Technical Library | 2012-12-14 14:17:56.0
This article provides practical and affordable Design-for- Test (DFT) and Design-for-Inspection (DFI) methods that will have a positive impact on product costs, yield, reliability, and time-to-market. The properties of testability (including controllability and observability) will be analysed as they relate to analogue and digital design rules and their cause/effect, as well as the electrical and physical characteristics of proper PCB design.
Technical Library | 2012-12-26 14:18:24.0
Passive components including resistors, capacitors, inductors, and circuit-protection devices compose the highest percentage of all devices that are populated on today’s PCB assemblies. However, the successful isolation and testing of these components during ICT is perhaps the most challenging and the least understood of all modern-day validation practices.
Technical Library | 2013-08-07 21:52:15.0
PCB architectures have continued their steep trend toward greater complexities and higher component densities. For quality control managers and test technicians, the consequence is significant. Their ability to electrically test these products is compounded with each new generation. Probe access to high density boards loaded with micro BGAs using a conventional in-circuit (bed-of-nails) test system is greatly reduced. The challenges and complexity of creating a comprehensive functional test program have all but assured that functional test will not fill the widening gap. This explains why sales of automated-optical and automated X-ray inspection (AOI and AXI) equipment have dramatically risen...
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