Technical Library | 2023-12-06 03:28:49.0
Mastering Precision: I.C.T's SMT Conformal Coating Valves Introduction Of SMT Conformal Coating Valves: In various industries, including electronics, lighting, energy, and life sciences, the SMT conformal coating process plays a critical role. Precision is key, and the choice of a SMT coating valve significantly influences application quality. This article explores I.C.T's SMT conformal coating valves, focusing on the C-0101, C-L101, PJ-01, PJ-01 (with plastic bucket), C-0100, D-0100, D-0300, and the W Series. C-0101 Water Curtain Spray SMT Conformal Coating Valves: The C-0101, a non-atomizing water curtain spray valve, excels with low-viscosity solvent materials. It ensures clean and precise edges in applications like conformal coatings, UV adhesives, backfilling, and volatile substances. C-L101 Rotary Water Curtain Spray Valve: Similar to the C-0101, the C-L101 suits low-viscosity solvent materials, offering a precise edge without splashing for various coatings. PJ-01 Injection Valve (Without Plastic Bucket): Designed for high-precision applications in electronics, lighting, energy, and life sciences, the PJ-01 excels in accurate dispensing and coating. It accommodates various materials, including red glue, liquids, and pastes. PJ-01 Injection Valve (With Plastic Bucket 30CC): The PJ-01, with a 30cc plastic bucket, maintains high precision for complex circuit board applications, offering precise dispensing for materials like red glue, liquids, and pastes. C-0100 Non-Rotating Film Valve: Different from pneumatic atomizing valves, the C-0100 provides precise edge definition without air pressure involvement. It addresses issues related to atomizing drift and fast-drying adhesives, allowing control over the film width. D-0100 Precision Valve: The D-0100, with a unique fluid-sealing structure driven by compressed air, minimizes seal replacement frequency. Suitable for various fluid dispensing, it handles UV adhesives, encapsulating materials, silicones, epoxies, and surface coatings. D-0300 Dispensing Valve: Tailored for precision fluid dispensing at low driving pressure, the D-0300 accommodates a range of materials, including acrylics, silicones, epoxies, and UV adhesives. It's ideal for applications where accuracy and consistency are crucial. W Series: Needle Design Atomization Valves: The W Series offers needle design valves leaving zero residue. Easy to clean without disassembly, they provide adjustable fluid and air pressure for various coating materials, ensuring excellent atomization effects. Analyzing The Options: When selecting a conformal coating valve, consider specific application requirements. C-0101 and C-L101 suit low-viscosity solvent materials, providing clean and precise edges. PJ-01, with or without a plastic bucket, offers high-precision dispensing for complex applications. C-0100 and D-0100 are versatile for various materials, and D-0300 excels in precision dispensing. The W Series offers residue-free needle design atomization valves. Choose based on material, precision, and coating needs. Integration with I.C.T's Conformal Coating Machines: Integral to I.C.T's Conformal Coating machines, these valves enable precise application tailored to specific requirements. Machines like I.C.T-T550, I.C.T-T550U, I.C.T-T600, and I.C.T-T650 come equipped with a range of valve options catering to diverse production line needs. I.C.T SMT Coating Machine.png Conclusion: Selecting the right conformal coating valve is crucial for consistent, high-quality results. Evaluate options based on material, precision, and coating requirements. I.C.T provides tailored solutions for electronic assembly needs. For detailed insights into coating and dispensing machines, follow the provided link. Professional engineers are ready to assist in designing a production line that perfectly matches your requirements, ensuring optimal performance. Contact us for more information and tailored solutions to elevate your conformal coating processes.
Technical Library | 1999-05-07 10:47:00.0
White residue remaining after cleaning circuit board assemblies can be caused by a variety of chemicals and reactions. Rosin and water-soluble fluxes, circuit board resins and epoxies, component materials and other contamination all contribute to this complex chemistry. This paper discusses many of the sources of the residues that seem to be an ever-increasing occurrence.
Technical Library | 2009-07-09 17:23:07.0
Sometimes you just cannot clean with water. Good examples of this are: circuits with batteries attached, cleaning prior to encapsulation, ionic cleanliness testing, and non-sealed or other water sensitive parts. High impedance or high voltage circuits need to be cleaned of flux residues and other soils to maximize performance and reliability and, in these types of circuits; water can be just as detrimental as fluxes. When solvent cleaning is called for, Hansen solubility parameters can help target the best solvent or solvent blend to remove the residue of interest, and prevent degradation of the assembly being manufactured. In short, using this approach can time, manufacturing cost and reduce product liability.
Technical Library | 2017-03-22 20:58:08.0
Water soluble lead-free solder paste is widely used in today’s SMT processes, but the industry is slowly moving away from water soluble solder pastes in favor of no-clean solder pastes. This shift in usage of solder paste is driven by an effort to eliminate the water wash process. Some components cannot tolerate water wash and elimination of water washing streamlines the SMT process. Despite this shift, certain applications lend themselves to the use of water soluble solder paste.This paper details the research and development of a new water soluble lead-free solder paste which improves on the performance characteristics of existing technologies.
Technical Library | 2013-05-09 14:35:18.0
Atmospheric dust consists of solids suspended in air. Dust is well known for its complex nature. It normally includes inorganic mineral materials, water soluble salts, organic materials, and a small amount of water. The impact of dust on the reliability of printed circuit board assemblies (PCBAs) is ever-growing, driven by the miniaturization of technology and the increasing un-controlled operating conditions with more dust exposure in telecom and information industries... First published in the 2012 IPC APEX EXPO technical conference proceedings.
Technical Library | 2007-07-19 15:15:11.0
ROSA is a surface restoration technique that removes hard to reduce species like metal oxides or sulfides. At the time of its development, the focus was on solderability and compliance to environmental regulations. Industry trends and regulatory changes as a result of the Montreal Protocol were the driver for much of the concern over environmental compliance. The result was an increase in the development of no-clean and water soluble fluxes and the removal of halogenated cleaning chemistries.
Technical Library | 2013-07-11 15:22:40.0
This research paper will focus on the effect of various parameters that are used to reball a BGA and their effect on the overall shear strength. Factors that will be looked at include the type of BGA (SAC305 or 63Sn/37Pb), the alloy used to reball (SAC405 or 63Sn/37Pb), the type of flux used (Water Soluble or No Clean), and the environment in which reballing takes place (Nitrogen or Ambient).
Technical Library | 2022-01-05 23:14:20.0
The process of copper recovery from waste printed circuit board has generated large amounts of non-metallic fraction (NMF) residue. In this research, the residue was recycled as a substitute for fine aggregates at 0%, 5%, 10%, 15%, and 20% to produce interlocking concrete blocks. Properties of the interlocking concrete blocks produced in this study, such as density, water absorption, compressive strength, were firstly examined and the selected mixes were further evaluated for the heavy metal leachability.
Technical Library | 2023-05-22 16:42:56.0
Nano-coatings are applied to solder paste stencils with the intent of improving the solder paste printing process. Do they really make a noticeable improvement? The effect of Nano-coatings on solder paste print performance was investigated. Transfer efficiencies were studied across aperture sizes ranging from 0.30 to 0.80 area ratio. Also investigated were the effects of Nano-coatings on transfer efficiencies of tin-lead, lead-free, water soluble, no-clean, and type 3, 4, and 5 solder pastes. Solder paste print performance for each Nano-coating was summarized with respect to all of these variables.
Technical Library | 2018-10-03 20:41:44.0
Voids in solder joints plague many electronics manufacturers. Do you have voids in your life? We have good news for you, there are many excellent ways to "Fill the Void." This paper is a continuation of previous work on voiding in which the following variables were studied: water soluble lead-free solder pastes, a variety of stencil designs, and reflow profiles. Quad Flat No-Lead (QFN) component thermal pads were used as the test vehicle. The voiding results were summarized and recommendations were made for reduction of voiding.
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