Technical Library | 2013-11-27 16:54:01.0
The need in complexity for microwave space products such as active BFNs (Beam Forming Networks) is increasing, with a significantly growing number of amplitude / phase control points (number of beams * numbers of radiating elements). As a consequence, the RF component’s package topology is evolving (larger number of I/Os, interconnections densification ...) which directly affect the routing and architecture of the multilayer boards they are mounted on. It then becomes necessary to improve the density of these boards (...) This paper will present the work performed to achieve LCP-based high density multilayer structures, describing the different electrical and technological breadboards manufactured and tested and presenting the results obtained.
Technical Library | 2013-12-11 23:24:32.0
Today's analyses of electronics reliability at the system level typically use a "black box approach", with relatively poor understanding of the behaviors and performances of such "black boxes" and how they physically and electrically interact (...) The incorporation of more rigorous and more informative approaches and techniques needs to better understand (...) Understanding the Physics of Failure (PoF) is imperative. It is a formalized and structured approach to Failure Analysis/Forensics Engineering that focuses on total learning and not only fixing a particular current problem (...) In this paper we will present an explanation of various physical models that could be deployed through this method, namely, wire bond failures; thermo-mechanical fatigue; and vibration.
Technical Library | 2017-12-21 11:24:05.0
The present work concerns on the use of sensors to monitor the structural health of wind turbine . Conventionally the inspection was made using non-contact sensing during the turbine’s inoperable period hence loss occurred. A real -time monitoring system via embedded wireless sensor is preferred but the sensor could only be implanted using non-contact printing method due to most turbine blade s’ curved surface. Conductive ink associate d with non-contact printing method via fluid dispensing system are proposed since conductive inks are proven stretchable and fluid dispensing system enables printing on various substrates and works well with any materials...
Technical Library | 2018-01-11 10:48:48.0
Ink-jet printing is poised to impact the manufacturing of devices that are particularly attractive for flexible electronics, as more suitable and printable fluids become available. The addition of surfacants in the preparation of the inks usually results in additional process steps, potentially increasing cost, as well as material waste, where the surfactants also often have a negative impact on specific properties of the printed features, such as comprising electrical conductivity of metallic structures. (...)In this work, we have successfully formulated a suitable ink derived from a mixture of terpineolin cyclohexanone as a more environmentally friendly option for the exfoliation of bulk graphite, which we elaborate upon in more detail here.
Technical Library | 2022-01-05 23:10:11.0
Waste electrical and electronic equipment or e-waste generation has been skyrocketing over the last decades. This poses waste management and value recovery challenges, especially in developing countries. Printed circuit boards (PCBs) are mainly employed in value recovery operations. Despite the high energy costs of generating crushed and milled particles of the order of several microns, those are employed in conventional hydrometallurgical techniques. Coarse PCB pieces (of order a few centimetres) based value recovery operations are not reported at the industrial scale as the complexities of the internal structure of PCBs limit efficient metal and non-metal separation.
Technical Library | 2023-03-13 19:12:56.0
Printed electronics (PE) is impacting almost every branch of manufacturing. The printing of electronics on mechanically flexible substrates such as plastic, paper and textile, using traditional printing techniques, provides novel applications for wearable and stretchable electronics. Government sponsored consortiums, universities, contract printers, startups and global manufacturers are developing processes to bring this technology to market faster, more costeffectively and at scale. By increasing the speed of technology adoption while following industrialization best practices, industry researchers aim to create processes that ramp up the scale of production for simple circuits and integrated conductive structures.
Technical Library | 2009-10-08 01:58:04.0
In the present study, we report novel ferroelectric-epoxy based polymer nanocomposites that have the potential to surpass conventional composites to produce thin film capacitors over large surface areas, having high capacitance density and low loss. Specifically, novel crack resistant and easy to handle Resin Coated Copper Capacitive (RC3) nanocomposites capable of providing bulk decoupling capacitance for a conventional power-power core, or for a three layer Voltage-Ground-Voltage type power core, is described.
Technical Library | 2021-02-25 14:19:00.0
This study proposes a new design of lightweight and cost-e#14;cient composite materials for the aeronautic industry utilizing recycled fresh scrap rubber, epoxy resin, and graphene nanoplatelets (GnPs). After manufacturing the composites, their bending strength and fracture characteristics were investigated by three-point bending (3PB) tests. Halpin–Tsai homogenization adapted to composites containing GnPs was used to estimate the moduli of the composites, and satisfactory agreement with the 3PB test results was observed.
Technical Library | 2022-02-09 17:52:47.0
This article presents the first time that an millimeter-wave (mm-wave) multichip module (MCM) with on-demand "smart" encapsulation has been fabricated utilizing additive manufacturing technologies. RF and dc interconnects were fabricated using inkjet printing, while the encapsulation was realized using 3-D printing. Inkjet-printed interconnects feature superior RF performance, better mechanical reliability, and on-demand, low-cost fabrication process.
Technical Library | 2017-04-28 07:53:37.0
A major drawback to Industry 4.0 that few write about is maintenance of an industry 4.0 plant. The maintenance aspect is a much greater and immediate drawback than even the commonly known major concern of security, and the lesser concern of system integration standards. Maintenance of 4.0 systems has, and will continue to result in related huge increases in process downtime. The barriers to overcoming the maintenance/downtime drawbacks of a 4.0 system are almost insurmountable. Has the Smart Manufacturing Leadership Coalition (SMLC) addressed the maintenance paradox? “... model also demands the ability to calculate and manage risk and uncertainty within very different operating structures. ..” Continue reading in pdf or for even more see and share http://bin95.com/Industry40inUSA.htm
