Technical Library | 2019-10-07 10:56:06.0
Power interfaces are required when external power sources like solar panels, fuel cells, or batteries are used to generate power for electrical devices. There are two major power interfaces commonly used, direct current to direct current (DC/DC) converters and direct current to alternating current (DC/AC) inverters. While both interfaces are designed to convert from variable DC inputs, they output to different power standards and power levels that are used in different applications.
Technical Library | 2017-10-05 17:13:04.0
Intermetallic compounds (IMC) in solder bonds are commonly considered critical for the reliability of interconnections. The microstructure and thermal aging characteristics of solder bonds of crystalline silicon solar cells are investigated, whereby two solders, Sn60Pb40 and a lead-free, low melting point alternative Sn41Bi57Ag2 are considered.
Technical Library | 2009-05-28 18:15:46.0
Considerable effort is ongoing to improve the efficiency and to move towards high-volume manufacturing of photovoltaic cells. Much attention has been focused on developing in-line processes to replace the current batch processes. A critical process to improve the performance of solar wafers is the application of Dopants. The basic requirement for this process is an automated method for applying a very thin, uniform film of Dopant to the silicon wafer as part of an in-line manufacturing process.
Technical Library | 2014-12-04 18:27:40.0
A review on applications of metal-based inkjet inks for printed electronics with a particular focus on inks containing metal nanoparticles, complexes and metallo-organic compounds. The review describes the preparation of such inks and obtaining conductive patterns by using various sintering methods: thermal, photonic, microwave, plasma, electrical, and chemically triggered. Various applications of metal-based inkjet inks (metallization of solar cell, RFID antennas, OLEDs, thin film transistors, electroluminescence devices) are reviewed.
Technical Library | 2021-12-16 01:52:32.0
Package on Packages (PoP) find use in applications that require high performance with increased memory density. One of the greatest benefits of PoP technology is the elimination of the expensive and challenging task of routing high-speed memory lines from under the processor chip out to memory chip in separate packages. Instead, the memory sits on top of the processor and the connections are automatically made during assembly. For this reason PoP technology has gained wide acceptance in cell phones and other mobile applications. PoP technology can be assembled using one-pass and two-pass assembly processes. In the one-pass technique the processor is first mounted to the board, the memory is mounted to the processor and the finished board is then run through the reflow oven in a single pass. The two-pass technique has an intermediate step in which the memory is first mounted onto the processor.
Technical Library | 2023-11-14 19:33:57.0
Wave soldering is an established technology and is commonly used where large unit volumes occur with low product variety. However, if a wave soldering machine is getting old or if technological changes or new PCB designs limits its manufacturing capabilities, consideration should be given to whether selective soldering would be a better choice. Anyone who deals with soldering through-hole and surface mount mixed-technology printed circuit assemblies will quickly discover that a selective soldering machine is not only less expensive that wave soldering, but selective soldering also offers the opportunity to meet customer requirements with significantly more flexibility. One such company is Thomas Preuhs GmbH. Located in Geislingen, Germany, Thomas Preuhs GmbH manufactures a variety of electronic assemblies for solar and HVAC data systems, automotive and white goods products as well as electric drive systems.
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