Technical Library | 2017-06-15 00:44:19.0
Ceramics packages are being used in the electronics industry to operate the devices in harsh environments. In this paper we report a study on acoustic imaging technology for nondestructively inspecting underfill layers connecting organic interposers sandwiched between two ceramics substrates.First, we inspected the samples with transmission mode of scanning acoustic tomography (SAT) system, an inspection routine usually employed in assembly lines because of its simpler interpretation criteria: flawed region blocks the acoustic wave and appears darker. In this multilayer sample, this approach does not offer the crucial information at which layer of underfill has flaws. To resolve this issue, we use C-Mode Scanning in reflection mode to image layer by layer utilizing ultrasound frequencies from 15MHz to 120MHz. Although the sample is thick and contains at least 5 internal material interfaces, we are able to identify defective underfill layer interfaces.
Technical Library | 2016-04-28 14:43:23.0
Underfilling is a long-standing process issued from the micro-electronics that can enhance the robustness and the reliability of first or second-level interconnects for a variety of electronic applications. Its usage is currently spreading across the industry fueled by the decreasing reliability margins induced by the miniaturization and interconnect pitch reduction. (...) This paper will address the control of surface mount under filled assemblies, focusing on applicable inspection techniques and possible options to overcome their limitations.
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