Technical Library | 2023-09-18 03:44:40.0
Unleash the art of PCB assembly with our SMT manual printers. Elevate your craftsmanship and achieve precision in solder paste application. Discover our reliable solutions today!
Technical Library | 2023-09-18 03:06:18.0
Our SMT fully automatic printers are the perfect solution for businesses of all sizes. They are designed to be high-quality, affordable, and easy to use. Our printers are equipped with the latest features and technology to ensure accurate and consistent solder paste printing. They are also easy to set up and operate, making them a great choice for businesses that are new to SMT assembly.
Technical Library | 2008-10-15 20:16:12.0
Solder paste dispensing is usually considered a slow process. Due to the speed advantages, screen printing is used to apply solder paste whenever possible. However, screen printing is not always an option. Leveraging the high speed of piezo drive technology opens the door to a broad range of solder paste dispensing applications. The ability to dispense dots under 300-μm diameter, even as small as 125 μm, enables BGA rework, small geometry deposits for miniaturized passive components, electrical connections in recessed cavities, and RF shield attach for handheld devices.
Technical Library | 2024-02-02 07:48:31.0
Maximizing Efficiency: The High-Speed SMT Line With Laser Depanelizer In today's rapidly evolving electronics manufacturing landscape, optimizing efficiency, cost-effectiveness, and precision remains paramount. Businesses engaged in producing industrial control boards, computer motherboards, mobile phone motherboards, and mining machine boards face ongoing challenges in streamlining production processes. The integration of expensive equipment strains budgets, making the creation of an efficient, cost-effective high-speed SMT line a daunting task. However, a solution exists that seamlessly combines these elements into a singular, high-performance, and cost-effective SMT line. Let's delve into the specifics. A Comprehensive High-Speed SMT Line Our innovative solution amalgamates two pivotal components: a cutting-edge SMT (Surface Mount Technology) production line and a laser cutting line equipped with a depanelizer. The SMT Production Line The high-speed SMT line comprises several essential components, each fulfilling a unique role in the manufacturing process: 1. PCB Loader: This initial stage involves loading boards onto the production line with utmost care. Our Board Loader prioritizes safety, incorporating various safety light curtains and sensors to promptly halt operations and issue alerts in case of any anomalies. 2. Laser Marking Machine: Every PCB receives a unique two-dimensional code or barcode, facilitating comprehensive traceability. Despite the high-temperature laser process potentially leading to dust accumulation on PCB surfaces, our dedicated PCB Surface Cleaner swiftly addresses this issue. 3. SMT Solder Paste Printer: This stage involves applying solder paste to the boards, a fundamental step in the manufacturing process. 4. SPI (Solder Paste Inspection): Meticulous inspections are conducted at this stage. Boards passing inspection proceed through the NG (No Good) Buffer Conveyor to the module mounters. Conversely, "No Good" results prompt storage of PCBs in the NG Buffer Conveyor, capable of accommodating up to 25 PCBs. Operators can retrieve these NG boards for rework after utilizing our specialized PCB Mis Cleaner to remove solder paste. 5. Module Mounters: These machines excel in attaching small and delicate components, necessitating precision and expertise in the module mounting process. 6. Standard Pick And Place Machines: The selection of these machines is contingent upon your specific BOM (Bill of Materials) list. 7. Pre-Reflow AOI (Automated Optical Inspection): Boards undergo examination for component quality at this stage. Detected issues prompt the Sorting Conveyor to segregate boards for rework. 8. Reflow Oven: Boards undergo reflow soldering, with our Lyra series reflow ovens recommended for their outstanding features, including nitrogen capability, flux recycling, and water cooling function, ensuring impeccable soldering results. 9. Post-Reflow AOI: This stage focuses on examining soldering quality. Detected defects prompt the Sorting Conveyor to segregate boards for further inspection or rework. Any identified defects are efficiently addressed with the BGA rework station, maintaining the highest quality standards. 10. Laser Depanelizer: Boards advance to the laser depanelizer, where precision laser cutting, often employing green light for optimal results, ensures smoke-free, highly accurate separation of boards. 11. PCB Placement Machine: Cut boards are subsequently managed by the PCB Placement Machine, arranging them as required. With this, all high-speed SMT line processes are concluded. Efficiency And Output This production line demonstrates exceptional productivity when manufacturing motherboards with approximately 3000 electronic components, boasting the potential to assemble up to 180 boards within a single hour. Such efficiency not only enhances output but also ensures cost-effectiveness and precision in your manufacturing processes. At I.C.T, we specialize in crafting customized SMT production line solutions tailored to your product and specific requirements. Our equipment complies with European safety standards and holds CE certificates. For inquiries or to explore our exemplary post-sales support, do not hesitate to contact us. The I.C.T team is here to elevate your electronics manufacturing to new heights of efficiency and cost-effectiveness.
Technical Library | 2009-05-14 13:57:43.0
Is screen printing technology able to keep pace with rising quality demands and increasingly complex board layouts? Or, is new jet printing technology ready to fill the gap? A comparison study between the two methods reveals some interesting differences. Screen printers offer some possibilities for optimizing solder paste deposits, but optimization is far easier and quicker with the jet printer. At the same time, the ability to print individualized deposits on every single pcb pad may be the ultimate answer to the growing quality challenge.
Technical Library | 2007-12-13 17:03:02.0
Printer-hosted processes for solder ball placement are now widely used for package technologies ranging from BGAs using ball diameters above 750μm to the latest WL-CSPs demanding 250μm diameter. This broadening spectrum of applications brings more choices in terms of stencil design rules and production methodologies.
Technical Library | 2014-06-05 16:44:07.0
Stencil printing capability is becoming more important as the range of component sizes assembled on a single board increases. Coupled with increased component density, solder paste sticking to the aperture sidewalls and bottom of the stencil can cause insufficient solder paste deposits and solder bridging. Yield improvement requires increased focus on stencil technology, printer capability, solder paste functionality and understencil cleaning.(...) The purpose of this research is to study the wipe sequence, wipe frequency and wipe solvent(s) and how these factors interact to provide solder paste printing yield improvement.
Technical Library | 2015-10-01 16:12:51.0
Solder paste printing is known to be one of the most difficult processes to quality assure in electronic manufacturing. The challenge increases as the technology development moves toward a mix between large modules and small chip components on large and densely populated printed circuit boards. Having a process for quality assurance of the solder paste print is fast becoming a necessity.This article describes a method to ensure quality secured data from both solder paste printers and inspection machines in electronic assembly manufacturing. This information should be used as feedback in order to improve the solder paste printing process.
Technical Library | 2016-08-04 14:33:23.0
Solder paste screen printing is known to be one of the most difficult processes to quality assure in Printed Board Assembly (PBA) manufacturing. An important process step in solder paste screen printing is the under stencil cleaning process and one of the key materials in this process is the cleaning paper1. This, often neglected, material affects the cleaning process and thereby also the print quality. It is therefore important to perform tests of different cleaning papers before one could be chosen. This article describes how cleaning papers can be tested and it also tells how big differences it can be between different materials.
Technical Library | 2010-05-12 16:21:05.0
Numerous studies have shown that greater than 60% of end of line defects in SMT assembly can be traced to solder paste and the printing process. Reflowing adds another 15% or so. In light of this fact, it is surprising that no simplified procedure for solder paste evaluation has been documented. This paper is about such a procedure.
DONGGUAN KINGSUN AUTOMATION TECHNOLOGY CO.,LTD is a company which mainly provide used and new SMT parts, provide repair SMT key parts service,new/used SMT machine trading,SMT consumables and Peripherals equipment,Clean room, ESD..
3th, Tangchang 3rd Road, Hengli, Dongguan City
Dongguan, 30 China
Phone: 8615629932323
