Technical Library | 2024-09-02 17:31:09.0
The cracking and delamination of printed circuit boards (PCB) during exposure to elevated thermal exposure, such as reflow and rework, have always been a concern for the electronics industry. However, with the increasing spread of Pb-free assembly into industries with lower volume and higher complexity, the occurrence of these events is increasing in frequency. Several telecom and enterprise original equipment manufacturers (OEMs) have reported that the robustness of their PCBs is their number one concern during the transition from SnPb to Pb-free product. Cracking and delamination within PCBs can be cohesive or adhesive in nature and can occur within the weave, along the weave, or at the copper/epoxy interface (see Figure 1). The particular role of moisture absorption and other PCB material properties, such as out of plane expansion on this phenomenon is still being debated.
Technical Library | 2016-10-27 16:24:23.0
Press-fit technology is a proven and widely used and accepted interconnection method for joining electronics assemblies. Printed Circuit Board Assembly Systems and typical functional subassemblies are connected through press-fit connectors. The Press-Fit Compliant Pin is a proven interconnect termination to reliably provide electrical and mechanical connections from a Printed Circuit Board to an Electrical Connector. Electrical Connectors are then interconnected together providing board to board electrical and mechanical inter-connection. Press-Fit Compliant Pins are housed within Connectors and used on Backplanes, Mid-planes and Daughter Card Printed Circuit Board Assemblies. High reliability OEM (Original Equipment Manufacturer) computer designs continue to use press-fit connections to overcome challenges associated with soldering, rework, thermal cycles, installation and repair. This paper investigates the technical roadmap for press fit technology, putting special attention to main characteristics such, placement and insertion, inspection, repair, pin design trends, challenges and solutions. Critical process control parameters within an assembly manufacturing are highlighted.
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