Technical Library | 2012-12-26 20:18:50.0
①Single side The basic flexible printed circuit board is used of substrate of single side pcb materials and coated coverlay after finishing printed. ②Double sided That is made of substrates of double sided printed circuit board with double surface coated coverlays after finishing printed. ③Single copper foil with double coverlays Single copper foil coated different coverlays with double surface after finishing printed. ④Air gap Laminating two single printed circuit board together with no glue and bare design to meet high flexibility requirements. ⑤Multilayer That is designed for three and above circuit layers by laminating single side printed circuit board or double sided printed circuit board. ⑥COF IC chips and electronic components are installed on the flexible circuit board directly. ⑦Rigid-Flexible PCB Combined to rigid PCB with supporting and flexible PCB with high flexibility.
Technical Library | 2016-11-30 15:53:15.0
The use of microvias in Printed Circuit Boards (PCBs) for military hardware is increasing as technology drives us toward smaller pitches and denser circuitry. Along with the changes in technology, the industry has changed and captive manufacturing lines are few and far between. As PCBs get more complicated, the testing we perform to verify the material was manufactured to our requirements before they are used in an assembly needs to be reviewed to ensure that it is sufficient for the technology and meets industry needs to better screen for long-term reliability. The Interconnect Stress Testing (IST) protocol currently used to identify manufacturing issues in plated through holes, blind, or buried vias are not necessarily sufficient to identify problems with microvias. There is a need to review the current IST protocol to determine if it is adequate for finding bad microvias or if there is a more reliable test that will screen out manufacturing inconsistencies. The objective of this research is to analyze a large population of PCB IST coupons to determine if there is a more effective IST test to find less reliable microvias in electrically passing PCB product and to screen for manufacturing deficiencies. The proposed IST test procedure will be supported with visual inspection of corresponding microvia cross sections and Printed Wiring Assembly (PWA) acceptance test results. The proposed screening will be shown to only slightly affect PCB yield while showing a large benefit to screening before PCBs are used in an assembly.
Technical Library | 2009-05-14 13:57:43.0
Is screen printing technology able to keep pace with rising quality demands and increasingly complex board layouts? Or, is new jet printing technology ready to fill the gap? A comparison study between the two methods reveals some interesting differences. Screen printers offer some possibilities for optimizing solder paste deposits, but optimization is far easier and quicker with the jet printer. At the same time, the ability to print individualized deposits on every single pcb pad may be the ultimate answer to the growing quality challenge.
Technical Library | 2011-01-20 19:50:30.0
This article introduces the technical development that went in to realizing an 80-layer ultra-multilayer printed circuit board, which meets the market demand for a "semiconductor test board supporting memory increases".
Technical Library | 2016-08-04 14:33:23.0
Solder paste screen printing is known to be one of the most difficult processes to quality assure in Printed Board Assembly (PBA) manufacturing. An important process step in solder paste screen printing is the under stencil cleaning process and one of the key materials in this process is the cleaning paper1. This, often neglected, material affects the cleaning process and thereby also the print quality. It is therefore important to perform tests of different cleaning papers before one could be chosen. This article describes how cleaning papers can be tested and it also tells how big differences it can be between different materials.
Technical Library | 2021-09-15 18:58:01.0
Mathematical model for dynamic force analysis of printed circuit boards has been designed to calculate dynamic deformations and stresses in printed circuit boards and assess their dynamic strength and rigidity. The represented model describes a printed circuit board as a separate oscillatory system, which is simulated as prismatic beam set on two oscillating supports. Simulation and assessment of stress and deflection in printed circuit boards and obtaining their amplitude frequency responses provided recommendations, which ensure strength and stiffness of printed circuit boards subjected to dynamic loads..
Technical Library | 2019-05-22 21:24:05.0
voidless treatment Smaller components -> miniaturization (01005 capability) Large board handling -> dynamic preheating for large board repair Repeatable processes -> flux and paste application (Dip and Print), residual solder removal (scavenging), dispensing, multiple component handling, and traceability Operator support -> higher automation, software guidance
Technical Library | 2010-04-22 14:55:51.0
It is now widely accepted that using designed experiments is the most effective way to optimize surface mount technology (SMT) processes. This situation begs the question "what is an effective strategy in implementing this powerful tool?" This paper will present such a strategy that incorporates Taguchi's approach for screening, full factorial analysis for optimization and central composite design for precise modeling. We will present these techniques using MINITABTM Release 13 statistical software and printed circuit board industry applications.
Technical Library | 2012-12-27 14:35:29.0
Printed Electronics is generally defined as the patterning of electronic materials, in solution form, onto flexible substrates, omitting any use of the photolithography, etching, and plating steps commonly found within the Printed Circuit Board (PCB) industry. The origins of printed electronics go back to the 1960s, and close variants of several original applications and market segments remain active today. Through the 1980s and 1990s Printed Electronic applications based on Membrane Touch Switch and Electroluminescent lighting technologies became common, and the screen printed electronic materials used then have formed the building blocks for many of the current and emerging technologies and applications... First published in the 2012 IPC APEX EXPO technical conference proceedings.
Technical Library | 2018-03-15 07:23:35.0
The SMT assembly process is continuously challenged by the factors which enhance circuit board performance and limit productivity. The pick and place and reflow systems reflect these driven issues by adding more and more controls to their systems, but the fact is one of the age old processes continues to operate within the same rules since the dawn of the SMT assembly world: The SMT screen printing. (...)This paper showcases a new stencil process that was discovered by reverting to the basics:understanding the reason for each stencil material process, focusing on detailed finishes and a disciplined aperture design process, maintaining original designs, and making the correctly designed apertures to control the paste deposition. The test results drove us to focus the efforts on the aperture walls In this paper we will demonstrate with lab tests SMT process results howthe improved paste release results in improved SMT print process performance and its positive impact on SPI yields and EOL performance.
