Technical Library: rule (Page 1 of 3)

Plastic vs Metal Stencils for Prototype Printing

Technical Library | 2014-09-11 11:47:39.0

This article goes through the pluses and minuses of using plastic stencils for DIY prototypes. The release efficiency is measured and "rules of thumb" for using one type vs another is explained.

BEST Inc.

Advanced Electronic Connector Technologies

Technical Library | 2008-11-27 01:25:25.0

Military electrical connectors have traditionally used very conservative design rules that provide the ruggedization needed for harsh military use environments. Commercial electronic connectors have typically used less conservative design rules that.

Electronics Manufacturing Productivity Facility (EMPF)

Why the minimum order quantity of IC shipping tubes is so high?

Technical Library | 2019-04-30 08:04:19.0

Every industry has every unwritten rules, like IC shipping tube moq is high in packaging tube industry rules! This regulation is not to be difficult for customers, but the cost of the problem, as long as the manufacturers feel that even a small amount of packaging tube can do and do too.

Shenzhen Sewate Technology Co.,Ltd

Designing Circuit Boards for Selective Robotic Coating Application

Technical Library | 2013-10-13 10:36:21.0

Designing circuit boards for selective robotic spraying of conformal coating can be straightforward if you follow some design rules. Follow them and you can save money and time in your application process. However, if the rules are not followed, the resultant circuit board design can challenge even the most sophisticated conformal coating system and its operator to achieve the finish desired.

SCH Technologies

HDI Microvia Technology – Cost Aspects

Technical Library | 2021-12-21 23:21:34.0

Points of discussion in "HDI Microvia Technology – Cost Aspects" are: - Reasons for the use of HDI technology - Printed circuit board (PCB) size - Number of layers - Stack-up and complexity - Other important cost influences -–Design rules -–Drilling costs -–Microvia filling

Würth Elektronik GmbH & Co. KG

A New Stencil Rulebook for Wafer Level Solder Ball Placement using High Accuracy Screen Printing

Technical Library | 2007-12-13 17:03:02.0

Printer-hosted processes for solder ball placement are now widely used for package technologies ranging from BGAs using ball diameters above 750μm to the latest WL-CSPs demanding 250μm diameter. This broadening spectrum of applications brings more choices in terms of stencil design rules and production methodologies.

ASM Assembly Systems (DEK)

Streamlining PCB Assembly and Test NPI with Shared Component Libraries

Technical Library | 2016-04-08 01:19:52.0

PCB assembly designs become more complex year-on-year, yet early-stage form/fit compliance verification of all designed-in components to the intended manufacturing processes remains a challenge. So long as librarians at the design and manufacturing levels continue to maintain their own local standards for component representation, there is no common representation in the design-to-manufacturing phase of the product lifecycle that can provide the basis for transfer of manufacturing process rules to the design level. A comprehensive methodology must be implemented for all component types, not just the minority which happen to conform to formal packaging standards, to successfully left-shift assembly and test DFM analysis to the design level and thus compress NPI cycle times.(...)This paper will demonstrate the technological components of the working solution: the logic for deriving repeatable and standardized package and pin classifications from a common source of component physical-model content, the method for associating DFA and DFT rules to those classifications, and the transfer of those rules to separate DFM and NPI analysis tools elsewhere in the design-through-manufacturing chain resulting in a consistent DFM process across multiple design and manufacturing organizations.

Mentor Graphics

Designing PCBs for Test and Inspection

Technical Library | 2012-12-14 14:17:56.0

This article provides practical and affordable Design-for- Test (DFT) and Design-for-Inspection (DFI) methods that will have a positive impact on product costs, yield, reliability, and time-to-market. The properties of testability (including controllability and observability) will be analysed as they relate to analogue and digital design rules and their cause/effect, as well as the electrical and physical characteristics of proper PCB design.

Teradyne

Electronic Does Not Equal Smart: Service Documentation and Brand Quality

Technical Library | 2018-02-01 00:31:48.0

This paper briefly summarizes the technologies underpinning the evolution in electrical system diagnosis and repair, which include schematic layout automation using prototypes and rule-based styling, instant language translation, 2D/3D view links with schematics, interactive diagnostic procedures, and dynamically-generated signal-tracing diagrams. These technologies empower after-sales service teams with state-of-the-art capabilities, which not only reduce costs but also improve brand quality in the eyes of its customers.

Mentor Graphics

Basics of ASHCROFT Pressure Transmitter - Performance Index, Wiring, Thread Type, Unavoidable Inaccuracies and Mounting

Technical Library | 2021-11-29 01:10:58.0

ASHCROFT pressure transmitter is one of the most commonly used transmitters in industrial applications. It is widely used in a variety of control environments, involving water conservancy and hydropower, railway transportation, intelligent building, production automation, aerospace, military, petrochemical, oil wells, electric power, ships, machine tools and pipelines. ASHCROFT pressure transmitter is an electronic device that senses the pressure signal and converts it into an available output electrical signal according to certain rules.

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