Technical Library | 2009-11-18 23:37:52.0
Accurate component placement is a basic requirement for any pick and place machine. The first step towards accurate placement is accurate centering, or measurement of the component’s position on the placement head. One of the most widely used centering methods for ICs, connectors, and odd‐shaped components are a camera based system that measures the component position relative to a known point. Camera based centering systems include three main elements: lighting, camera, and software. Each of these elements are critical to obtaining an accurate measurement of the component and ultimately for accurate component placement on the PCB. As the old adage goes, the system is only as strong as its weakest link.
Technical Library | 2011-09-26 03:33:31.0
How to repair flash drive documents when missing due to malicious software installations? Company presents drive recovery software to restore digital files and compressed folders from accidently formatted usb removable media drives.
Technical Library | 2019-04-04 15:39:49.0
Siemens announced today the introduction of Camstar™ Electronics Suite software, an innovative manufacturing execution system (MES) for electronics. Building on the successful enterprise-level platform for integrated circuit (IC) manufacturing, this powerful, configurable and scalable MES solution enables printed circuit board (PCB) and box assemblers to meet traceability requirements, improve efficiency levels and control manufacturing operations through direct Internet of Things (IoT) connectivity with machines and production lines.
Technical Library | 2015-06-30 16:07:12.0
Robotics for automated fluid dispensing have the ability to apply a variety of materials including epoxy, silicone, and acrylic coatings. These materials are extensively used in today’s high-speed fluid dispensers for the electronics industry. Whether a dispenser is applying epoxy or another material, the central concept for applying any form of material remains the same. Specific points of an item being dispensed onto are programmed into the dispensing system. The automated fluid dispensers software interprets the programmed information and keeps the travel path in memory. A robotic arm moves fluid dispensing nozzles along this travel path and applies epoxy onto the surface of the item with precise accuracy. Machine speed can be adjusted to emit varying amounts of epoxy. The overall application process is auto-regulating and will not be disrupted.
Technical Library | 2008-10-29 18:45:53.0
Growing demand for compact, multi-function electronics products has accelerated component miniaturization and high-density placement, creating new challenges for the electronics manufacturing industry. It is no longer adequate to simply place parts accurately per a pre-defined CAD assembly program because solder paste alignment errors are increasing for numerous reasons. The solution to this problem is a system in which the placement machine can automatically detect and compensate for misalignment of the solder paste to produce high-quality boards regardless of the process errors beforehand.
Technical Library | 2008-10-01 13:03:00.0
Many Original Equipment Manufacturers, (OEM’s), struggle to continue shipping aging or obsolete electronic products. Electronic products designed five to ten years ago are still relevant in the marketplace. Often these venerable old products have gained particular acceptance amongst a select group of customers. In many cases these old products fulfill a need in a unique manner. Examples include: designs that are grandfathered into an application due to regulatory considerations; designs having unique form-fit-and-function; designs running special software ; designs subject to contractual support and service requirements; designs in which a new contract stipulates delivery of older gear as part of a larger system offering. Any one or all of these reasons can lead an OEM to continue the production of electronic equipment well into its end of useful component life
Technical Library | 1999-05-06 14:03:04.0
This paper describes how Nikes innovative architecture addresses the expanding requirements of Intels next-generation processor designs while enabling a design environment that is more productive than one built with the previous tool generation.
Technical Library | 2015-12-14 13:40:04.0
A Manufacturing Execution System (MES) is a software program that manages and monitors production work in a factory. The MES controls and monitors all manufacturing data in real time, so there is no guesswork as to the status of any given job, machine, operator, etc. The focus is on short-interval scheduling (shift or day) with an emphasis on optimizing the distribution of work orders. Larger manufacturers have employed MES’s for years but many small to medium sized enterprises (SME’s) have yet to adopt such systems. The benefits of using an MES are many. Looking forward, I predict that even the smallest manufacturing companies will employ MES systems in the future.
Technical Library | 2009-12-09 19:28:28.0
A fundamental evaluation of a variety of approaches for designing a high-speed (10 Gb/s) serial differential electrical channel is examined. The application of the electrical interface has been simulated using HSpice software. It demonstrated how the signal quality could be affected by the use of microstrip versus stripline traces and their associated advantages and disadvantages is discussed. Example XFI channels were assembled from the simulation results to demonstrate viability of the application.
Technical Library | 2023-11-06 17:08:44.0
A new process has been developed for RF shielding on compact electronic communications devices using automated solder paste dispensing. The process is known as Shield Edge Interconnect (SEI). SEI designs enable parts to be processed though underfill before placing of the RF shield and allows more complete use of valuable PCB real estate to achieve reduced form factor requirements and/or for added components on products such as smartphones and tablets. The reduced form factor creates challenges for the assembly of those devices. This process, enabled by Speedline dispensing technology, relies on extremely accurate dispensing of solder paste on copper traces located along the outer edge of the PCB. The result is a robust process solution for SEI in which proprietary closed loop dispenser, pump, vision, and software technologies enable a high volume manufacturing (HVM) process.
