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Thermal Cycle Reliability Study of Vapor Phase BGA Solder Joints

Technical Library | 2012-09-13 20:45:17.0

First published in the 2012 IPC APEX EXPO technical conference proceedings. Prior to committing production boards to vapor phase soldering, we performed an evaluation to assess reliability and evaluate the vacuum soldering option. The reliability of vapor

Agilent Technologies, Inc.

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