Technical Library: today 2011 (Page 1 of 1)

Package Converter Compliments Chip Obsolescence

Technical Library | 2011-05-26 19:26:12.0

The Semiconductor industry enabling today’s electronics market place is widely disseminated between multiple customer factions such as consumer electronics, telecommunications, automotive, medical devices, military, aerospace, industrial controls, embedde

Ironwood Electronics

Manufacturing Substrates with Embedded Passives

Technical Library | 2011-05-05 16:17:34.0

Passives account for a very large part of today’s electronic assemblies. This is particularly true for digital products such as cellular phones, camcorders, and computers. Market pressures for new products with more features, smaller size and lower cost v

i3 Electronics

Using Flexible Circuits as an Electronic Interconnection... Do's and Don'ts

Technical Library | 2011-11-16 22:11:58.0

Flexible Circuits are proven, reliable interconnect solutions for many of today's electronic packages. This article gives some general guidelines in terms of "dos" and "don'ts" that will help the engineer or designer make better decisions when using flex

All Flex Flexible Circuits, LLC

Manufacturability & Reliability Challenges with Leadless Near Chip Scale (LNCSP) Packages in Pb-Free Processes

Technical Library | 2011-10-27 18:03:53.0

Leadless, near chip scale packages (LNCSP) like the quad flat pack no lead (QFN) are the fastest growing package types in the electronics industry today. Early LNCSPs were fairly straightforward components with small overall dimensions, a single outer row

DfR Solutions (acquired by ANSYS Inc)

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