Technical Library | 2021-01-03 19:24:52.0
Reflow soldering is the primary method for interconnecting surface mount technology (SMT) applications. Successful implementation of this process depends on whether a low defect rate can be achieved. In general, defects often can be attributed to causes rooted in all three aspects, including materials, processes, and designs. Troubleshooting of reflow soldering requires identification and elimination of root causes. Where correcting these causes may be beyond the reach of manufacturers, further optimizing the other relevant factors becomes the next best option in order to minimize the defect rate.
Technical Library | 2023-12-15 03:06:24.0
The first process in the SMT industry is solder paste printing. After the solder paste printing is completed, electronic components are attached to PCB pads through a SMT machine, and then reflow soldered. A preliminary PCB board is roughly processed. SMT is a combination of multiple devices, and such a line is called an SMT production line. Our common PCBA is processed through this process. In SMT technology, each process is very important, and poor quality can be caused by different process defects. Today, we are discussing the causes and countermeasures of SMT printing collapse.
Technical Library | 2020-04-01 14:24:56.0
It happens much too often; manufacturing engineers are brought into a NEW product design phase at the very end of a design and are asked to provide input that should have been provided much earlier. One needs to understand how the circuit board design and quality of the manufacturing process not only effects assembly yield and product reliability, but how it could also affect the results of any testing that is done to circuit packs during prototyping. It is important that any circuit pack (including prototypes) that will be used in reliability, performance and functional testing be designed with the proper features and assembled with a manufacturing process that has been developed to produce a high-quality assembly. If not, the results of any testing might not represent the actual characteristics of the design and provide miss-guidance to future changes.
Technical Library | 2023-09-16 06:12:26.0
Discover our cost-effective wave soldering machine designed to streamline your PCB assembly process without breaking the bank. Achieve quality soldering with affordability.
Technical Library | 2023-09-16 06:29:26.0
Explore our range of reflow ovens designed to streamline your PCB assembly process. Achieve consistent and high-quality soldering for your electronic components.
Technical Library | 2019-08-08 10:23:51.0
High mix production is the mainstay of many electronics assembly plants. Lot sizes and board complexities vary and the boards are often mixed technology, comprising a blend of both surface mount and through-hole technology. Modularizing a production line enables a clear distinction between one type of assembly process and another. This article assumes a modern factory where a job can be routed to the selective soldering machine module, the hand assembly bench, or a combination of both. The decision rules of routing a circuit board through hand assembly versus automated selective soldering are discussed. Hand assembly soldering operations require no explanation.
Technical Library | 2023-09-13 13:10:06.0
Pneumatic stencil cleaning machines are a great way to improve the efficiency and effectiveness of your stencil cleaning process. These machines use compressed air to remove contaminants and debris from stencils, which can cause defects and reliability issues.
Technical Library | 2023-09-13 13:07:16.0
Pneumatic stencil cleaning machines are a great way to improve the efficiency and effectiveness of your stencil cleaning process. These machines use compressed air to remove contaminants and debris from stencils, which can cause defects and reliability issues.
Technical Library | 2023-09-13 13:03:25.0
SMT auto aqueous stencil cleaning machines are an essential tool for any SMT production line. These machines use a variety of methods to remove contaminants and debris from SMT stencils, which can cause defects and reliability issues.
Technical Library | 2019-05-29 23:10:30.0
There are times when a PCB prototype needs to be built quickly to test out a design. In such cases where it is known early on that there will be multiple iterations or that a "one and done" assembly will be made that there will be some SMT assemblers who choose to hand print solder paste onto the board using a "frameless" stencil. In such cases where hand printing is used, the consistency of the printing technique has typically been in question. Furthermore, the effectiveness of both the nanocoatings as well as the higher end stainless steel materials, which have been heretofore studied in controlled printing environments, will be evaluated for their impact on the hand printing process.The purpose of the study was to determine the effectiveness of select nanocoating materials as well as certain high end stainless steel stencil materials as they relate to the manual SMT printing process. A variety of nanocoatings were applied to SMT metal stencils and solder paste volume measurements were taken to compare the effectiveness.
