Technical Library | 1999-05-06 10:30:06.0
Augmentation of extended surfaces used to dissipate heat increases the overall effectiveness of a heat sink and increases the heat removed per unit volume. This amount of increase depends on the number of augmentations, air flow velocity and ...
Technical Library | 2011-09-26 03:33:31.0
How to repair flash drive documents when missing due to malicious software installations? Company presents drive recovery software to restore digital files and compressed folders from accidently formatted usb removable media drives.
Technical Library | 2007-07-19 15:15:11.0
ROSA is a surface restoration technique that removes hard to reduce species like metal oxides or sulfides. At the time of its development, the focus was on solderability and compliance to environmental regulations. Industry trends and regulatory changes as a result of the Montreal Protocol were the driver for much of the concern over environmental compliance. The result was an increase in the development of no-clean and water soluble fluxes and the removal of halogenated cleaning chemistries.
Technical Library | 2011-09-01 18:11:31.0
Scavenging, Site Dressing, Residual Solder Removal. What's in a name? "That which we call an onion, by any other name would smell as strong" (apologies to the immortal bard). And, regardless of the name you give it, the objective is the same, namely the clean up of remaining solder after a component (particularly a BGA) or R.F. Shield has been removed from a PCB. This paper will describe the various methods that are available and discuss their pros and cons.
Technical Library | 2019-05-22 21:24:05.0
voidless treatment Smaller components -> miniaturization (01005 capability) Large board handling -> dynamic preheating for large board repair Repeatable processes -> flux and paste application (Dip and Print), residual solder removal (scavenging), dispensing, multiple component handling, and traceability Operator support -> higher automation, software guidance
Technical Library | 2007-12-06 11:37:15.0
Over the past 30 years we have learned that lead has negative affects on the health of humans and seen strong legislation remove it from gasoline and paints. More recently, governments in Europe and Asia have set deadlines to remove lead from consumer electronic devices that use printed circuit boards. Currently, the ban is not being applied to high reliability applications such as military or medical devices, but we all know that will come someday soon. Likewise many believe that lead free solder is coming to wafer bump reflow and are beginning to make the transition.
Technical Library | 2019-05-21 00:21:26.0
Continue to talk about the dust removal from temperature humidity test chamber. Cleaning and maintenance: 1) Pls remove internal impurities inisde chamber before operation. 2) The power distribution room should be cleaned at least once a year, and the dust can be removed by vacuum cleaner. 3) The exterior chamber must also be cleaned more than once a year, which can be wiped with soapy water. Inspection and maintenance of humidifier: The water storage in humidifier should be replaced once a month to ensure clean water quality, humidifying water tray should be cleaned once a month to ensure smooth flow of water. The inspection of over-temperature protector:during the test: If the temperature is over 20 ℃ ~ 30 ℃ than the maximum value setted,the power supply of the heater will stop, the "OVERHEAT" overt-emperature warning light will automatically turn on but the fan is still in operation, if the equipment runs without operator around,the operator should check the over-temperature protector in advance to ensure wether it has been setted properly before start [wet ball over-temperature protector set to 120 ℃].
Technical Library | 2021-09-21 20:20:22.0
The electronics industry has been using the epoxy puck for the processing of the vast majority of electronics microsections since the 1970s. Minimal advancements have been seen in the methods used for precision micro-sections of PCBs, PCBAs, and device packages. This paper will discuss different techniques and approaches in performing precision and analytical micro-sections, which fuse the techniques and materials common in preparation of silicon wafers and bulk materials. These techniques have not only been found to produce excellent optical results, but transfer effectively to SEM for high magnification inspection and further analysis with minimal post-lapping preparation needed. Additionally, processing time is reduced primarily due to a significant reduction of bulk material removal earlier in the preparation, therefore needing less removal at later lapping steps compared to traditional sectioning methods. Additional techniques are introduced that mitigate some classic challenges experienced by technicians over the decades.
Technical Library | 1999-05-07 11:28:39.0
There are many things that can go wrong when soldering to gold plate over nickel surfaces. First of all, we know that gold and solder are not good friends, as any time solder comes into contact with gold, something seems to go wrong. Either the solder bonds to the gold and eventually pulls off as the tin and gold cross-migrate, leaving voids; or the solder completely removes the gold and is expected to bond to the metal which was under the gold.
Technical Library | 2021-04-16 05:38:38.0
The overall process of manufacturing electronics assemblies is characterized by a number of very different procedures. Along the production chain, technologies for cutting, assembling, soldering, bonding, gluing, marking, potting, etc. are used, all of them have one thing in common: They produce airborne pollutants, some of which can have a significant impact on employees, manufacturing equipment and products - and for this reason need to be removed effectively and efficiently.
