Technical Library: suspension (Page 1 of 1)

Simulation of Droplet Jetting of a Non-Newtonian Mixed Suspension

Technical Library | 2021-06-15 18:40:53.0

The jet printing of a dense mixed non-Newtonian suspension is based on the rapid displacement of fluid through a nozzle, the forming of a droplet and eventually the break-off of the filament. The ability to model this process would facilitate the development of future jetting devices. The purpose of this study is to propose a novel simulation framework and to show that it captures the main effects such as droplet shape, volume and speed. In the framework, the time dependent flow and the fluid-structure interaction between the suspension, the moving piston and the deflection of the jetting head is simulated. The system is modelled as a two phase system with the surrounding air being one phase and the dense suspension the other. Hence, the non-Newtonian suspension is modelled as a mixed single phase with properties determined from material testing. The simulations were performed with two coupled in-house solvers developed at Fraunhofer-Chalmers Centre; IBOFlow, a multiphase flow solver and LaStFEM, a large strain FEM solver. Jetting behaviour was shown to be affected not only by piston motion and fluid rheology, but also by the energy loss in the jetting head. The simulation results were compared to experimental data obtained from an industrial jetting head.

Fraunhofer-Chalmers Research Centre for Industustrial Mathematics

Study of the Rheological Behaviors of Solder Pastes

Technical Library | 2018-11-06 12:42:25.0

Solder paste is a homogeneous, stable suspension of solder powder particles suspended in a flux binder, and is one of the most important process materials today in surface mount technology (SMT). By varying the solder particle size, distribution and shape, as well as the other constituent materials, the rheology and printing performance of solder pastes can be controlled. Paste flow behavior is very important in defining the printing performance of any paste.The purpose of this paper is to study the rheological behavior of SAC (Sn-Ag-Cu) solder paste used for surface mount applications in the electronic industry. The reason why the rheological tests are presented in this paper are two critical sub-processes: aperture filling and paste withdraw. In this paper, we report on the investigation of the rheological profiles, the serrated cone-to-plate system was found as effective in parameter minimizing the wall-slip effect

Technical University of Košice

  1  

suspension searches for Companies, Equipment, Machines, Suppliers & Information

convection smt reflow ovens

Software for SMT placement & AOI - Free Download.
Sell Used SMT & Test Equipment

Training online, at your facility, or at one of our worldwide training centers"
Voidless Reflow Soldering

High Resolution Fast Speed Industrial Cameras.
High Throughput Reflow Oven

Easily dispense fine pitch components with ±25µm positioning accuracy.
Hot selling SMT spare parts and professional SMT machine solutions

Internet marketing services for manufacturing companies