Technical Library: tape (Page 1 of 2)

SMT Pick and Place Machine Feeder common types from KINGSUN

Technical Library | 2023-08-18 03:28:47.0

Today, KINGSUN shares with you the common types and classifications of SMT mounters. 一、According to the feeding method, common ones include: 1.Tape Feeder 2.Tray Feeder  3.Tube Feeder  4.Stick Feeder   5.Special Vibration Feeder 二、According to the classification of electric and non electric, the common ones are electric feeder and mechanical feeder. Yamaha's SIGMA SMT machines are all electric feeders, while many of JUKI's feeder are mechanical feeders...... Regarding feeders related knowledge, KINGSUN share with you here , hoping to be helpful to you. More information about Products please Contact US at jenny@ksunsmt.com or visit www.ksunsmt.com . "DONGGUAN KINGSUN AUTOMATION TECHNOLOGY CO.,LTD" is a leading SMT automation equipment factory provider in China. With many years of profound experience accumulation, we provides comprehensive solutions for global customers with strong resources and high-quality professional technical team.

DONGGUAN KINGSUN AUTOMATION TECHNOLOGY CO.,LTD

Advantages of PET carrier tape

Technical Library | 2019-09-17 02:37:31.0

1.PET carrier tape. It has outstanding mechanical function, and the impact strength is 3~5 times that of other films, and the folding resistance is good.

Shenzhen Sewate Technology Co.,Ltd

Carrier tape introduction and classification

Technical Library | 2019-07-27 07:13:16.0

Carrier Tape refers to a strip product used in the field of electronic packaging, which has a specific thickness, and equidistantly distributes holes (also called pockets) for holding electronic components in the longitudinal direction thereof. Positioning hole for index positioning.

Shenzhen Sewate Technology Co.,Ltd

How to deal with the carrier tape and the cover tape sealing crack

Technical Library | 2019-08-14 08:27:46.0

There are five forms of carrier tape sealing cracking. In particular, it is more important to seal products such as IC components (IC tape carriers) and lighter and thinner LED components (LED tape carriers).

Shenzhen Sewate Technology Co.,Ltd

What is the difference between the carrier tape and the cover tape?

Technical Library | 2019-09-03 09:52:53.0

The cover tape and the carrier tape are two different products, and many people cannot distinguish the difference between the cover tape and the carrier tape.

Shenzhen Sewate Technology Co.,Ltd

Kapton Tape

Technical Library | 2024-09-30 15:10:24.0

Article information on what Kapton tape is and how different industries utilize it.

A-Laser, Inc.

What are the packaging forms of electronic components

Technical Library | 2021-12-31 06:09:47.0

The packaging method of surface mount components has become an important part of the SMT system. It directly affects the efficiency of assembly production and must be optimized in combination with the type and number of feeders of the SMT machine. There are four main types of packaging for surface mount components, Tape, tube, tray and bulk.

Shenzhen Sewate Technology Co.,Ltd

Pushing the barriers of wafer level device integration: High-speed assembly, the case for MicroTape.

Technical Library | 2009-01-21 23:01:49.0

Over the last 10 years, the adoption of wafer-level packaging (WLP) has expanded to a wide range of semiconductor devices applied in a crosssection of industries from Automotive to Mobile Phone, Sensors to Medical Technology.

Siemens Process Industries and Drives

Parasitic Extraction for Deep Submicron and Ultra-deep Submicron Designs

Technical Library | 1999-08-09 11:36:27.0

Shrinking process technologies and increasing design sizes continually challenge design methodologies and EDA tools to develop at an ever-increasing rate. Before the complexities of deep submicron (DSM), gate and transistor delays dominated interconnect delays, and enabled simplified design methodologies that could focus on device analysis. The advent of DSM processes is changing all of this, invalidating assumptions and approximations that existing design methodologies are based upon, and forcing design teams to re-tool. High-capacity parasitic extraction tools are now critical for successful design tape-outs.

Cadence Design Systems, Inc.

Dispensing Thermally Conductive Materials

Technical Library | 2022-09-29 14:08:42.0

Electronic vehicles, devices and components must not overheat, otherwise they may fail to operate correctly. Thermal management is a major technical challenge as components are getting smaller, power densities are increasing and demands on robustness and reliability are becoming more stringent. To prevent power losses or defects resulting from overheating, liquid thermal interface materials (TIMs) are being increasingly used to dissipate their heat. This White Paper discusses the aspects that need to be taken into account when dispensing these mostly highly viscous, highly abrasive materials and why in many cases they are better alternatives to pads, tapes and foils.

Scheugenpflug Inc.

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