Technical Library | 2012-10-18 21:58:51.0
First published in the 2012 IPC APEX EXPO technical conference proceedings. In this paper, we report on a comprehensive study regarding the morphology evolution and voiding of SnAgCu solder joints on the central pad of two different packages – QFN and an Agilent package called TOPS – on PCBs with a Ni/Au surface finish.
Technical Library | 2020-10-18 19:35:05.0
Interconnect reliability especially in BGA solder joints and compliant pins are subjected to design parameters which are very critical to ensure product performance at pre-defined shipping condition and user environment. Plating thickness of compliant pin and damping mechanism of electronic system design are key successful factors for this purpose. In additional transportation and material handling process of a computer server system will be affected by shock under certain conditions. Many accessories devices in the server computer system tend to become loose resulting in poor contact or solder intermittent interconnect problems due to the shock load from the transportation and material handling processes.
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