Technical Library | 2023-11-06 17:08:44.0
A new process has been developed for RF shielding on compact electronic communications devices using automated solder paste dispensing. The process is known as Shield Edge Interconnect (SEI). SEI designs enable parts to be processed though underfill before placing of the RF shield and allows more complete use of valuable PCB real estate to achieve reduced form factor requirements and/or for added components on products such as smartphones and tablets. The reduced form factor creates challenges for the assembly of those devices. This process, enabled by Speedline dispensing technology, relies on extremely accurate dispensing of solder paste on copper traces located along the outer edge of the PCB. The result is a robust process solution for SEI in which proprietary closed loop dispenser, pump, vision, and software technologies enable a high volume manufacturing (HVM) process.
Technical Library | 2002-03-07 17:00:40.0
Electrovert problems & solutions reflow & wave soldering.
Technical Library | 2008-05-14 15:44:58.0
This paper will review some basic past and present flux chemistries that affect flux collection methodology. It will also review some of the most common flux collection methods, self-cleaning techniques, and maintenance goals. And, finally, data will be presented from high volume production testing of an advanced flux management system.
Technical Library | 2009-09-16 15:13:58.0
The dispensing industry within electronics manufacturing represents a very diverse marketplace indeed; many different materials can be applied in many different ways. One high-growth area in this market is underfill, driven by the explosive demand for hand-held devices (HHDs). This segment is comprised of popular consumer goods, such as cell phones, mp3 players, GPS navigators, PDAs, portable games and ultra-mobile PCs. A new, non-contact dispense technology, known as Streaming, has recently been introduced to specifically address the incumbent needs associated with underfill.
Technical Library | 2008-05-28 18:41:53.0
This paper describes correlation between a true 2D area measurement (e.g. printer) and a height map generated area from a SPI system. In addition, this paper will explore the correlation between area/volume measurements and bridge detection between 2D/3D techniques. The ultimate goal is to arm the process engineers with information that can be used to make decision that will impact defects, cost, throughput and Return On Investment.
Technical Library | 2008-01-16 18:25:55.0
The consumer's interest for smaller, lighter and higher performance electronics products has increased the use of ultra fine pitch packages, such as Flip Chips and Chip Scale Packages, in printed circuit board (PCB) assembly. The assembly processes for these ultra fine pitch packages are extremely complex and each step in the assembly process influences the assembly yield and reliability.
Technical Library | 2008-02-12 22:52:41.0
Corrosion of solder pots and solder pot components in wave soldering equipment has been reduced with the introduction of corrosion resistant coatings and improved lead free solder alloys. The latest trends in protecting wave solder machine components from liquid metal corrosion by lead free solder alloys will be presented in order to provide guidelines for evaluating existing equipment as well as for purchasing new systems.
Technical Library | 2010-06-17 20:48:04.0
The solder paste deposition process is viewed by many in the industry as the leading contributor of defects in the Surface Mount Technology (SMT) assembly process. As with all manufacturing processes, solder paste printing is subject to both special and common cause variation. Just like using graduated cylinders from distinctly different manufacturing processes to measure a volume of liquid, using different blades types can contribute significant special cause variation to a process. Understanding the significant differences in print performance between blade types is an important first step to establishing a standard blade for an SMT process.
Technical Library | 2010-05-06 18:46:29.0
Stencil printing technology has come a long way since the early 80’s when SMT process gained importance in the electronics packaging industry. In those early days, components were fairly large, making the board design and printing process relatively simple. The current trend in product miniaturization has led to smaller and more complex board designs. This has resulted into designs with maximum area utilization of the board space. It is not uncommon, especially for hand held devices, to find components only a few millimeters from the edge of the board. The board clamping systems used in the printing process have become a significant area of concern based on the current board design trend.
Technical Library | 2018-12-19 21:23:59.0
With the rapid trend towards miniaturization in surface mount and MEMs lid-attach technology, it is becoming increasingly challenging to dispense solder paste in ultra-fine dot applications such as those involving chip capacitors or BGA packages, as well as dispensing ultra-fine lines in MEMs lid-attach applications. In order to achieve ultra-fine dots and fine line widths while dispensing solder paste, both the solder material and dispensing equipment need to be optimized. Optimizing the equipment can be very challenging, as there are many input variables that can affect the dispense quality of the solder paste. In this paper we will evaluate the many equipment variables involved in the solder paste dispensing process, and the impact these variables have on the dispense quality of the solder paste.
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