Technical Library | 2024-02-02 07:48:31.0
Maximizing Efficiency: The High-Speed SMT Line With Laser Depanelizer In today's rapidly evolving electronics manufacturing landscape, optimizing efficiency, cost-effectiveness, and precision remains paramount. Businesses engaged in producing industrial control boards, computer motherboards, mobile phone motherboards, and mining machine boards face ongoing challenges in streamlining production processes. The integration of expensive equipment strains budgets, making the creation of an efficient, cost-effective high-speed SMT line a daunting task. However, a solution exists that seamlessly combines these elements into a singular, high-performance, and cost-effective SMT line. Let's delve into the specifics. A Comprehensive High-Speed SMT Line Our innovative solution amalgamates two pivotal components: a cutting-edge SMT (Surface Mount Technology) production line and a laser cutting line equipped with a depanelizer. The SMT Production Line The high-speed SMT line comprises several essential components, each fulfilling a unique role in the manufacturing process: 1. PCB Loader: This initial stage involves loading boards onto the production line with utmost care. Our Board Loader prioritizes safety, incorporating various safety light curtains and sensors to promptly halt operations and issue alerts in case of any anomalies. 2. Laser Marking Machine: Every PCB receives a unique two-dimensional code or barcode, facilitating comprehensive traceability. Despite the high-temperature laser process potentially leading to dust accumulation on PCB surfaces, our dedicated PCB Surface Cleaner swiftly addresses this issue. 3. SMT Solder Paste Printer: This stage involves applying solder paste to the boards, a fundamental step in the manufacturing process. 4. SPI (Solder Paste Inspection): Meticulous inspections are conducted at this stage. Boards passing inspection proceed through the NG (No Good) Buffer Conveyor to the module mounters. Conversely, "No Good" results prompt storage of PCBs in the NG Buffer Conveyor, capable of accommodating up to 25 PCBs. Operators can retrieve these NG boards for rework after utilizing our specialized PCB Mis Cleaner to remove solder paste. 5. Module Mounters: These machines excel in attaching small and delicate components, necessitating precision and expertise in the module mounting process. 6. Standard Pick And Place Machines: The selection of these machines is contingent upon your specific BOM (Bill of Materials) list. 7. Pre-Reflow AOI (Automated Optical Inspection): Boards undergo examination for component quality at this stage. Detected issues prompt the Sorting Conveyor to segregate boards for rework. 8. Reflow Oven: Boards undergo reflow soldering, with our Lyra series reflow ovens recommended for their outstanding features, including nitrogen capability, flux recycling, and water cooling function, ensuring impeccable soldering results. 9. Post-Reflow AOI: This stage focuses on examining soldering quality. Detected defects prompt the Sorting Conveyor to segregate boards for further inspection or rework. Any identified defects are efficiently addressed with the BGA rework station, maintaining the highest quality standards. 10. Laser Depanelizer: Boards advance to the laser depanelizer, where precision laser cutting, often employing green light for optimal results, ensures smoke-free, highly accurate separation of boards. 11. PCB Placement Machine: Cut boards are subsequently managed by the PCB Placement Machine, arranging them as required. With this, all high-speed SMT line processes are concluded. Efficiency And Output This production line demonstrates exceptional productivity when manufacturing motherboards with approximately 3000 electronic components, boasting the potential to assemble up to 180 boards within a single hour. Such efficiency not only enhances output but also ensures cost-effectiveness and precision in your manufacturing processes. At I.C.T, we specialize in crafting customized SMT production line solutions tailored to your product and specific requirements. Our equipment complies with European safety standards and holds CE certificates. For inquiries or to explore our exemplary post-sales support, do not hesitate to contact us. The I.C.T team is here to elevate your electronics manufacturing to new heights of efficiency and cost-effectiveness.
Technical Library | 2021-12-16 01:52:32.0
Package on Packages (PoP) find use in applications that require high performance with increased memory density. One of the greatest benefits of PoP technology is the elimination of the expensive and challenging task of routing high-speed memory lines from under the processor chip out to memory chip in separate packages. Instead, the memory sits on top of the processor and the connections are automatically made during assembly. For this reason PoP technology has gained wide acceptance in cell phones and other mobile applications. PoP technology can be assembled using one-pass and two-pass assembly processes. In the one-pass technique the processor is first mounted to the board, the memory is mounted to the processor and the finished board is then run through the reflow oven in a single pass. The two-pass technique has an intermediate step in which the memory is first mounted onto the processor.
Technical Library | 2020-07-02 13:29:37.0
Industry standards such as J-STD-005 and JIS Z 3284-1994 call for the use of viscosity measurement(s) as a quality assurance test method for solder paste. Almost all solder paste produced and sold use a viscosity range at a single shear rate as part of the pass-fail criteria for shipment and customer acceptance respectively. As had been reported many times, an estimated 80% of the defects associated with the surface mount technology process involve defects created during the printing process. Viscosity at a single shear rate could predict a fatal flaw in the printability of a solder paste sample. However, false positive single shear rate viscosity readings are not unknown.
Technical Library | 2020-07-29 19:58:48.0
The majority of flexible circuits are made by patterning copper metal that is laminated to a flexible substrate, which is usually polyimide film of varying thickness. An increasingly popular method to meet the need for lower cost circuitry is the use of aluminum on Polyester (Al-PET) substrates. This material is gaining popularity and has found wide use in RFID tags, low cost LED lighting and other single-layer circuits. However, both aluminum and PET have their own constraints and require special processing to make finished circuits. Aluminum is not easy to solder components to at low temperatures and PET cannot withstand high temperatures. Soldering to these materials requires either an additional surface treatment or the use of conductive epoxy to attach components. Surface treatment of aluminum includes the likes of Electroless Nickel Immersion Gold plating (ENIG), which is extensive wet-chemistry and cost-prohibitive for mass adoption. Conductive adhesives, including Anisotropic Conductive Paste (ACP), are another alternate to soldering components. These result in component substrate interfaces that are inferior to conventional solders in terms of performance and reliability. An advanced surface treatment technology will be presented that addresses all these constraints. Once applied on Aluminum surfaces using conventional printing techniques such as screen, stencil, etc., it is cured thermally in a convection oven at low temperatures. This surface treatment is non-conductive. To attach a component, a solder bump on the component or solder printed on the treated pad is needed before placing the component. The Aluminum circuit will pass through a reflow oven, as is commonly done in PCB manufacturing. This allows for the formation of a true metal to metal bond between the solder and the aluminum on the pads. This process paves the way for large scale, low cost manufacturing of Al-PET circuits. We will also discuss details of the process used to make functional aluminum circuits, study the resultant solder-aluminum bond, shear results and SEM/ EDS analysis.
Technical Library | 2020-05-28 02:19:28.0
Properly functioning printed circuit boards are essential for both manufacturers of electronic devices and also the developers if the overall intent is for the electronic device to function at high capacity. From designing the schematics of the printed circuit boards to testing the products, there is no process of PCB manufacturing and/or assembly that can be taken for granted. While it's true that you can attempt this process on your own, especially if you are in possession of a large scale manufacturing facility, here are a few reasons why it would be a better option to opt for a professional company for PCB manufacturing and assembly. 1. Variety A professional printed circuit boards manufacturing company will be able to offer you a huge variety. You will be able to choose from rigid, flexible, or rigid-flex. What's more, the PCBs will be customized as per the need of the application. 2. Quality Professional and good printed circuit board manufacturing and assembling companies might cost you just a little bit extra but they also guarantee to produce the best results and offer very high quality products. In the end, it is quality that will make the difference between mediocre and a high functioning PCB. 3. Cost Efficiency Since you don't have to waste time or resources on buying equipment to produce the best PCBs or hiring staff to oversee the process, you can actually end up saving money. You can even save on PCB assembly cost by hiring this job out. All you have to do is to negotiate the quote and sit back, relax, and wait for the PCBs to be delivered to you. 4. Eliminate Design Flaws Design engineers hired by PCB manufacturing and assembling companies use the best graphic software to develop and test the schematics of PCBs. This increases the chances of eliminating flaws in the printed circuit boards during the initial design phase. 5. Multilayer PCB Manufacturing and Assembly The process of manufacturing and assembling multilayer PCBs is as intricate as it sounds. All processes of manufacturing and assembling multilayer PCBs require the best machines and trained technicians to pass the quality and functionality tests. Manufacturing and assembling multilayer printed circuit boards yourself is going to cost you a lot. Even the smallest of mistakes during the manufacturing and assembling process might render the entire PCB entirely useless. 6. Save Time PCBs are just a single part of the electronic device. To complete the device, many more pieces would be needed. The manufacturers of the electronic device can hire out the job of manufacturing or assembling the PCBs, which will mean they will have one less chore to do. This, in turn, will save you a lot of time which could be spent on elevating the quality of the product. 7. Experience Experience makes all the difference. It is what makes the name of any company reliable in the market. Long experience of manufacturing and assembling printed circuit boards makes the company well versed in the process and it also makes it an expert to identify design, manufacturing, assembling, and testing needs of certain applications We, at Asia Pacific Circuits, offer these benefits and so much more. For quick turn PCB assembly, PCB manufacturing and PCB designing, you can contact us anytime.
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