Technical Library | 2007-05-31 19:05:55.0
This paper discusses solder paste printing and flux dipping assembly processes for 0.4 and 0.5mm pitch lead-free WLCSPs and the corresponding assembly results and thermal cyclic reliability obtained. Variables evaluated include reflow ambient, paste type, and stencil design. Reliability is also compared to results for the same components assembled under identical conditions using SnPb solder.
Technical Library | 2007-11-15 15:54:44.0
At the contractor level once a product is required to be soldered with lead-free solders all the processes must be assessed as to insure the same quality a customer has been accustomed to with a Sn63Pb37 process is achieved. The reflow, wave soldering and hand assembly processes must all be optimized carefully to insure good joint formation as per the appropriate class of electronics with new solder alloys and often new fluxes.
Technical Library | 2009-05-14 13:57:43.0
Is screen printing technology able to keep pace with rising quality demands and increasingly complex board layouts? Or, is new jet printing technology ready to fill the gap? A comparison study between the two methods reveals some interesting differences. Screen printers offer some possibilities for optimizing solder paste deposits, but optimization is far easier and quicker with the jet printer. At the same time, the ability to print individualized deposits on every single pcb pad may be the ultimate answer to the growing quality challenge.
Technical Library | 2011-09-01 18:11:31.0
Scavenging, Site Dressing, Residual Solder Removal. What's in a name? "That which we call an onion, by any other name would smell as strong" (apologies to the immortal bard). And, regardless of the name you give it, the objective is the same, namely the clean up of remaining solder after a component (particularly a BGA) or R.F. Shield has been removed from a PCB. This paper will describe the various methods that are available and discuss their pros and cons.
Technical Library | 2013-11-06 06:39:05.0
The set up of a turnkey conformal coating production line or facility, whether it is a batch or inline process, has many similar characteristics. Whether the coating application is based around a high volume selective coating robot, a batch dip coating system or a spray booth, the process requirements tend to be the same. This bulletin reviews the potential needs of the facility, including the process controls, environmental needs and health and safety issues and provides some starting points for a new facility.
Technical Library | 2024-02-06 14:36:04.0
Quality monitoring for verifiable, high-precision application of adhesives and sealants now begins with detecting the position of the component. Dispensing systems are in continuous use and have to work with 100 percent accuracy. And this level of accuracy must be verifiable. Demands on electronic components continue to escalate as these components also need to operate continuously and flawlessly, especially in the automotive and medical sectors. At the same time, there is increasing pressure to automate as companies are looking to achieve the shortest possible cycle times and maximum output.
Technical Library | 2019-12-16 22:20:55.0
When we were children,our parents always warn us "Do comparison shopping before you buy",why they say like this?this is a very simple truth, for the first deal,we are always cautious, through continuous comparison in order to find out the best quality, service, after-sale and price. This apply to any industry,there are many manufacturers of environmental test equipment. When some customers inquire a temeprature humidity test chamber, they will find a very common problem. Why is the price of the same equipment quoted by the two manufacturers very different? 1, the chamber body process,which effects the exterior case quality,this price has a gap. 2, the components, esp.components of the refrigeration system, is the core value of the temperature humidity test chamber. 3, even if the body and refrigeration components are the same, some prices are different, that is the manufacturer technical level. 4, regional issues, Wuxi,Changzhou, Dongguan, these brands need to know more. 5. after-sales, a powerful manufacturer often with a sound after-sales service dept.. The above are both technical and service, as well as the delivery cost of goods to the local and overseas are different.
Technical Library | 2020-04-16 05:52:45.0
Based on the dual pot, we developed an independent dual z-axis control dual pot for FLEX-i2! There are 5 operation modes available with the independent dual Z axis: only solder pot1, only solder pot2, first solder pot 1 then solder pot2, first solder pot2 then solder pot1, solder pot1 and solder pot2 together. In specific applications, solder pot1 can be selected with large nozzle soldering heat-absorbing large parts, solder pot2 use small nozzle soldering heat-absorbing small parts, so as to achieve both soldering effect and productivity. Also can use same nozzle, dual axis simultaneously solder two same plate to increase productivity. To get the maximum flexibility and productivity! FLEX-i2 is a compact in line selective soldering machine, equipped with high precision servo control system, jet valve, live-on camera, upper preheating etc, which can provide a high flexibility and efficiency soldering process. The maximum soldering size can reach 420mm*490mm!
Technical Library | 2015-02-05 23:23:40.0
Ball grid arrays are the boon and bane of engineers and printed circuit board designers the world over. Their unparalleled pin density and low lead inductance are essential in today's high pin count, high frequency integrated circuits. However, that same pin density and unique interface create a challenge unique unto themselves. These challenges need to be faced head on since the ball grid array (BGA) is prevalent in modern PCBs. While there are entire textbooks that cover the topic of BGAs, their use and fanout techniques, the quick overview provided here offers an engineer a good starting point for improving BGA designs.
Technical Library | 2015-11-12 19:04:51.0
In order to provide the functionality in today’s electronics, printed circuit boards are approaching the complexity of semiconductors. For flexible circuits with 1 mil lines and spaces, this means no nodules, no pits, and excellent ductility with thinner deposits. One of the areas that has to change to get to this plateau of technology is acid copper plating. Acid copper systems have changed in minor increments since their introduction decades ago. However, the basic cell design using soluble anodes in slabs or baskets has for the most part remained the same. Soluble, phosphorized, copper anodes introduce particulate and limits the ability to control plating distribution.
