Technical Library | 2023-09-18 03:40:02.0
Our SMT intelligent solder paste supply system is the perfect solution for businesses that need to improve the accuracy and consistency of their SMT paste printing. Our system uses the latest technology to automatically dispense the correct amount of solder paste to each stencil opening, ensuring that your SMT assemblies are consistently high-quality.
Technical Library | 2007-02-01 09:36:26.0
Purpose: Compare the Surface Insulation Resistance of reworked BGA Test samples made with standard solder balls using a flux only reattachment and samples made including the StencilQuik™ product from Best Inc. with solder balls using a flux only reattachment.
Technical Library | 2019-05-29 23:10:30.0
There are times when a PCB prototype needs to be built quickly to test out a design. In such cases where it is known early on that there will be multiple iterations or that a "one and done" assembly will be made that there will be some SMT assemblers who choose to hand print solder paste onto the board using a "frameless" stencil. In such cases where hand printing is used, the consistency of the printing technique has typically been in question. Furthermore, the effectiveness of both the nanocoatings as well as the higher end stainless steel materials, which have been heretofore studied in controlled printing environments, will be evaluated for their impact on the hand printing process.The purpose of the study was to determine the effectiveness of select nanocoating materials as well as certain high end stainless steel stencil materials as they relate to the manual SMT printing process. A variety of nanocoatings were applied to SMT metal stencils and solder paste volume measurements were taken to compare the effectiveness.
Technical Library | 2013-07-03 10:31:54.0
It has been demonstrated in numerous pieces of work that stencil printing, one of the most complex PCB assembly processes, is one of the largest contributors to defects (Revelino et el). This complexity extends to prototype builds where a small number of boards need to be assembled quickly and reliably. Stencil printing is becoming increasingly challenging as packages shrink in size, increase in lead count and require closer lead spacing (finer pitch). Prototype SMT assembly can be further divided between industrial and commercial work and the DIYer, hobbyist or researcher groups. This second group is highly price sensitive when it comes to the materials used for the board assembly as their funds are sourced from personal or research monies as opposed to company funds. This has led to development of a lower cost SMT printing stencil made from plastic film as opposed to the more traditional stainless steel stencil used by industrial and commercial users.This study compares the performance of these two traditional materials and their respective impact on solder paste printing including efficiency and print quality.
Technical Library | 2007-01-31 15:17:04.0
The goal of this project is to evaluate the reliability of lead-free BGA solder joints with a variety of different pad sizes using several different BGA rework methods. These methods included BGAs reworked with both flux only and solder paste attachment techniques and with or without the use of the BEST stay in place StencilQuick™. The daisy chained test boards were placed into a thermal test chamber and cycled between -25ºC to 125ºC over a 30 minute cycle with a 30 minute dwell on each end of the cycle. Each BGA on the board was wired and the continuity assessed during the 1000 cycles the test samples were in the chamber.
Technical Library | 2007-02-01 10:08:40.0
The increased replacement of high lead count SMT devices with BGAs and other high ball count area array packages has brought increased challenges to PCB rework and repair. Often solder mask areas surrounding BGA pad areas are damaged when components are removed.
Technical Library | 2022-07-11 09:24:48.0
The change of squeegee pressure has a significant impact on printing. Too small pressure will make the solder paste unable to effectively reach the bottom of the stencil opening and not be well deposited on the pad. Too much pressure will cause tin The paste is printed too thin and can even damage the stencil.
Technical Library | 2014-03-13 15:25:01.0
A student competition paper at Budapest University of Technology And Economics, Department of Electronics Technology gives background, covers stencil design and discusses stencils intended for pin in paste application. The stencil applied for depositing the solder paste is a thin, 75–200 µm thick metal foil, on which apertures are formed according to the solder pads on the printed circuit board. Stencil printing provides a fast, mass solder paste deposition process; relatively expensive, appropriate and recommended for mass production.
Technical Library | 2015-08-25 13:51:27.0
The stencil printing process is one of the most critical processes in the electronic production. Due to the requirement: "faster and smaller" it is necessary to place components with different paste volume close together without regard to solder paste printing. In our days it is no longer possible to control the solder paste volume only by adjustment of the aperture dimensions. The requirements of solder paste volumes for specific components are realized by different thicknesses of metal sheets in one stencil with so called step stencils. The step-down stencil is required when it is desirable to print fine-pitch devices using a thinner stencil foil, but print other devices using a thicker stencil foil. The paper presents the innovative technology of step-up and step-down stencils in a laser cutting and laser welding process. The step-up/step-down stencil is a special development for the adjustment of solder paste quantity, fulfilling the needs of placement and soldering. This includes the laser cutting and laser welding process as well as the resulting stencil characteristics and the potential of the printing process.
Technical Library | 2013-03-12 13:25:18.0
High density and miniaturized circuit assemblies challenge the solder paste printing process. The use of small components such as 0201, 01005 and μBGA devices require good paste release to prevent solder paste bridging and misalignment. When placing these miniaturized components, taller paste deposits are often required. To improve solder paste deposition, a nano-coating is applied to laser cut stencils to improve transfer efficiency. One concern is the compatibility of the nano-coating with cleaning agents used in understencil wipe and stencil cleaning. The purpose of this research is to test the chemical compatibility of common cleaning agents used in understencil wipe and stencil cleaning processes.Compatibility of Cleaning Agents With Nano-Coated Stencils
