Technical Library | 1999-05-06 14:39:20.0
ntelís traditional microprocessor test methodology, based on manually generated functional tests that are applied at speed using functional testers, is facing serious challenges due to the rising cost of manual test generation and the increasing cost of high-speed testers. If current trends continue, the cost of testing a device could exceed the cost of manufacturing it. We therefore need to rely more on automatic test pattern generation (ATPG) and low-cost structural testers.
Technical Library | 1999-07-21 09:00:55.0
Isotropic conductive adhesives are typically silver filled epoxy resins. Electronics assemblers have evaluated these materials for a variety of unique interconnect applications. The goal is a conductive polymer that exhibits similar reliability and performance to traditional solder while offering the benefits of a polymer structure such as low temperature processing and good thermal stability as well as the ability to bond a variety of substrates.
Technical Library | 2007-10-25 18:39:07.0
More and more substrate designs require signals paths that can handle multi-gigahertz frequencies [1-3]. The challenges for organic substrates, in meeting these electrical requirements, include using high-speed, low-loss materials, manufacturing precise structures and making a reliable finished product. A new substrate technology is presented that addresses these challenges.
Technical Library | 2009-01-01 16:37:38.0
Recent technology advancement has enabled enhancement in PWB electrical performance and wiring density. These innovations have taken the form of improved materials, novel PWB interconnect structures, and manufacturing technology. One such advancement is Z-axis conductive interconnect. The Z-interconnect technology involves building mini-substrates of 2 or 3 layers each, then assembling several mini-substrates together using conductive paste.
Technical Library | 2009-04-30 18:06:24.0
This presentation surveys the most significant via and via-related laminate failure mechanisms from past to present using data from current induced thermal cycling (CITC) testing, failure analysis, and other sources. The relative life and failure modes of thru vias, buried vias, and microvias (stacked vs. non-stacked) are compared, along with the affect of structure, materials, and peak temperatures on the above. The origin of via-induced laminate failures such as "eyebrow cracks" and Pb free related internal delamination is also explored.
Technical Library | 2012-12-12 03:17:51.0
When we designed the PCB equipments, we should try to simplify crcuit and structure design that on the premise of ensuring the equipments to meet the technology and performance, In modern society, modules design (MD)is a effective measures to improved the pcb equipment reliability. The system were made up simpleness functions of modules to reducing the complexity of the design. Both domestic and abroad, a large number of facts have proved this point, MD was a best choice for PCB equipment design.
Technical Library | 2013-03-21 21:24:49.0
This paper explores the behaviour of a copper test vehicle with multiple reflowed solder joints, which has direct relevance to ball grid arrays (BGA) and high density interconnect structures. The paper explores the relative stress conditions on the distributed joints and the sensitivity to ball joint shape... First published in the 2012 IPC APEX EXPO technical conference proceedings
Technical Library | 2020-03-12 13:10:35.0
The electronics industry is further progressing in terms of smaller, faster, smarter and more efficient electronic devices. This continuous evolving environment caused the development on various electrolytic copper processes for different applications over the past several decades. (...) This paper describes the reasons for development and a roadmap of dimensions for copper filled through holes, microvias and other copper plated structures on PCBs.
Technical Library | 2021-03-18 20:07:08.0
X-ray tomography is a promising technique that can provide micron level, internal structure, and three dimensional (3D) information of an integrated circuit (IC) component without the need for serial sectioning or decapsulation. This is especially useful for counterfeit IC detection as demonstrated by recent work. Although the components remain physically intact during tomography, the effect of radiation on the electrical functionality is not yet fully investigated. In this paper we analyze the impact of X-ray tomography on the reliability of ICs with different fabrication technologies.
Technical Library | 2021-12-28 01:34:06.0
PLC (Programmable Logic Controller) and VFD (Variable Frequency Drive) play an important role in industrial production and technological development. They have been widely used in the field of industrial automation and mechanical automation. The control of the PLC and VFD is quite intelligent and automated, which brings great convenience to industrial production and life. The PLC and VFD will perform intelligent calculation, control and output according to the predetermined program. Today we will focus on how the PLC and the VFD communicate, and in what ways? First, let's take a look at their respective basic structures.
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