Technical Library | 2021-12-31 06:09:47.0
The packaging method of surface mount components has become an important part of the SMT system. It directly affects the efficiency of assembly production and must be optimized in combination with the type and number of feeders of the SMT machine. There are four main types of packaging for surface mount components, Tape, tube, tray and bulk.
Technical Library | 1999-08-05 10:52:56.0
This technology transfer was prepared by the Research Triangle Institute (RTI) as part of SEMATECH's Facility Fluids Project (S100). It is a compilation of information on existing facility fluids metric and test methods. Information on standard methods was gathered from SEMATECH and SEMI. Other information was obtained from a literature search of journals and conference proceedings. The published information primarily is concerned with the test equipment used and what levels of detection and purity were found. Many of the articles discussed the use of new equipment, either commercial or experimental. Extensive annotated bibliographies are append to the report.
Technical Library | 2022-06-20 21:01:37.0
We've been doing a lot of print testing in our lab. In our first set of published results, "The Impact of Reduced Solder Alloy Powder Size on Solder Paste Print Performance1" from IPC/APEX 2016, we revealed a hierarchy of input variables to maximize solder paste transfer efficiency and minimize variation. In that study, we used a fully-optioned stencil as part of the equipment set. In order to tease out the data we were looking for, we could not lose critical information to the noise of stencil-induced variations.
Technical Library | 2013-04-12 08:20:15.0
There is much to read about the shifting sands of electronics manufacturing, including current moves by OEMs to alter their EMS relationships to better mitigate risk and cost, while EMS companies look for additional ways in which to adjust their business models in an attempt to improve their profitability. Electronics outsourcing over time evolved from a means to buffer manufacturing demand fluctuations into a wide scale shift in capabilities, in part in order to deal with vastly shorter product life cycles. Following the global economic crash of 2000, aka “the internet bubble,” more and more EMS providers responded by transferring their manufacturing to low cost labour regions, and in particular China.
Technical Library | 2020-07-02 13:29:37.0
Industry standards such as J-STD-005 and JIS Z 3284-1994 call for the use of viscosity measurement(s) as a quality assurance test method for solder paste. Almost all solder paste produced and sold use a viscosity range at a single shear rate as part of the pass-fail criteria for shipment and customer acceptance respectively. As had been reported many times, an estimated 80% of the defects associated with the surface mount technology process involve defects created during the printing process. Viscosity at a single shear rate could predict a fatal flaw in the printability of a solder paste sample. However, false positive single shear rate viscosity readings are not unknown.
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