Technical Library: thermo couple wire (Page 1 of 1)

Using Physics of Failure to Predict System Level Reliability for Avionic Electronics

Technical Library | 2013-12-11 23:24:32.0

Today's analyses of electronics reliability at the system level typically use a "black box approach", with relatively poor understanding of the behaviors and performances of such "black boxes" and how they physically and electrically interact (...) The incorporation of more rigorous and more informative approaches and techniques needs to better understand (...) Understanding the Physics of Failure (PoF) is imperative. It is a formalized and structured approach to Failure Analysis/Forensics Engineering that focuses on total learning and not only fixing a particular current problem (...) In this paper we will present an explanation of various physical models that could be deployed through this method, namely, wire bond failures; thermo-mechanical fatigue; and vibration.

DfR Solutions (acquired by ANSYS Inc)

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