Technical Library | 2021-09-02 08:17:07.0
We are a professional manufacturer of PCB depaneling machines, which is workable for all boards, including flex and regid boards, v-scored boards and routed boards. Laser pcb depaneling is non-contact way without mechanical stress,this solution is good for modern precision PCB depaneling. It has below advantages: 1. No dust The production environment of the circuit board industry is carried out in the dust-free workshop. The traditional pcb depaneling equipment, such as blade moving type machine, will inevitably produce residues and micro powder, which will pollute the 10000 and 1000 class dust-free workshops and affect the conductivity of products. The UV laser PCB cutting machine is a vaporization processing process, which will not produce dust and is conducive to the conductivity of the product. 2. High cutting precision The processing gap of high-precision traditional processing equipment can not reach the gap width of less than 100 microns, which will cause certain damage to the lines on the edge or PCBA circuit board containing components. The focus spot of the laser cutting machine is small, and the ultraviolet cold processing mode has little thermal impact on the edge of the circuit board. The cutting position accuracy is less than 50 microns, and the cutting size accuracy is less than 30 microns, which will not affect the edge of the circuit board, and the precision is high. 3. No stress Traditional processing methods generally have V-grooves, which will cause certain damage to the board in the manufacturing process. The UV laser PCB cutting machine can directly cut the bare board without making V-grooves. In addition, the traditional processing methods directly use tools to act on the circuit board, especially the stamping method has a great impact on the circuit board, which is easy to cause board deformation. The laser cutting machine is a non-contact processing mode, which acts on the surface of the material through the high-energy beam, which will not cause the influence of stress and the deformation and damage of the circuit board. 4. For special-shaped cutting, it is easy to automate The UV laser PCB cutting machine can cut for any shape without replacing any props and fixtures, and without steel mesh. The same equipment can meet special-shaped and straight-line cutting, which is easy to realize assembly line automatic production and high flexibility. It is easy to improve production efficiency and save production process and production cycle. In particular, it can quickly and efficiently meet the needs of rapid proofing, directly import the drawing, and then locate the cutting. 5. High compatibility The UV laser PCB cutting machine can process the materials around the circuit board, such as PCB, FPC, covering film, pet, reinforcing board, IC, ultra-thin metal cutting, etc. it has strong practicability, is compatible with the processing of a variety of materials, is easy to operate, can be imported into the drawing, does not need to adjust any mechanical parts, and is easy to operate and maintain. 6. Good cutting edge effect The cutting edge is smooth and neat without burr. It can be processed and formed directly according to the size of the drawing, which is conducive to improving the yield of the product. It can be directly installed into the subsequent process without further processing. For more details about UV laser depaneling, please feel free to contact us. www.pcbdepanelingrouter.com
Technical Library | 2011-01-20 19:50:30.0
This article introduces the technical development that went in to realizing an 80-layer ultra-multilayer printed circuit board, which meets the market demand for a "semiconductor test board supporting memory increases".
Technical Library | 2019-05-08 21:52:28.0
Cold ball pull testing is used to validate the resistance of PCB pad cratering for the different ultra-low loss dielectrics materials (Dk=3~4.2 and Df
Technical Library | 2008-01-16 18:25:55.0
The consumer's interest for smaller, lighter and higher performance electronics products has increased the use of ultra fine pitch packages, such as Flip Chips and Chip Scale Packages, in printed circuit board (PCB) assembly. The assembly processes for these ultra fine pitch packages are extremely complex and each step in the assembly process influences the assembly yield and reliability.
Technical Library | 2018-12-19 21:23:59.0
With the rapid trend towards miniaturization in surface mount and MEMs lid-attach technology, it is becoming increasingly challenging to dispense solder paste in ultra-fine dot applications such as those involving chip capacitors or BGA packages, as well as dispensing ultra-fine lines in MEMs lid-attach applications. In order to achieve ultra-fine dots and fine line widths while dispensing solder paste, both the solder material and dispensing equipment need to be optimized. Optimizing the equipment can be very challenging, as there are many input variables that can affect the dispense quality of the solder paste. In this paper we will evaluate the many equipment variables involved in the solder paste dispensing process, and the impact these variables have on the dispense quality of the solder paste.
Technical Library | 2010-03-25 06:26:37.0
The complexity of Printed Circuit Assembly process is increasing day by day and causing productivity issues in the industry, introducing ultra fine pitch components (pitch less than 15mil) in PCA is a challenge to minimize risk of defects as solder short, dry solder. This paper is focusing on minimizing these defects.
Technical Library | 2021-04-01 14:40:08.0
We demonstrate the viability of using ultra-thin sheets of microbially grown nanocellulose to build functional medical sensors. Microbially grown nanocellulose is an interesting alternative to plastics, as it is hydrophilic, biocompatible, porous, and hydrogen bonding, thereby allowing the potential development of new application routes. Exploiting
Technical Library | 2022-10-31 09:05:54.0
Warranty: 3 Months Precision: High Precision Certification: CE，ROHS Wight: 1kg Automatic Grade: Automatic Trademark: Ultra High-speed Chip Mounter High Light: 00345186, 00345186 smt pick and place parts, 00345186 SMT Spare Parts
Technical Library | 1999-05-07 08:50:40.0
To enable transistor scaling into the 21st century, new solutions such as high dielectric constaConventional scaling of gate oxide thickness, source/drain extension (SDE), junction depths, and gate lengths have enabled MOS gate dimensions to be reduced from 10mm in the 1970’s to a present day size of 0.1mm. To enable transistor scaling into the 21st century, new solutions such as high dielectric constant materials for gate insulation and shallow, ultra low resistivity junctions need to be developed. In this paper, for the first time, key scaling limits are quantified for MOS transistorsnt materials for gate insulation and shallow, ultra low resistivity junctions need to be developed.
Technical Library | 2020-01-15 23:54:34.0
Flexible electronics has significantly advanced over the last few years, as devices and circuits from nanoscale structures to printed thin films have started to appear. Simultaneously, the demand for high-performance electronics has also increased because flexible and compact integrated circuits are needed to obtain fully flexible electronic systems. It is challenging to obtain flexible and compact integrated circuits as the silicon based CMOS electronics, which is currently the industry standard for high-performance, is planar and the brittle nature of silicon makes bendability difficult. For this reason, the ultra-thin chips from silicon is gaining interest. This review provides an in-depth analysis of various approaches for obtaining ultra-thin chips from rigid silicon wafer. The comprehensive study presented here includes analysis of ultra-thin chips properties such as the electrical, thermal, optical and mechanical properties, stress modelling, and packaging techniques. The underpinning advances in areas such as sensing, computing, data storage, and energy have been discussed along with several emerging applications (e.g., wearable systems, m-Health, smart cities and Internet of Things etc.) they will enable. This paper is targeted to the readers working in the field of integrated circuits on thin and bendable silicon; but it can be of broad interest to everyone working in the field of flexible electronics.
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