Technical Library | 2020-12-02 20:36:54.0
Industry 4.0 is a topic of much discussion within the electronics manufacturing industry. Manufacturers and vendors are trying to come to terms with what that means. In the most simplistic of terms, Industry 4.0 is a trend toward automation and data exchange within the manufacturing process. This basically requires connectivity and communication from machine to machine within the manufacturing line. The challenge is to collect data from each of the systems within the line and make that data available to the rest of the machines. Without test and inspection, there is no Industry 4.0. The whole purpose of test and inspection is to collect actionable data that may be used to reduce defects and maximize efficiency within the manufacturing line. The goal is to minimize scrap and get a really good handle on those process parameters that need to be put in place to manufacture products the right way the first time. For maximum efficiency, three inspection systems are required within the production line. These are solder paste inspection (SPI) post-solder deposition, automated optical inspection (AOI) post-placement, and AOI post-reflow. This requires a substantial investment; however, the combination of all three inspection machines is really the only true way to provide feedback for each stage of the manufacturing process.
Technical Library | 2012-11-12 14:06:48.0
With consumers constantly looking for lower prices on their technology products and manufacturers trying to squeak out higher margins from their production lines, the need for process control and lower overhead costs have become even more important. One sector that is often overlooked is the hand soldering area of the factory. Many factories have been struggling with antiquated soldering systems for years. In some cases they are trying to make their investment in stations last much longer than they were designed for, or they are falsely trying to recoup their original investment ‐ all at the cost of higher operating expenses or even worse, reduced operator thru‐put.
Technical Library | 2015-05-27 11:47:47.0
It goes without saying that manufacturing companies want the highest possible quality at the lowest possible cost. These days, everyone is trying to do more with less in order to stay relevant in a competitive environment.
Technical Library | 2017-12-12 01:43:55.0
In recent years, more and more companies with SMT production floor are trying to become more efficient and cut production costs. In most cases, the treatment was carried out problematic processes that visible and easy to find. Now these companies came to look problematic processes that are invisible and hard to find.
Technical Library | 2010-05-20 17:17:03.0
As several industry pundits have expressed in recent years: "the era of 'one test method fits all' seems well behind us." For most test managers with even a modest mix of products, trying to formulate a test policy/philosophy has become a tricky balancing act at the best of times. James Stanbridge, Sales Manager UK for JTAG Technologies, and Steve Lees Managing Director of ATE Solutions look at the options.
Technical Library | 2012-12-12 03:17:51.0
When we designed the PCB equipments, we should try to simplify crcuit and structure design that on the premise of ensuring the equipments to meet the technology and performance, In modern society, modules design (MD)is a effective measures to improved the pcb equipment reliability. The system were made up simpleness functions of modules to reducing the complexity of the design. Both domestic and abroad, a large number of facts have proved this point, MD was a best choice for PCB equipment design.
Technical Library | 2006-10-26 08:08:00.0
There have been many studies of the causes of tombstoning; some published, some not. They tend to focus on a single process parameter as the root cause of tombstoning. However, there is no single process change that is a sure cure for tombstoning! Those that claim otherwise are either uninformed or trying to sell you something. Rather than limiting your view to a single solution, EFD recommends you heed all of the studies. Like pieces of a puzzle, each study does not reveal the whole picture, but looked at all together, the picture is clear.
Technical Library | 2015-12-02 18:32:50.0
(Thermal Compression with Non-Conductive Paste Underfill) Method.The companies writing this paper have jointly developed Copper (Cu) Pillar micro-bump and TCNCP(Thermal Compression with Non-Conductive Paste) technology over the last two+ years. The Cu Pillar micro-bump and TCNCP is one of the platform technologies, which is essentially required for 2.5D/3D chip stacking as well as cost effective SFF (small form factor) package enablement.Although the baseline packaging process methodology for a normal pad pitch (i.e. inline 50μm) within smaller chip size (i.e. 100 mm2) has been established and are in use for HVM production, there are several challenges to be addressed for further development for commercialization of finer bump pitch with larger die (i.e. ≤50μm tri-tier bond pad with the die larger than 400mm2).This paper will address the key challenges of each field, such as the Cu trace design on a substrate for robust micro-joint reliability, TCNCP technology, and substrate technology (i.e. structure, surface finish). Technical recommendations based on the lessons learned from a series of process experimentation will be provided, as well. Finally, this technology has been used for the successful launching of the company FPGA products with SFF packaging technology.
Technical Library | 2023-04-17 21:17:59.0
The purpose of this paper is to evaluate and compare the effectiveness and sensitivity of different cleanliness verification tests for post soldered printed circuit board assemblies (PCBAs) to provide an understanding of current industry practice for ionic contamination detection limits. Design/methodology/approach – PCBAs were subjected to different flux residue cleaning dwell times and cleanliness levels were verified with resistivity of solvent extract, critical cleanliness control (C3) test, and ion chromatography analyses to provide results capable of differentiating different sensitivity levels for each test. Findings – This study provides an understanding of current industry practice for ionic contamination detection using verification tests with different detection sensitivity levels. Some of the available cleanliness monitoring systems, particularly at critical areas of circuitry that are prone to product failure and residue entrapment, may have been overlooked. Research limitations/implications – Only Sn/Pb, clean type flux residue was evaluated. Thus, the current study was not an all encompassing project that is representative of other chemistry-based flux residues. Practical implications – The paper provides a reference that can be used to determine the most suitable and effective verification test for the detection of ionic contamination on PCBAs. Originality/value – Flux residue-related problems have long existed in the industry. The findings presented in this paper give a basic understanding to PCBA manufacturers when they are trying to choose the most suitable and effective verification test for the detection of ionic contamination on their products. Hence, the negative impact of flux residue on the respective product's long-term reliability and performance can be minimized and monitored effectively.
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