Technical Library | 2015-08-25 13:51:27.0
The stencil printing process is one of the most critical processes in the electronic production. Due to the requirement: "faster and smaller" it is necessary to place components with different paste volume close together without regard to solder paste printing. In our days it is no longer possible to control the solder paste volume only by adjustment of the aperture dimensions. The requirements of solder paste volumes for specific components are realized by different thicknesses of metal sheets in one stencil with so called step stencils. The step-down stencil is required when it is desirable to print fine-pitch devices using a thinner stencil foil, but print other devices using a thicker stencil foil. The paper presents the innovative technology of step-up and step-down stencils in a laser cutting and laser welding process. The step-up/step-down stencil is a special development for the adjustment of solder paste quantity, fulfilling the needs of placement and soldering. This includes the laser cutting and laser welding process as well as the resulting stencil characteristics and the potential of the printing process.
Technical Library | 2021-11-22 20:39:44.0
Quality control is a key activity performed by manufacturing companies to verify product conformance to the requirements and specifications. Standardized quality control ensures that all the products are evaluated under the same criteria. The decreased cost of sensors and connectivity enabled an increasing digitalization of manufacturing and provided greater data availability. Such data availability has spurred the development of artificial intelligence models, which allow higher degrees of automation and reduced bias when inspecting the products. Furthermore, the increased speed of inspection reduces overall costs and time required for defect inspection. In this research, we compare five streaming machine learning algorithms applied to visual defect inspection with real world data provided by Philips Consumer Lifestyle BV. Furthermore, we compare them in a streaming active learning context, which reduces the data labeling effort in a real-world context. Our results show that active learning reduces the data labeling effort by almost 15% on average for the worst case, while keeping an acceptable classification performance. The use of machine learning models for automated visual inspection are expected to speed up the quality inspection up to 40%.
Technical Library | 2009-11-05 11:17:32.0
Head-in-pillow (HiP), also known as ball-and-socket, is a solder joint defect where the solder paste deposit wets the pad, but does not fully wet the ball. This results in a solder joint with enough of a connection to have electrical integrity, but lacking sufficient mechanical strength. Due to the lack of solder joint strength, these components may fail with very little mechanical or thermal stress. This potentially costly defect is not usually detected in functional testing, and only shows up as a failure in the field after the assembly has been exposed to some physical or thermal stress.
Technical Library | 2009-12-23 16:55:08.0
Leading up to the development of lead-free soldering alloys, Horizontal Convection* was developed for the reflow process. Getting the correct temperature profile, with the narrow process window in lead-free applications, is now more important than ever. In each chamber or zone, air is circulated toward one side of the oven above the PCB and toward the opposite side of the oven below the PCB, forming a cyclone around the board. The forced air circulation results in a uniform temperature profile along the entire circuit board assembly. This technology is ideal for the precise profiles needed for lead free soldering.
Technical Library | 2016-08-04 10:34:35.0
With the onset of 1900’s, the novelty of printed circuits boards got started with a profound concept of constructing an electrical path on an isolated surface of a board. The initial trend of printed circuit board got into a vain to develop and upgrade the radios and gramophones. Gradually the notion of ‘Through Hole Technique’ came into picture to produce a double sided PCB. In mid 1990’s the idea of auto assembly process was introduced by PCB Manufacturer USA. This was a point of modern touch to enhance the fabrication process with automated soldering technique. The research and development picked up a pace for end to end electronic solutions for defense and US army.
Technical Library | 2019-08-15 13:31:52.0
Cracks in ceramic chip capacitors can be introduced at any process step during surface mount assembly. Thermal shock has become a "pat" answer for all of these cracks, but about 75 to 80% originate from other sources. These sources include pick and place machine centering jaws, vacuum pick up bit, board depanelization, unwarping boards after soldering, test fixtures, connector insulation, final assembly, as well as defective components. Each source has a unique signature in the type of crack that it develops so that each can be identified as the source of error.
Technical Library | 2021-11-15 07:08:00.0
The audio comprehensive tester can test consumer audio, automotive electronics and other audio products, such as mobile phones, headphones, speakers, players, power amplifiers, home cinemas, televisions, set-top boxes, automotive multimedia hosts, etc. It is suitable for rapid testing of production line and R & D testing. It can realize fast audio, simple and convenient operation, and support automatic testing. Support analog / digital input and analog output, up to 192K digital sampling rate, and multiple test functions, including audio output, signal acquisition, audio file analysis, etc.
Technical Library | 2022-03-02 21:52:34.0
In today's consumer-driven electronic marketplace many products have a limited useful life and component suppliers are moving to shorter product lifecycles. However, there are several industries that require semiconductor components to have a much longer lifecycle. In many cases application lifecycles within the Industrial, Automotive, Medical, Aerospace and Defense sectors may extend up to 30 years or more. As a result, an ongoing component supply becomes critical to sustaining these applications throughout their useful lifecycle. For this reason, it is often a requirement that semiconductor components be stored for extended periods of time after production ends.
Technical Library | 2023-11-20 17:59:32.0
Quality control at Mentzer Electronics in Burlingame, California, includes tracing electronics assembly issues using a Metris XT V real-time X-ray inspection system. This electronics X-ray inspection system allows quality engineers to intuitively navigate through the internal structure of assembled PCBs. In the rapidly evolving electronics industry, Mentzer Electronics uses the acquired insight to speed up and fi ne tune manufacturing processes. Real-time X-ray guarantees that no hidden defects remain in products when turning them out to customers nationwide.
Technical Library | 2009-06-17 18:52:27.0
The increased interest in halogen-free assemblies is a result of Non-Government Organizations (NGOs) exerting pressure on electronic equipment manufacturers to eliminate halogens. The NGOs primary focus is on resolving global environmental issues and concerns. As a result of an increase in the enormous "e-waste" dump sites that have begun showing up around the world, NGOs are pushing consumer electronic manufacturers to ban halogen-containing material in order to produce "green" products. Not only are these sites enormous, but the recycling methods are archaic and sometimes even illegal.This stockpiling and dumping has created growing political and environmental issues. In order to deal with this issue, the question of why halogens are a focal point must be addressed.
