Technical Library | 2023-01-17 17:58:36.0
Heterogeneous integration has become an important performance enabler as high-performance computing (HPC) demands continue to rise. The focus to enable heterogeneous integration scaling is to push interconnect density limit with increased bandwidth and improved power efficiency. Many different advanced packaging architectures have been deployed to increase I/O wire / area density for higher data bandwidth requirements, and to enable more effective die disaggregation. Embedded Multi-die Interconnect Bridge (EMIB) technology is an advanced, cost-effective approach to in-package high density interconnect of heterogeneous chips, providing high density I/O, and controlled electrical interconnect paths between multiple dice in a package. In emerging architectures, it is required to scale down the EMIB die bump pitch in order to further increase the die-to-die (D2D) communication bandwidth. Aa a result, bump pitch scaling poses significant challenges in the plated solder bump reflow process, e.g., bump height / coplanarity control, solder wicking control, and bump void control. It's crucial to ensure a high-quality solder bump reflow process to meet the final product reliability requirements. In this paper, a combined formic acid based fluxless and vacuum assisted reflow process is developed for fine pitch plated solder bumping application. A high-volume production (HVM) ready tool has been developed for this process.
Technical Library | 2023-01-17 17:22:28.0
The impact of voiding on the solder joint integrity of ball grid arrays (BGAs)/chip scale packages (CSPs) can be a topic of lengthy and energetic discussion. Detailed industry investigations have shown that voids have little effect on solder joint integrity unless they fall into specific location/geometry configurations. These investigations have focused on thermal cycle testing at 0°C-100°C, which is typically used to evaluate commercial electronic products. This paper documents an investigation to determine the impact of voids in BGA and CSP components using thermal cycle testing (-55°C to +125°C) in accordance with the IPC- 9701 specification for tin/lead solder alloys. This temperature range is more typical of military and other high performance product use environments. A proposed BGA void requirement revision for the IPC-JSTD-001 specification will be extracted from the results analysis.
Technical Library | 2024-08-20 00:40:08.0
In electronics manufacturing, 'Underfill' refers to a material that is applied to fill the gap between a semiconductor device, such as flip-chip assemblies, Ball Grid Arrays (BGA), or Chip Scale Packages (CSP), and the substrate, such as a PCB or flex circuit.
Technical Library | 2012-06-07 21:44:28.0
First published in the 2012 IPC APEX EXPO technical conference proceedings. IPC-175x Intent: To establish a standard data exchange format that will facilitate, improve, and secure data transfer between all members of a supply chain.
Technical Library | 2023-11-20 09:56:38.0
Understanding The Crucial Role Of Dust Collectors In PCB Depaneling Machines Precision is paramount in PCB manufacturing, but it must go hand in hand with cleanliness. The intrusion of dust and debris can wreak havoc on delicate electronics. This article explores the pivotal role of dust collectors, their operation, and their necessity for various PCB depaneling machines. The Dust Collector's Crucial Function Dust collectors, also known as dust extractors, play an indispensable role in PCB manufacturing. When a PCB depaneling machine or a Laser PCB Depaneling machine is in operation, it generates a significant amount of dust. The dust collector promptly engages its vacuum motor to suction fine particles off the PCB, directing them to a collector equipped with a filtration system. Which Models Of PCB Depanelers Require Dust Collector? Several PCB depaneling machines necessitate dust collectors to ensure precision and cleanliness, including: I.C.T-5700 Offline Depaneling Machine, high precision, easy manual operation, dual platform, high efficiency. I.C.T-IR350 In-line depaneling machine, high precision, rapid operation, suitable for integration into the SMT production line for Industry 4.0 and AI automated production. I.C.T-LCO350 Laser cutting ensures cutting accuracy of 0.002, ideal for precise cutting requirements. I.C.T-100A Desktop PCB depaneling machine with compact size and high precision, suitable for smaller-scale operations. The Science Behind PCB Dust Collectors To prevent charged dust particles from adhering to PCBs, PCB depaneling machines are equipped with ionizing guns. These devices emit ions that neutralize static charges, making dust particles less likely to stick to freshly cut PCBs. The Vacuum Effect: Suctioning Away Dust During PCB depaneling, a cloud of dust is produced. The dust collector utilizes a robust suction system, often powered by vacuum motors, to draw dust away from the work area. Collected dust is transported to a designated collection point within the dust collector. A Difference In Design: I.C.T-5700 Vs. I.C.T-IR350 The placement of the dust collection apparatus distinguishes PCB depaneling machines. I.C.T-5700 has a bottom-mounted system capturing falling dust, while I.C.T-IR350 features a top-mounted system preventing dust settling on the work surface. This strategic difference ensures efficient removal of dust and debris, guaranteeing a clean and precise manufacturing process. Check: If you want to learn about the comparison of I.C.T-5700 and I.C.T-IR350. The Importance Of Filter Replacement The efficiency of a dust collector relies on its filter, necessitating periodic replacement every 1-3 years, depending on usage frequency. Regular filter maintenance ensures optimal performance. Dust Collectors: Keep Your PCB Manufacturing Clean And Precise Precision in PCB manufacturing is not solely about cutting-edge machinery but also about cleanliness. If you seek a dust collector for your PCB depaneling machine, contact us today to explore your options. Ensure your operations maintain cleanliness, efficiency, and meet the high standards of modern PCB manufacturing. Don't let dust compromise your precision – let's keep it clean together!
Technical Library | 2023-11-20 09:56:42.0
Understanding The Crucial Role Of Dust Collectors In PCB Depaneling Machines Precision is paramount in PCB manufacturing, but it must go hand in hand with cleanliness. The intrusion of dust and debris can wreak havoc on delicate electronics. This article explores the pivotal role of dust collectors, their operation, and their necessity for various PCB depaneling machines. The Dust Collector's Crucial Function Dust collectors, also known as dust extractors, play an indispensable role in PCB manufacturing. When a PCB depaneling machine or a Laser PCB Depaneling machine is in operation, it generates a significant amount of dust. The dust collector promptly engages its vacuum motor to suction fine particles off the PCB, directing them to a collector equipped with a filtration system. Which Models Of PCB Depanelers Require Dust Collector? Several PCB depaneling machines necessitate dust collectors to ensure precision and cleanliness, including: I.C.T-5700 Offline Depaneling Machine, high precision, easy manual operation, dual platform, high efficiency. I.C.T-IR350 In-line depaneling machine, high precision, rapid operation, suitable for integration into the SMT production line for Industry 4.0 and AI automated production. I.C.T-LCO350 Laser cutting ensures cutting accuracy of 0.002, ideal for precise cutting requirements. I.C.T-100A Desktop PCB depaneling machine with compact size and high precision, suitable for smaller-scale operations. The Science Behind PCB Dust Collectors To prevent charged dust particles from adhering to PCBs, PCB depaneling machines are equipped with ionizing guns. These devices emit ions that neutralize static charges, making dust particles less likely to stick to freshly cut PCBs. The Vacuum Effect: Suctioning Away Dust During PCB depaneling, a cloud of dust is produced. The dust collector utilizes a robust suction system, often powered by vacuum motors, to draw dust away from the work area. Collected dust is transported to a designated collection point within the dust collector. A Difference In Design: I.C.T-5700 Vs. I.C.T-IR350 The placement of the dust collection apparatus distinguishes PCB depaneling machines. I.C.T-5700 has a bottom-mounted system capturing falling dust, while I.C.T-IR350 features a top-mounted system preventing dust settling on the work surface. This strategic difference ensures efficient removal of dust and debris, guaranteeing a clean and precise manufacturing process. Check: If you want to learn about the comparison of I.C.T-5700 and I.C.T-IR350. The Importance Of Filter Replacement The efficiency of a dust collector relies on its filter, necessitating periodic replacement every 1-3 years, depending on usage frequency. Regular filter maintenance ensures optimal performance. Dust Collectors: Keep Your PCB Manufacturing Clean And Precise Precision in PCB manufacturing is not solely about cutting-edge machinery but also about cleanliness. If you seek a dust collector for your PCB depaneling machine, contact us today to explore your options. Ensure your operations maintain cleanliness, efficiency, and meet the high standards of modern PCB manufacturing. Don't let dust compromise your precision – let's keep it clean together!
Technical Library | 1999-05-07 08:50:40.0
To enable transistor scaling into the 21st century, new solutions such as high dielectric constaConventional scaling of gate oxide thickness, source/drain extension (SDE), junction depths, and gate lengths have enabled MOS gate dimensions to be reduced from 10mm in the 1970’s to a present day size of 0.1mm. To enable transistor scaling into the 21st century, new solutions such as high dielectric constant materials for gate insulation and shallow, ultra low resistivity junctions need to be developed. In this paper, for the first time, key scaling limits are quantified for MOS transistorsnt materials for gate insulation and shallow, ultra low resistivity junctions need to be developed.
Technical Library | 1999-05-06 12:11:42.0
The newest workstations and servers, targeting computationally-intensive applications and large-scale database management, use 64-bit microprocessors and provide the next generation of computing power.
Technical Library | 2013-08-14 14:06:48.0
This paper discusses how to successfully profile a printed circuit board when reworking Ball Grid Array and Chip Scale Packages.
Technical Library | 1999-05-06 13:50:14.0
This paper begins with a historical review of that revolution, from the first integrated circuit to modern very large scale integration (VLSI) technology, and then reviews the development of present-day microelectronics manufacturing technology...
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