to save time and improve quality during subsequent stages of product development.

XJTAG

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