Technical Library: reflow oven for education (Page 1 of 1)

Efficient and Reliable Reflow Ovens for PCB Assembly

Technical Library | 2023-09-16 06:29:26.0

Explore our range of reflow ovens designed to streamline your PCB assembly process. Achieve consistent and high-quality soldering for your electronic components.

I.C.T ( Dongguan Intercontinental Technology Co., Ltd. )

Special Reflow Oven for 5G Modular and Radiator Assembly

Technical Library | 2023-09-16 06:31:54.0

Discover our specialized reflow oven tailored for efficient soldering in 5G modular and radiator assembly. Achieve precise and reliable connections for high-performance electronics.

I.C.T ( Dongguan Intercontinental Technology Co., Ltd. )

Thermal Profiling for Reflow

Technical Library | 2019-05-21 17:23:47.0

Reflow temperature profiling is the most important aspect of proper control of the solder reflow process. It may appear to some to be a magical art practiced by a select experienced few, who are able to divine the proper settings for a reflow oven by reading graphs as if they were tea leaves. This does not have to be true. This article outlines a systematic method by which engineers and technicians can implement a successful reflow process from scratch.

ACI Technologies, Inc.

SMT Line Improvements for High Mix, Low Volume Electronics Manufacturing

Technical Library | 2011-08-04 19:29:53.0

This work covers two major projects aimed at increasing quality and efficiency on a high mix, low volume surface mount electronics production line. Specifically the installation of a ten zone reflow oven and an enhanced changeover method for SMT pick and

Auburn University

Reliability Evaluation of One-Pass and Two-Pass Techniques of Assembly for Package on Packages under Torsion Loads

Technical Library | 2021-12-16 01:52:32.0

Package on Packages (PoP) find use in applications that require high performance with increased memory density. One of the greatest benefits of PoP technology is the elimination of the expensive and challenging task of routing high-speed memory lines from under the processor chip out to memory chip in separate packages. Instead, the memory sits on top of the processor and the connections are automatically made during assembly. For this reason PoP technology has gained wide acceptance in cell phones and other mobile applications. PoP technology can be assembled using one-pass and two-pass assembly processes. In the one-pass technique the processor is first mounted to the board, the memory is mounted to the processor and the finished board is then run through the reflow oven in a single pass. The two-pass technique has an intermediate step in which the memory is first mounted onto the processor.

CALCE Center for Advanced Life Cycle Engineering

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