Technical Library | 2008-01-24 16:19:43.0
The wave solder process is characterized by a large number of process parameters. To understand them all and their interactions is challenging, particularly when it comes to lead-free soldering. Wave soldering has a number of sub-processes, which include fluxing, preheating, soldering and cooling.
Technical Library | 1999-05-07 10:38:11.0
This paper is a report of a study made to determine the maximum allowable impurities in solder used for wave soldering applications. This report concludes with a list of impurities compiled from actual analyses of solder which caused production problems. A list of recommended maximum allowable impurities will assist in establishing reliable quality controls on the purity level of the solder in a wave soldering machine.
Technical Library | 1999-05-09 12:36:40.0
The production of electronics began with hand soldering, followed by manual cleaning, which reached its peak during the NASA program. Each step in the process tended to be considered on a stand alone basis, without thought being given to the preceding and following steps. Since each step had its own set of specifications, this led to a "patchwork" approach to overall quality.
Technical Library | 2011-09-22 16:30:11.0
The remainder of this paper will deal with the adhesive cure mechanism most often found in the microelectronics industry; the thermal activation and cure of adhesives that are most commonly based on epoxy backbones. The use of heat is already prevalent in the microelectronics industry as most printed circuit board assemblies use some element of this thermal energy (reflow ovens for example) during the component soldering and assembly stage or during their burn-in stage (convection ovens).
Technical Library | 2020-04-29 03:25:11.0
1CLICKSMT has recently installed a odd form component inserting and wave soldering line for a security products manufacturer.
Technical Library | 2008-08-28 22:50:11.0
The increasing use of lead-free solder has introduced a new set of process parameters when setting up wave solder equipment for effective soldering. Determining the proper flow characteristics of the solder wave for adequate hole fill is an essential step in achieving a reliable process. A variety of solder waves exist in the industry; each with advantages and disadvantages when performing lead-free wave soldering. One way to ensure adequate hole-fill is by increasing contact time at the Chip Wave.
Technical Library | 2009-12-14 20:27:54.0
Solder paste is the most recognized form of solder used in electronics assembly today. A surface mount application depends on solder paste to attach the components to the circuit board. However, solder paste may not be the only solution. This is especially true when working with through-hole components or very large devices that require more solder than can be supplied by printed solder paste. In fact, quite often a PCB involves mixed technology that requires more than one form of solder. Solder paste is used for the surface mount components and solder preforms are utilized to attach the leads on through-hole components, avoiding wave or selective soldering.
Technical Library | 2023-11-14 19:33:57.0
Wave soldering is an established technology and is commonly used where large unit volumes occur with low product variety. However, if a wave soldering machine is getting old or if technological changes or new PCB designs limits its manufacturing capabilities, consideration should be given to whether selective soldering would be a better choice. Anyone who deals with soldering through-hole and surface mount mixed-technology printed circuit assemblies will quickly discover that a selective soldering machine is not only less expensive that wave soldering, but selective soldering also offers the opportunity to meet customer requirements with significantly more flexibility. One such company is Thomas Preuhs GmbH. Located in Geislingen, Germany, Thomas Preuhs GmbH manufactures a variety of electronic assemblies for solar and HVAC data systems, automotive and white goods products as well as electric drive systems.
Technical Library | 1999-04-15 06:56:07.0
Solder paste is a seemingly simple material that forms one of the foundations of the surface mount assembly operation. If the solder paste does not do its job correctly then first pass yield will be severely reduced.
Technical Library | 2019-07-24 23:55:32.0
Voiding is a key concern for components with thermal planes because interruptions in Z-axis continuity of the solder joint will hinder thermal transfer. When assembling components with solder paste, there is a high propensity for voiding due to the confined nature of the solder paste deposits under the component. Once reflowed, many factors contribute to the amount of voiding in a solder joint such as the reflow profile, designs of the component, board and stencil, and material factors. This study will focus on the solder paste alloy and flux combination as well as profile and board surface finishes.
