Technical Library | 1999-08-27 09:18:58.0
A need to move beyond aerosol sprays and dipping leads to a development that answers tough requirements for controlled coverage, low waste, and environmental restrictions.
Technical Library | 1999-08-27 09:29:49.0
Contract packaging houses have to contend with a large mix of die types and products. Flexibility and quick turnaround of package types is a must in this industry. Traditional methods of die encapsulation, (i.e., use of transfer-molding techniques), are only cost effective when producing a large number of components. Liquid encapsulants now provide similar levels of reliability1, and are cost effective...
Technical Library | 1999-07-21 09:04:04.0
A high volume manufacturer of printed circuit boards (PCBs) had attempted for many years to locate an adhesive that was robust enough to meet their manufacturing needs. This proved to be a challenge because they needed the adhesive to accommodate a wide range of different dispensing equipment and board designs. The two key performance criteria required from the adhesive were dispensability and adhesion...
Technical Library | 1999-08-05 09:34:44.0
This document demonstrates a sequential process of evaluating automated wafer instruments and discusses why this approach is useful for studying instruments that have automation features such as loading and focusing mechanisms. The methodology specifies a series of experiments consisting of two or more capability studies followed by a stability study. Each experiment achieves a separate goal, yet combines with the others in providing information needed to assess the usefulness of the instrument.
Technical Library | 2008-11-06 02:17:59.0
For many years Acoustic Micro Imaging (AMI) techniques have been utilized to evaluate the quality of the underfill used to support the solder bump interconnections of Flip Chip type devices. AMI has been established as one of the few techniques that can provide reliability and quality control data, but little has been done to automate the evaluation process for Flip Chip underfill until now.
Technical Library | 2014-06-26 16:43:12.0
Edgebond adhesives have been widely used by the industry for improving the shock performance of area array packages. Most of the studies focus on the impact of material properties, such as coefficient of thermal expansion (CTE) and glass transition temperature (Tg), on reliability at room temperature. However, the operating temperature of a component on the printed circuit board bonded with edgebond adhesive can be close to or exceed Tg of the adhesive, where the material properties may be very different than at room temperature.
Technical Library | 2009-10-08 01:58:04.0
In the present study, we report novel ferroelectric-epoxy based polymer nanocomposites that have the potential to surpass conventional composites to produce thin film capacitors over large surface areas, having high capacitance density and low loss. Specifically, novel crack resistant and easy to handle Resin Coated Copper Capacitive (RC3) nanocomposites capable of providing bulk decoupling capacitance for a conventional power-power core, or for a three layer Voltage-Ground-Voltage type power core, is described.
Technical Library | 2019-05-15 22:26:02.0
As the demand for higher routing density and transfer speed increases, Via-In-Pad Plated Over (VIPPO) has become more common on high-end telecommunications products. The interactions of VIPPO with other features used on a PCB such as the traditional dog-bone pad design could induce solder joints to separate during the second and thereafter reflows. The failure has been successfully reproduced, and the typical failure signature of a joint separation has been summarized.To better understand the solder separation mechanism, this study focuses on designing a test vehicle to address the following three perspectives: PCB material properties, specifically the Z-direction or out-of-plane Coefficient of Thermal Expansion (CTE); PCB thickness and back drill depth; and quantification of the driving force magnitude beyond which the separation is due to occur.
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