Technical Library: test engineer (Page 1 of 3)

SMT Stencil Design And Consideration Base on IPC

Technical Library | 2010-03-23 11:50:22.0

This document discuss how to design SMT stencil base on IPC-7525. Introduction: PCBA (Printed Circuit Board Assembly) is a segment of printed circuit board technology. This segment of printed circuit board industry is concentrated in assemble all the pieces of electronic industry to one piece before output them to market. This segment covers: interconnection technology, package design technology, system integration technology, board and system test technology

Association Connecting Electronics Industries (IPC)

High Speed IC Chip Programming Machine

Technical Library | 2023-11-25 07:46:13.0

In the dynamic realm of Surface Mount Technology (SMT), where efficiency and precision are paramount, I.C.T, a renowned SMT equipment manufacturer, proudly unveils its latest innovation – the I.C.T-910 Automatic IC Programming System. Crafted to cater to the intricate demands of SMD chip programming, this cutting-edge device vows to redefine your programming experience and elevate production capabilities. Programming system.png The Power of IC Programming System: As a beacon of excellence in IC Programming Systems, the I.C.T-910 seamlessly integrates advanced technology with user-friendly features. This system empowers manufacturers in the SMT industry, offering versatility in programming needs by accommodating a wide range of SMD chips. Precision Programming: The I.C.T-910 boasts unparalleled precision in programming SMD chips, ensuring accuracy in every generated code. In the SMT industry, where even the slightest error can lead to setbacks, this precision is indispensable. Efficiency Redefined: Accelerate your production timelines with the I.C.T-910's efficient programming capabilities. Engineered to optimize workflows, this system ensures rapid programming without compromising quality, recognizing that time is money in the SMT industry. User-Friendly Interface: Navigating the complexities of IC programming is simplified with the I.C.T-910's intuitive user interface. Operators, even without extensive programming expertise, can harness the system's power, minimizing the learning curve and maximizing productivity. Compatibility and Adaptability: The I.C.T-910 breaks free from limitations, supporting a wide array of SMD chip models. It is a versatile solution for diverse programming requirements, allowing you to stay ahead of technological advancements. Why Choose I.C.T-910 IC Programming System? 8 sets of 32-64sit burners Nozzle: 4pcs Camera: 2pcs (Component camera + Marking camera) UPH: 2000-3000PCS/H Package type: PLCC, JLCC, SOIC, QFP, TQFP, PQFP, VQFP, TSOP, SOP, TSOPII, PSOP, TSSOP, SON, EBGA, FBGA, VFBGA, BGA, CSP, SCSP, and so on. Compatibility: Adapters provided based on customer products. Simple operation interface: Modular and layered interface with pictures and texts for easy operation. System upgrade: Free software upgrade service. Reliability: Trust in the I.C.T-910, a programming system that prioritizes reliability. Rigorous testing ensures consistent and dependable performance, reducing the risk of programming errors and downtime. Elevate Your Competitiveness: Incorporate the I.C.T-910 into your production line to elevate competitiveness in the market. Stay ahead with a programming system designed to meet the demands of the fast-paced SMT industry. Embrace the Future with I.C.T-910: In a landscape where precision, efficiency, and adaptability are non-negotiable, the I.C.T-910 Automatic IC Programming System emerges as the game-changer for SMT manufacturers. Revolutionize your programming processes, enhance productivity, and future-proof your operations with the I.C.T-910. Choose I.C.T-910 and stay ahead in the SMT industry, ushering in the next era of IC programming excellence.

I.C.T ( Dongguan ICT Technology Co., Ltd. )

BGA Thermal Shock Testing

Technical Library | 2007-02-01 09:27:47.0

The purpose of the testing was to compare the resistance and check for open circuit conditions of reworked BGA test samples made with and without StencilQuik™ after 500 thermal shock cycles. StencilQuick™ is a product of Best Inc. In this series of tests, the resistance of daisy chain resistance patterns running between the BGA and test board after exposure to thermal shock was measured.

BEST Inc.

Surface Insulation Resistance (SIR) Testing

Technical Library | 2007-02-01 09:36:26.0

Purpose: Compare the Surface Insulation Resistance of reworked BGA Test samples made with standard solder balls using a flux only reattachment and samples made including the StencilQuik™ product from Best Inc. with solder balls using a flux only reattachment.

BEST Inc.

Introduction to Automated Test Fixtures

Technical Library | 2022-05-02 21:35:53.0

Testing of electronic assemblies involves three elements: the device under test, test equipment, and fixturing to make the connections between them. The challenge for a test engineer building a sophisticated test system is that instrumentation may need to measure thousands of test points through the mechanical interconnect.

Circuit Check, Inc.

Maintenance and operation of walk-in temperature humidity test chamber

Technical Library | 2019-11-17 22:46:45.0

Overview of walk-in temperature and humidity chamber: It also belongs to environmental test equipment, it tests whether the product can resist high temperature, low temperature, humidity, or the physical and chemical changes produced under extreme conditions, the walk-in temperature and humidity chamber volume is large, the product is placed, or a large object can be placed, such as automobile, new energy, television and liquid crystal screen, etc. How to do the routine maintenance of the walk-in temperature and humidity chamber: 1. The wet gauze basically, if there is no special case, s/b usually changed once in 3 months 2. The water channel shall be regularly cleaned, including water cup, water tank, etc., so as to prevent the water from being blocked,affect the humidity test. 3. It is forbidden to test the flammable and explosive products inside working room. 4. Clean the chamber on a regular basis 2. How to operate walk-in temperature and humidity chamber: The operation method is same as standard temperature humidity test chamber,the controller is 7-inch LCD programmable color screen, you only need to setthe temperature point---test time--how many cycles need to be tested, This can be done automatically, and the machine will stop automatically when it is complete. If there is any problem during the operation, the corresponding problem point will be displayed on the machine control screen. Walk-in temperature and humidity chamber is a must equipment for reliability test of Automobile,Aerospace,Electronic parts,etc,the operation and maintenance are easy,it is teh tear down mahcine,Climatest engineers will be dispatched to do on-site support,for instance,we will finish commissioning,train customers how to operate,maintain,welcome to follow our company facebook page:https://www.facebook.com/Climatechambers

Symor Instrument Equipment Co.,Ltd

Design for Testability (DFT) to Overcome Functional Board Test Complexities in Manufacturing Test

Technical Library | 2018-06-20 13:11:57.0

Manufacturers test to ensure that the product is built correctly. Shorts, opens, wrong or incorrectly inserted components, even catastrophically faulty components need to be flagged, found and repaired. When all such faults are removed, however, functional faults may still exist at normal operating speed, or even at lower speeds. Functional board test (FBT) is still required, a process that still relies on test engineers’ understanding of circuit functionality and manually developed test procedures. While functional automatic test equipment (ATE) has been reduced considerably in price, FBT test costs have not been arrested. In fact, FBT is a huge undertaking that can take several weeks or months of test engineering development, unacceptably stretching time to market. The alternative, of selling products that have not undergone comprehensive FBT is equally, if not more, intolerable.

A.T.E. Solutions, Inc.

The Long-term Shaping of the JTAG/Boundary-scan Standards

Technical Library | 2015-05-11 21:27:52.0

Originating from the last millenium, almost three decades ago, the introduction of surface mount packaging triggered a wave of changes throughout many aspects of electronics production. A small number of talented, innovative test engineers from various big players of the industry started to attend meetings to discuss the impact of that change of technology on their future test concepts for modern assemblies. The Joint Test Action Group was born.

JTAG Technologies B. V.

Testing Prototype Assembled PCBs — Who Should Do It?

Technical Library | 2017-06-29 15:41:36.0

What's the most cost-effective method for testing prototype PCBs? Should the assembler do it, or the client's in-house engineers? This article explains all.

Power Design Services

Redundancy and High-Volume Manufacturing Methods

Technical Library | 1999-05-07 10:16:31.0

This paper will describe practical aspects of a redundancy implementation on a high-volume cache memory product. Topics covered include various aspects of redundancy from a design and product engineering perspective; and present test development methods for future product implementations.

Intel Corporation

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