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Assembly And Reliability Issues Associated With Leadless Chip Scale Packages

Technical Library | 2006-10-02 14:26:47.0

This paper addresses the assembly and reliability of 0.5 mm pitch leadless Chip Scale Packages (CSP) on .062" immersion Ag plated printed circuit boards (PCB) using Pb-free solder paste. Four different leadless CSP designs were studied and each was evaluated using multiple PCB attachment pad designs.

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Technical Library: universal instruments 72 mm multi pitch (Page 1 of 1)

Assembly And Reliability Issues Associated With Leadless Chip Scale Packages

universal instruments 72 mm multi pitch searches for Companies, Equipment, Machines, Suppliers & Information