Technical Library: technologically services ccga (Page 2 of 3)

Soldering Faster At Lower Temperatures: A Performance Comparison

Technical Library | 1999-05-09 13:14:02.0

Studies and tests of comparative soldering iron thermal performance at low temperatures - Metcal direct power soldering technology compared to conventional stored energy soldering irons from leading manufacturers.

Metcal

Printed Circuit Board (PCB) Technology for Electrochemical Sensors and Sensing Platforms

Technical Library | 2021-02-17 22:13:39.0

The development of various biosensors has revolutionized the healthcare industry by providing rapid and reliable detection capability. Printed circuit board (PCB) technology has a well-established industry widely available around the world. In addition to electronics, this technology has been utilized to fabricate electrical parts, including electrodes for different biological and chemical sensors. High reproducibility achieved through long-lasting standard processes and low-cost resulting from an abundance of competitive manufacturing services makes this fabrication method a prime candidate for patterning electrodes and electrical parts of biosensors. The adoption of this approach in the fabrication of sensing platforms facilitates the integration of electronics and microfluidics with biosensors. In this review paper, the underlying principles and advances of printed board circuit technology are discussed. In addition, an overview of recent advancements in the development of PCB-based biosensors is provided. Finally, the challenges and outlook of PCB-based sensors are elaborated. doi:10.3390/bios10110159

Louisiana State University

Effect of Soldering Parameters on Reaction Kinetics and Phase Transformations of SAC 305 Solder

Technical Library | 2010-07-08 19:56:15.0

As technology becomes increasingly reliant on electronics, understanding the reliability of lead-free solder also becomes increasingly important. This research project focused on phase transformation kinetics with the lead-free solder SAC 305. Today in the electronics industry, SAC 305 is the most widely used solder, making it a high priority to understand its long-term stability and performance in a variety of service conditions. Recent evidence has shifted the focus from thermal aging to reflow temperature and time above liquidus values during initial solder melting.

Radiance Technologies

High Temperature Ceramic Capacitors for Deep Well Applications

Technical Library | 2015-01-22 17:32:27.0

Temperature requirements for ceramic capacitors have increased significantly with recent advances in deep-well drilling technology. Increasing demand for oil and natural gas has driven the technology to deeper and deeper deposits resulting in extreme temperature environments up to 200°C and above. A novel capacitor solution utilizing temperature-stable base-metal electrode capacitors in a molded and leaded package addresses the growing market high temperature demands of (1) capacitance stability, (2) long service life, and (3) mechanical durability. A range of high temperature C0G capacitors capable of meeting this 200°C and above high temperature environment has been developed. This paper will review the electrical, reliability, and mechanical performance of this new capacitor solution

KEMET Electronics Corporation

Manufacturing Considerations When Implementing Voc-Free Flux Technology

Technical Library | 1999-05-07 11:44:26.0

In 1990 the United States Environmental Protection Agency Issued the Clean Air Act. The Clean Air Act and subsequent amendments are designed to limit the use of chemicals that contain volatile organic compounds (VOCs). The document goes into great detail setting limits for allowable VOC emissions for different industries.

Kester

Mechanical stress test for component solder joints and bonding wires

Technical Library | 2016-08-24 06:15:35.0

From consumer electronics to systems control, automotive technology to aviation and aerospace – today, electronics are absolutely essential in many sectors. They increasingly replace mechanical components, eliminating wear and tear and thereby extending the service life. What is easily forgotten in this regard is that electronics are also subject to the laws of mechanics. Mechanical test equipment is crucial to test components for the secure hold of welded, soldered or adhesive bonds. A new, mechanically intricate test probe with universal clamping jaws, that can even grasp the individual bonding wires, is in line with the trend toward ever smaller components. Serving as an actuator for these is a micro drive that can be precisely controlled using a miniaturised motion controller to relieve the control unit in the test device.

XYZTEC bv

New Life for Aging Electronic Products

Technical Library | 2008-10-01 13:03:00.0

Many Original Equipment Manufacturers, (OEM’s), struggle to continue shipping aging or obsolete electronic products. Electronic products designed five to ten years ago are still relevant in the marketplace. Often these venerable old products have gained particular acceptance amongst a select group of customers. In many cases these old products fulfill a need in a unique manner. Examples include: designs that are grandfathered into an application due to regulatory considerations; designs having unique form-fit-and-function; designs running special software ; designs subject to contractual support and service requirements; designs in which a new contract stipulates delivery of older gear as part of a larger system offering. Any one or all of these reasons can lead an OEM to continue the production of electronic equipment well into its end of useful component life

Orchid Technologies Engineering & Consulting, Inc.

How Reshoring Drives Profitability

Technical Library | 2016-05-05 15:19:39.0

For many years, manufacturing has sought to increase competitiveness by moving off-shore to countries with lower labour costs. Electronic manufacturing services (EMS) companies provided an essential element to make off-shore transfer happen more quickly, offering further cost reduction opportunities from load balancing. Fierce arguments were put forward to protect the loss of local jobs, although the result was, in almost all cases, inevitable. Today, however, the whole market of PCBbased electronics products has changed significantly. The "pros" of off-shoring are no longer what they once were, and the "cons" are becoming more significant because off-shore manufacturing can no longer satisfy the needs of the market. In this paper, we expose the real costs of off-shore manufacturing, and put labour cost differentials into perspective. We demonstrate how practically, using existing technologies, re-shored manufacturing can yield better business return, either for an OEM, or through EMS providers.

Mentor Graphics

Duo-Solvent Cleaning Process Development for Removing Flux Residue from Class 3 Hardware

Technical Library | 2016-07-28 17:00:20.0

Packaging trends enable disruptive technologies. The miniaturization of components reduces the distance between conductive paths. Cleanliness of electronic hardware based on the service exposure of electrical equipment and controls can improve the reliability and cost effectiveness of the entire system. Problems resulting from leakage currents and electrochemical migration lead to unintended power disruption and intermittent performance problems due to corrosion issues.Solvent cleaning has a long history of use for cleaning electronic hardware. Limitations with solvent based cleaning agents due to environmental effects and the ability to clean new flux designs commonly used to join miniaturized components has limited the use of solvent cleaning processes for cleaning electronic hardware. To address these limitations, new solvent cleaning agents and processes have been designed to clean highly dense electronic hardware.The research study will evaluate the cleaning and electrical performance using the IPC B-52 Test Vehicle. Lead Free noclean solder paste will be used to join the components to the test vehicle. Ion Chromatography and SIR values will be reported.

KYZEN Corporation

Cold Ball Pull Test Efficiency for the PCB Pad Cratering Validation with the Ultra Low Loss Dielectric Material

Technical Library | 2019-05-08 21:52:28.0

Cold ball pull testing is used to validate the resistance of PCB pad cratering for the different ultra-low loss dielectrics materials (Dk=3~4.2 and Df

iNEMI (International Electronics Manufacturing Initiative)


technologically services ccga searches for Companies, Equipment, Machines, Suppliers & Information

SMTAI 2024 - SMTA International

High Precision Fluid Dispensers
Blackfox IPC Training & Certification

Software programs for SMT placement and AOI Inspection machines from CAD or Gerber.
Baja Bid Auction JUL 9-10, 2024

Have you found a solution to REDUCE DISPENSE REWORK? Your answer is here.