Technical Library | 2023-01-17 17:50:59.0
Heller's new Condenser Tube Flux Recovery System is designed to provide more efficient flux collection than earlier Heller flux collection systems; while providing minimal down time for inspection and cleaning. The entire system easily fits within the rear of the top shell of an 1800-EXL oven. The system utilizes a different set of top shell caps specially designed to provide the best serviceability of both the flux collection system and maintenance of the heater zone blower motors.
Technical Library | 2024-02-02 07:48:31.0
Maximizing Efficiency: The High-Speed SMT Line With Laser Depanelizer In today's rapidly evolving electronics manufacturing landscape, optimizing efficiency, cost-effectiveness, and precision remains paramount. Businesses engaged in producing industrial control boards, computer motherboards, mobile phone motherboards, and mining machine boards face ongoing challenges in streamlining production processes. The integration of expensive equipment strains budgets, making the creation of an efficient, cost-effective high-speed SMT line a daunting task. However, a solution exists that seamlessly combines these elements into a singular, high-performance, and cost-effective SMT line. Let's delve into the specifics. A Comprehensive High-Speed SMT Line Our innovative solution amalgamates two pivotal components: a cutting-edge SMT (Surface Mount Technology) production line and a laser cutting line equipped with a depanelizer. The SMT Production Line The high-speed SMT line comprises several essential components, each fulfilling a unique role in the manufacturing process: 1. PCB Loader: This initial stage involves loading boards onto the production line with utmost care. Our Board Loader prioritizes safety, incorporating various safety light curtains and sensors to promptly halt operations and issue alerts in case of any anomalies. 2. Laser Marking Machine: Every PCB receives a unique two-dimensional code or barcode, facilitating comprehensive traceability. Despite the high-temperature laser process potentially leading to dust accumulation on PCB surfaces, our dedicated PCB Surface Cleaner swiftly addresses this issue. 3. SMT Solder Paste Printer: This stage involves applying solder paste to the boards, a fundamental step in the manufacturing process. 4. SPI (Solder Paste Inspection): Meticulous inspections are conducted at this stage. Boards passing inspection proceed through the NG (No Good) Buffer Conveyor to the module mounters. Conversely, "No Good" results prompt storage of PCBs in the NG Buffer Conveyor, capable of accommodating up to 25 PCBs. Operators can retrieve these NG boards for rework after utilizing our specialized PCB Mis Cleaner to remove solder paste. 5. Module Mounters: These machines excel in attaching small and delicate components, necessitating precision and expertise in the module mounting process. 6. Standard Pick And Place Machines: The selection of these machines is contingent upon your specific BOM (Bill of Materials) list. 7. Pre-Reflow AOI (Automated Optical Inspection): Boards undergo examination for component quality at this stage. Detected issues prompt the Sorting Conveyor to segregate boards for rework. 8. Reflow Oven: Boards undergo reflow soldering, with our Lyra series reflow ovens recommended for their outstanding features, including nitrogen capability, flux recycling, and water cooling function, ensuring impeccable soldering results. 9. Post-Reflow AOI: This stage focuses on examining soldering quality. Detected defects prompt the Sorting Conveyor to segregate boards for further inspection or rework. Any identified defects are efficiently addressed with the BGA rework station, maintaining the highest quality standards. 10. Laser Depanelizer: Boards advance to the laser depanelizer, where precision laser cutting, often employing green light for optimal results, ensures smoke-free, highly accurate separation of boards. 11. PCB Placement Machine: Cut boards are subsequently managed by the PCB Placement Machine, arranging them as required. With this, all high-speed SMT line processes are concluded. Efficiency And Output This production line demonstrates exceptional productivity when manufacturing motherboards with approximately 3000 electronic components, boasting the potential to assemble up to 180 boards within a single hour. Such efficiency not only enhances output but also ensures cost-effectiveness and precision in your manufacturing processes. At I.C.T, we specialize in crafting customized SMT production line solutions tailored to your product and specific requirements. Our equipment complies with European safety standards and holds CE certificates. For inquiries or to explore our exemplary post-sales support, do not hesitate to contact us. The I.C.T team is here to elevate your electronics manufacturing to new heights of efficiency and cost-effectiveness.
Technical Library | 2008-05-14 15:44:58.0
This paper will review some basic past and present flux chemistries that affect flux collection methodology. It will also review some of the most common flux collection methods, self-cleaning techniques, and maintenance goals. And, finally, data will be presented from high volume production testing of an advanced flux management system.
Technical Library | 2009-03-19 20:23:54.0
Over the past several years, post-reflow defluxing of circuit assemblies has gained in popularity. Microminiaturization of components and boards, combined with higher expected reliability and increased product liability, have contributed to the prominence of defluxing. Lead-free solder paste - with its higher reflow temperatures and negative effects on flux - increase the likelihood of post-reflow defluxing to increase a product's reliability and aesthetic appearance.
Technical Library | 2019-08-14 22:20:55.0
Cleanliness is a product of design, including component density, standoff height and the cleaning equipment’s ability to deliver the cleaning agent to the source of residue. The presence of manufacturing process soil, such as flux residue, incompletely activated flux, incompletely cured solder masks, debris from handling and processing fixtures, and incomplete removal of cleaning fluids can hinder the functional lifetime of the product. Contaminates trapped under a component are more problematic to failure. Advanced test methods are needed to obtain "objective evidence" for removing flux residues under leadless components.Cleaning process performance is a function of cleaning capacity and defined cleanliness. Cleaning performance can be influenced by the PCB design, cleaning material, cleaning machine, reflow conditions and a wide range of process parameters.This research project is designed to study visual flux residues trapped under the bottom termination of leadless components. This paper will research a non-destructive visual method that can be used to study the cleanability of solder pastes, cleaning material effectiveness for the soil, cleaning machine effectiveness and process parameters needed to render a clean part.
Technical Library | 2019-07-02 23:02:05.0
The introduction of lead-free solders resulted in a selection of different chemistries for solder pastes. The higher melting points of lead-free alloys required thermal heat resistant rosin systems and activators that are active at elevated temperatures. As a result, more frequent maintenance of the filtration systems is required and machine downtime is increased.Last year a different method of cleaning reflow ovens was introduced. Instead of cooling down the process gasses to condensate the residues, a catalyst was used to maintain the clean oven. Catalytic thermal oxidation of residues in the nitrogen atmosphere resulted in cleaner heating zones. The residues were transformed into carbon dioxide. This remaining small amount of char was collected in the catalyst. In air ovens the catalyst was not seen as a beneficial option because the air extracted out of the oven was immediately exhausted into the environment. When a catalyst is used in an air environment there is not only the carbon dioxide residues, but also water. When a catalyst is used in an air reflow oven the question is where the water is going to. Will it condensate in the process part of the oven or is the gas temperature high enough to keep it out of the process area? A major benefit of using a catalyst to clean the air before it is exhausted into the environment is that the air pollution is reduced dramatically. This will make environmental engineers happy and result in less pollution of our nature. Apart from this, the exhaust tubes remain clean which reduces the maintenance of air ovens.This paper will give more detailed information of catalyst systems during development and performance in production lines.
Technical Library | 2018-11-20 21:33:57.0
There are several industry-accepted methods for determining the reliability of flux residues after assembly. The recommended methods of test sample preparation do not always closely mimic the thermal cycle experienced by an assembly. Therefore, extraction from actual assemblies has become a popular method of process control to assess consistency of post-reflow cleanliness. Every method of post-reflow flux residue characterization will depend on the reflow process followed to prepare the coupon.This investigation will focus on the effect of thermal conditions on the remainder of active ingredients in flux residues after assembly with no-clean solder pastes.
Technical Library | 2020-11-24 23:01:04.0
The miniaturization trend is driving industry to adopting low standoff components or components in cavity. The cost reduction pressure is pushing telecommunication industry to combine assembly of components and electromagnetic shield in one single reflow process. As a result, the flux outgassing/drying is getting very difficult for devices due to poor venting channel. This resulted in insufficiently dried/burnt-off flux residue. For a properly formulated flux, the remaining flux activity posed no issue in a dried flux residue for no-clean process. However, when venting channel is blocked, not only solvents remain, but also activators could not be burnt off. The presence of solvents allows mobility of active ingredients and the associated corrosion, thus poses a major threat to the reliability. In this work, a new halogen-free no-clean SnAgCu solder paste, 33-76-1, has been developed. This solder paste exhibited SIR value above the IPC spec 100 MΩ without any dendrite formation, even with a wet flux residue on the comb pattern. The wet flux residue was caused by covering the comb pattern with 10 mm × 10 mm glass slide during reflow and SIR testing in order to mimic the poorly vented low standoff components. The paste 33-76-1 also showed very good SMT assembly performance, including voiding of QFN and HIP resistance. The wetting ability of paste 33-76-1 was very good under nitrogen. For air reflow, 33-76-1 still matched paste C which is widely accepted by industry for air reflow process. The above good performance on both non-corrosivity with wet flux residue and robust SMT process can only be accomplished through a breakthrough in flux technology.
Technical Library | 2007-10-18 13:42:45.0
To successfully achieve lead-free electronics assembly, each participant in the manufacturing process, from purchasing to engineering to maintenance to Quality/Inspection, must have a solid understanding of the changes required of them. This pertains to considerations regarding design, components, PWBs, solder alloys, fluxe s, printing, reflow, wave soldering, rework, cleaning, equipment wear & tear and inspection.
Technical Library | 2020-11-04 17:57:41.0
Residues present on circuit boards can cause leakage currents if not controlled and monitored. How "Clean is Clean" is neither easy nor cheap to determine. Most OEMs use analytical methods to assess the risk of harmful residues. The levels that can be associated with clean or dirty are typically determined based on the exposed environment where the part will be deployed. What is acceptably clean for one segment of the industry may be unacceptable for more demanding segments. As circuit assemblies increase in density, understanding cleanliness data becomes more challenging. The risk of premature failure or improper function is typically site specific. The problem is that most do not know how to measure or define cleanliness nor can they recognize process problems related to residues. A new site specific method has been designed to run performance qualifications on boards built with specific soldering materials, reflow settings and cleaning methods. High impedance measurements are performed on break off coupons designed with components geometries used to build the assembly. The test method provides a gauge of potential contamination sources coming from the assembly process that can contribute to electrochemical migration.
