Technical Library | 2023-01-17 17:37:45.0
Various international market trends drive electronics manufacturers and their mate- rials and equipment suppliers to develop new assembly techniques to reduce the industry's environmental impact. Two pri- mary forces in this drive are the movements to lead-free assembly and ISO 14000 cer- tification. In response to these factors, reflow technology advances are enabling manufacturers to meet or anticipate the new environmental mandates.
Technical Library | 2023-09-16 06:23:58.0
Explore our SMT & DIP PCB handling machine to optimize your manufacturing process. Enhance efficiency and precision in handling printed circuit boards.
Technical Library | 2021-06-15 15:17:33.0
Shielding electronic systems against electromagnetic interference (EMI) has become a hot topic. Technological advancements toward 5G standards, wireless charging of mobile electronics, in-package antenna integration, and system-in-package (SiP) adoption are driving the need to apply more effective EMI shielding and isolation to component packages and larger modules. For conformal shielding, EMI shielding materials for exterior package surfaces have mostly been applied with a physical vapor deposition (PVD) process of sputtering, leveraging front-end packaging technologies to back-end packaging applications. However, sputtering technology challenges in scalability and cost along with advancements in dispensable materials are driving considerations for alternative dispensing techniques for EMI shielding.
Technical Library | 1999-05-06 15:14:48.0
To help the designer set the appropriate current level, AMP has developed a new method of specifying current-carrying capacity. This new method takes into account the various application factors that influence current rating.
Technical Library | 2023-05-22 17:13:17.0
Agenda Overview Independent Testing & Studies-Print studies -Understencil Wipe studies-Durability Testing-Ongoing Studies NanoClear Product Information NanocoatingsComparison Summary Questions
Technical Library | 2021-12-31 01:27:08.0
A servomotor refers to the actuator to control the operation of mechanical components in the servo system and is a subsidy motor indirect transmission device. The servo motor can control speed, whose position accuracy is high, and convert voltage signal into torque and speed to drive the controlled object. A servomotor speed is controlled by the input signal, responding quickly.
Technical Library | 2016-02-04 19:11:47.0
In a typical mechatronic manufacturing functional test setup, actual load simulations are usually done by connecting the DUT outputs to power or ground in order to establish either a high or low side driver. Each output is connected with different load and the test will either be sequential or concurrent. At lower power levels, these can usually be managed with general purpose switches. However, when it comes to higher power levels of currents more than 5 amps, such switching and loading might pose a greater challenge. Furthermore, critically in the manufacturing line, the tradeoff between cost and test time would have a great influence on the test strategy.This paper will present some key points to design a cost effective high power switching and load management solution.
Technical Library | 2021-07-13 19:54:59.0
This Market Trend Report for the Silver Institute examines silver's growing role in printed and flexible electronics. According to our research, 33.9% of the annual silver global supply in 2020 ended up in electronics. This is a total of 327 million troy ounces (Moz) that finds its way into various electronics markets every year. Given the projected growth of electrification, we are confident that this will continue to grow over time since silver is the world's most conductive material.
Technical Library | 2024-05-16 16:06:24.0
Much like actual cities where streets and roads connect buildings together, ICs on a board are connected to each other with copper traces. And just like any metropolitan city, urban expansion tends to move vertically instead of horizontally, but instead of multi-story buildings, we get multilayer boards. Vias are copper-plated holes spanning through the different layers of a given board or panel. They are the entrance locations to the subway stations, if you will. Having those multilayer boards has enabled electronic design to minimize the size of boards immensely without compromising on the complexity.
Technical Library | 2021-04-16 05:38:38.0
The overall process of manufacturing electronics assemblies is characterized by a number of very different procedures. Along the production chain, technologies for cutting, assembling, soldering, bonding, gluing, marking, potting, etc. are used, all of them have one thing in common: They produce airborne pollutants, some of which can have a significant impact on employees, manufacturing equipment and products - and for this reason need to be removed effectively and efficiently.
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