Technical Library | 2020-12-24 02:34:23.0
The advance in technology and its relentless development is delivering yet another surface mount assembly challenge. To meet the market demand for products with higher functionality whilst reducing the overall product size, the next generation of chip package is being readied upon the surface mount community. The Metric 0201 will have dimensions in the order of 0.25mm x 0.125mm, as a result the entire assembly process will be questioned as to its ability to deliver high volume/quality product.
Technical Library | 2023-05-10 01:39:38.0
DPC (DirectPlatingCopper) thin film process is a method of prepare copper film using magnetron sputtering technology. This process is a process in which the copper target with the target material is placed in a true cavity chamber, and plasma is generated on the copper target surface by magnetron sputtering technology. The ions in the plasma are bombarded on the surface of the target, which is sputtered into fine particles and deposited on the substrate to form a copper film.
Technical Library | 2017-07-27 16:51:57.0
Reliability Expectations of Highly Dense Electronic Assemblies is commonly validated using Ion Chromatography and Surface Insulation Resistance. Surface Insulation Resistance tests resistance drops on both cleaned and non-cleaned circuit assemblies. It is well documented in the literature that SIR detects ionic residue and the potential of this residue to cause leakage currents in the presence of humidity and bias. Residues under leadless components are hard to inspect for and to ensure flux residue is totally removed. The question many assemblers consider is the risk of residues that may still be present under the body of components.
Technical Library | 2020-03-26 14:55:29.0
This paper introduces line confocal technology that was recently developed to characterize 3D features of various surface and material types at sub-micron resolution. It enables automatic microtopographic 3D imaging of challenging objects that are difficult or impossible to scan with traditional methods, such as machine vision or laser triangulation.Examples of well-suited applications for line confocal technology include glossy, mirror-like, transparent and multi-layered surfaces made of metals (connector pins, conductor traces, solder bumps etc.), polymers (adhesives, enclosures, coatings, etc.), ceramics (components, substrates, etc.) and glass (display panels, etc.). Line confocal sensors operate at high speed and can be used to scan fast-moving surfaces in real-time as well as stationary product samples in the laboratory. The operational principle of the line confocal method and its strengths and limitations are discussed.Three metrology applications for the technology in electronics product manufacturing are examined: 1. 3D imaging of etched PCBs for micro-etched copper surface roughness and cross-sectional profile and width of etched traces/pads. 2. Thickness, width and surface roughness measurement of conductive ink features and substrates in printed electronics applications. 3. 3D imaging of adhesive dots and lines for shape, dimensions and volume in PCB and product assembly applications.
Technical Library | 2011-12-22 16:45:49.0
This paper reports the feasibility of using surface mount adhesives to produce low temperature microchannel arrays in a wide variety of metals. Sheet metal embossing and chemical etching processes have been used to produce sealing bosses that eliminate ch
OSU School of Mechanical, Industrial, and Manufacturing Engineering (MIME)
Technical Library | 1999-05-09 12:51:38.0
This Technical Note outlines, step by step, the easiest ways to remove and replace surface mounted devices, using the lowest possible temperatures. This document discusses the following topics: Removal and replacement of discrete and passive components (capacitors, resistors, SOTs), Removal of two-sided components (SOICs, SOJs, TSOPs), Removal of quad components (PLCCs, QFPs), Replacement of quad components including fine-pitched devices.
Technical Library | 2022-03-16 19:41:17.0
Creep corrosion occurs in electronics assemblies and it is reminiscent to electromigration but does not require electrical field to drive the reaction. Corrosive elements and moisture must be present for creep corrosion to occur. Sulfur is the most prominent element to cause creep corrosion in environments such as paper mills, rubber manufacturing, mining, cement manufacturing, waste water treatment etc., also including companies and locations nearby such industries. The main part of printed circuit board assembly (PCBA) to be affected is the PCB surface finish. Especially immersion silver is prone to creep corrosion, but it sometimes occurs in NiPd (lead frames), and to a lesser extent in ENIG and OSP surface finishes. As the use of immersion silver is increasing as PCB surface finish and electronics are more and more used in harsh environments, creep corrosion is a growing risk. In this paper we will present the driving forces and mechanisms as well as suitable tests and mitigation strategies against creep corrosion
Technical Library | 2013-08-29 19:52:43.0
Au over Ni on Cu is a widely used printed circuit board (PCB) surface finish, under bump metallization (UBM), and component lead metallization. It is generally accepted that less than 3 wt.% Au in Sn-Pb solder joints inhibits formation of detrimental intermetallic compounds (IMC). However, the critical limit for Au content in Pb-free solder joints is not well established. Three surface-mount package platforms, one with a matte Sn surface finish and the others with Ni/Au finish, were soldered to Ni/Au-finished PCB using Sn-3.0Ag 0.5Cu (SAC305) solder, in a realistic manufacturing setting. The assembled boards were divided into three groups: one without any thermal treatment, one subjected to isothermal aging at 125°C for 30 days, and the third group aged at 125°C for 56 days...
Technical Library | 2011-12-29 17:33:21.0
2011 IPC APEX EXPO Conference Article: Surface mount area arrays (SMAA) have been in existence for decades and are increasingly becoming more important as printed circuit board (PCB) assemblies become further complex with package miniaturization and densi
Technical Library | 2013-07-18 12:12:40.0
Lead-free nanosolders have shown promise in nanowire and nanoelectronics assembly. Among various important parameters, melting is the most fundamental property affecting the assembly process. Here we report that the melting behavior of tin and tin/silver nanowires and nanorods can be significantly affected by the surface oxide of nanosolders.
Department of Chemical Engineering, University of Massachusetts
