Technical Library | 2011-02-24 19:20:14.0
In the selective soldering process, dross can be detrimental. Dross (and I use this term to encompass all surface contamination) is created in conjunction with the presence of Oxygen in two different areas of the process, and by separate means. Each must
Technical Library | 2023-11-14 19:42:24.0
Selective soldering is not a new process. It is already exists and used 30 years ago for through-hole component by different industries for automotive and medical products. Now most manufacturing industries are moving forward on SMD's miniaturization to reduce PCB complexity and balance component density on the board to ensure a good assembling process. By this concept, why selective soldering still utilized and used? Does it because of component reliability, uniqueness or complexity having this in mind next question will be which platform will best fit for the product
Technical Library | 2018-02-14 22:58:54.0
This document describes general guidelines and attention points for PCB design regarding selective soldering. The guidelines can be applied for Select Wave and/or Multi Wave soldering process in both leaded and leadfree alloy. When a PCB is designed according to these guidelines, a stable and solid solder-process can be guaranteed.
Technical Library | 2023-11-14 19:33:57.0
Wave soldering is an established technology and is commonly used where large unit volumes occur with low product variety. However, if a wave soldering machine is getting old or if technological changes or new PCB designs limits its manufacturing capabilities, consideration should be given to whether selective soldering would be a better choice. Anyone who deals with soldering through-hole and surface mount mixed-technology printed circuit assemblies will quickly discover that a selective soldering machine is not only less expensive that wave soldering, but selective soldering also offers the opportunity to meet customer requirements with significantly more flexibility. One such company is Thomas Preuhs GmbH. Located in Geislingen, Germany, Thomas Preuhs GmbH manufactures a variety of electronic assemblies for solar and HVAC data systems, automotive and white goods products as well as electric drive systems.
Technical Library | 2020-03-01 23:06:45.0
For though hole soldering, no matter it's wave soldering or selective soldering, the process is same formed by fluxing,preheating,soldering. How these 3 process will change the soldering result? When you face the soldering defects, what could be the reasons caused these and how to debug them? With below information you may get some hints.
Technical Library | 2020-05-07 03:46:27.0
The selective soldering process has evolved to become a standard production process within the electronics assembly industry, and now accommodates a wide variety of through-hole component formats in numerous applications. Most through-hole components can be easily soldered with the selective soldering process without difficulty, however some types of challenging components require additional attention to ensure optimum quality control is maintained. Several high thermal mass components can place demands on the selective soldering process, while the use of specialized solder fixtures and/or pallets often places an additional thermal demand on the preheating process. Fine-pitch through-hole components and connectors place a different set of demands on the selective soldering process and typically require special attention to lead projection and traverse speed to minimize bridging between adjacent pins. Dual in-line memory module (DIMM) connectors, compact peripheral component interface (cPCI) connectors, coax connectors and other high thermal mass components as well as fine-pitch microconnectors,can present challenges when soldered into backplanes or multilayer printed circuit board assemblies. Adding to this challenge, compact peripheral component interface connectors can present additional solderability issues due to their beryllium copper termination pins.
Technical Library | 2022-08-08 15:06:06.0
Selective soldering has evolved to become a standard production process within the electronics assembly industry, and now accommodates a wide variety of through-hole component formats in numerous applications. Most through-hole components can be easily soldered with the selective soldering process without difficulty however some types of challenging components require additional attention to ensure that optimum quality is maintained. Several high thermal mass components can place demands on the selective soldering process, while the use of specialized solder fixtures, or solder pallets, often places additional thermal demand on the preheating process. Fine-pitch through-hole components and connectors place a different set of demands on the selective soldering process and typically require special attention to lead projection and traverse speed to minimize bridging between adjacent pins. Dual in-line memory module (DIMM) connectors, compact peripheral component interface (cPCI) connectors, coax connectors and other high thermal mass components as well as fine-pitch microconnectors, can present challenges when soldered into backplanes or multilayer printed circuit board assemblies. Adding to this challenge, compact peripheral component interface connectors can present additional solderability issues because of their beryllium copper base metal pins. Key Terms: Selective soldering, drop-jet fluxing, sustained preheating, flux migration, adjacent clearance, lead-to-hole aspect ratio, lead projection, thermal reliefs, gold embrittlement, solderability testing.
Technical Library | 2023-12-18 21:07:29.0
Selective soldering utilises a nozzle to apply solder to components on the underside of printed circuit boards (PCBs). This nozzle can be moved to either perform dips (depositing solder to a single component) or draws (applying solder to several components in a single movement). The selective soldering methodology thereby allows the process to be tailored to specific joints and allows multiple nozzle types to be used if required on the circuit board. Nozzles can vary by size (internal diameter) and shape (making them suitable for different process types). This is all dictated by board design and process requirements. Selection of the nozzle type is dependent upon the product to be soldered and the desired cycle time. Examples of different nozzle types are shown here. Hand-load selective systems must be programmed with the parameters for multiple solder joints. However, many in-line systems are designed to be modular. This modularity allows for multiple solder stations with different conditions/nozzles to achieve low cycle times. Figure 1 shows the two distinct types of selective soldering systems offered by Pillarhouse International Ltd.
Technical Library | 2015-02-27 17:06:01.0
The drive towards fine pitch technology also affects the soldering processes. Selective soldering is a reliable soldering process for THT (through hole) connectors and offers a wide process window for designers. THT connectors can be soldered on the top and bottom side of boards, board in board, PCBs to metal shields or housing out of plastic or aluminum are today's state of the art. The materials that are used to make the solder connections require higher temperatures. Due to the introduction of lead-free alloys, the boards need more heat to get the barrels filled with solder. This not only affects the properties of the flux and components, but the operation temperatures of solder machines become higher (...)First the impact of temperature will be discussed for the separate process steps and for machine tooling. In the experimental part measurements are done to verify the accuracy that can be achieved using today's selective soldering machines. Dedicated tooling is designed to achieve special requirements with respect to component position accuracy.
Technical Library | 2017-05-25 17:07:39.0
Purpose of this research is to identify the factors that directly influence the effectiveness of the fluxing process in selective soldering machines, using the design of experiment methodology with associated factors and levels used in the experiment. Final findings gives directions for set up of the optimal fluxing parameters that will enable appropriate flux appliance and to gain reduction of soldering quality issues which foundations are from this process.
.gif)
winsouce.jpg)
